JP5251140B2 - 蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置 - Google Patents

蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置 Download PDF

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Publication number
JP5251140B2
JP5251140B2 JP2008011463A JP2008011463A JP5251140B2 JP 5251140 B2 JP5251140 B2 JP 5251140B2 JP 2008011463 A JP2008011463 A JP 2008011463A JP 2008011463 A JP2008011463 A JP 2008011463A JP 5251140 B2 JP5251140 B2 JP 5251140B2
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Japan
Prior art keywords
phosphor
light
present
emission
usually
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Expired - Fee Related
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JP2008011463A
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English (en)
Japanese (ja)
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JP2009173706A5 (enExample
JP2009173706A (ja
Inventor
昌義 三上
恭太 上田
直人 木島
宏之 伊村
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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Publication date
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Priority to JP2008011463A priority Critical patent/JP5251140B2/ja
Publication of JP2009173706A publication Critical patent/JP2009173706A/ja
Publication of JP2009173706A5 publication Critical patent/JP2009173706A5/ja
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Devices (AREA)
  • Luminescent Compositions (AREA)
JP2008011463A 2008-01-22 2008-01-22 蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置 Expired - Fee Related JP5251140B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008011463A JP5251140B2 (ja) 2008-01-22 2008-01-22 蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008011463A JP5251140B2 (ja) 2008-01-22 2008-01-22 蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置

Publications (3)

Publication Number Publication Date
JP2009173706A JP2009173706A (ja) 2009-08-06
JP2009173706A5 JP2009173706A5 (enExample) 2011-03-10
JP5251140B2 true JP5251140B2 (ja) 2013-07-31

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Family Applications (1)

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JP2008011463A Expired - Fee Related JP5251140B2 (ja) 2008-01-22 2008-01-22 蛍光体、蛍光体含有組成物、発光装置、画像表示装置及び照明装置

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JP (1) JP5251140B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178002B2 (en) * 2009-12-21 2012-05-15 Sabic Innovative Plastics Ip B.V. Oxy-nitride pyrosilicate based persistent phosphors
WO2014091776A1 (ja) * 2012-12-14 2014-06-19 電気化学工業株式会社 蛍光体、その製造方法及び発光装置
KR20170029234A (ko) * 2015-09-07 2017-03-15 엘지전자 주식회사 발광 장치
CN107290221B (zh) * 2017-06-02 2023-08-04 中国工程物理研究院核物理与化学研究所 用于原位中子衍射的高温高压加载装置
CN113125400B (zh) * 2021-04-20 2022-10-18 中国计量大学上虞高等研究院有限公司 一种发光纳米晶材料及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1104799A1 (en) * 1999-11-30 2001-06-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Red emitting luminescent material
DE10147040A1 (de) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
EP1413619A1 (en) * 2002-09-24 2004-04-28 Osram Opto Semiconductors GmbH Luminescent material, especially for LED application
JP4975269B2 (ja) * 2005-04-28 2012-07-11 Ｄｏｗａホールディングス株式会社 蛍光体およびその製造方法、並びに当該蛍光体を用いた発光装置
JP2007048864A (ja) * 2005-08-09 2007-02-22 Nippon Electric Glass Co Ltd 蛍光体複合材料
JP4956732B2 (ja) * 2006-05-18 2012-06-20 Ｄｏｗａエレクトロニクス株式会社 電子線励起用の蛍光体およびカラー表示装置

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JP2009173706A (ja) 2009-08-06

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