JP5249757B2 - 不揮発性メモリ - Google Patents
不揮発性メモリ Download PDFInfo
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- JP5249757B2 JP5249757B2 JP2008524015A JP2008524015A JP5249757B2 JP 5249757 B2 JP5249757 B2 JP 5249757B2 JP 2008524015 A JP2008524015 A JP 2008524015A JP 2008524015 A JP2008524015 A JP 2008524015A JP 5249757 B2 JP5249757 B2 JP 5249757B2
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- memory cells
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- 238000007740 vapor deposition Methods 0.000 description 1
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- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/4234—Gate electrodes for transistors with charge trapping gate insulator
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- H01L29/42324—Gate electrodes for transistors with a floating gate
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- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
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- H01L29/66409—Unipolar field-effect transistors
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- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7926—Vertical transistors, i.e. transistors having source and drain not in the same horizontal plane
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- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0441—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
- G11C16/0458—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates comprising two or more independent floating gates which store independent data
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
- G11C16/0475—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS] comprising two or more independent storage sites which store independent data
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0491—Virtual ground arrays
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Static Random-Access Memory (AREA)
Description
図40は図41に示した実施形態に関して記載した実施形態の回路図を含む。メモリセル3611,3612,3613,3614,3621,3622,3623,3624は、図40に示すようにNVMアレイ18内に配向されている。
Claims (5)
- 電子デバイスであって、
第1の壁と、該第1の壁と対向する第2の壁とを有する、基板内のトレンチと、
第1の方向に実質的に沿って配向された第1のメモリセルのセットと、
前記第1の方向に実質的に沿って配向された第2のメモリセルのセットと、
前記第1のメモリセルのセットに電気的に接続された選択ゲート線である第1のゲート線であって、前記第1のゲート線の少なくとも一部が前記トレンチの外側に存在する、第1のゲート線と、
前記第2のメモリセルのセットに電気的に接続された制御ゲート線である第2のゲート線であって、前記第1のゲート線に比べて第2のゲート線は、前記第1の方向に沿って存在する、より多くのメモリセルのセットに電気的に接続されているとともに、前記第1及び第2のメモリセルのセットを含むメモリアレイ内で前記第1のゲート線が第2のゲート線に実質的に平行であり、前記第2のゲート線の少なくとも一部が前記トレンチ内部に存在する、第2のゲート線と、
複数の不連続記憶素子であって、前記第1のメモリセルのセット内の各メモリセルにおいて、前記複数の不連続記憶素子のうちの第1のセットが、前記トレンチ内部に存在する前記第2のゲート線の少なくとも一部と前記トレンチの前記第1の壁との間に該第1の壁に沿って存在しており、前記第2のメモリセルのセット内の各メモリセルにおいて、前記複数の不連続記憶素子のうちの第2のセットが、前記トレンチ内部に存在する前記第2のゲート線の少なくとも一部と前記トレンチの前記第2の壁との間に該第2の壁に沿って存在している、複数の不連続記憶素子と、
を備える電子デバイス。 - 前記第1および第2のメモリセルのセット内の各メモリセルは、選択ゲート電極および制御ゲート電極を含む不揮発性メモリセルからなり、
前記第1のゲート線は、前記第1のメモリセルのセットの前記選択ゲート電極に電気的に接続されており、
前記第2のゲート線は、前記第2のメモリセルのセットの前記制御ゲート電極に電気的に接続されている、請求項1に記載の電子デバイス。 - 電子デバイスであって、
第1の壁と、該第1の壁と対向する第2の壁とを有する、基板内のトレンチと、
第1の方向に実質的に沿って配向された第1のメモリセルのセットと、
前記第1の方向に実質的に沿って配向された第2のメモリセルのセットと、ここで、前記第1および第2のメモリセルのセット内の各メモリセルは、制御ゲート電極を含み、
前記第1のメモリセルのセットに電気的に接続された第1のビット線であって、他の2つのビット線の間に存在する第1のビット線と、
前記第2のメモリセルのセットに電気的に接続された第2のビット線であって、前記第1のビット線に比べて第2のビット線は、前記第1の方向に沿った、より多くのメモリセルのセットに電気的に接続されているとともに、前記第1及び第2のメモリセルのセットを含むメモリアレイ内で前記第1のビット線が第2のビット線に実質的に平行である、第2のビット線と、
複数の不連続記憶素子であって、前記第1のメモリセルのセット内の各メモリセルにおいて、前記複数の不連続記憶素子のうちの第1のセットが、前記制御ゲート電極と前記トレンチの前記第1の壁との間に該第1の壁に沿って存在しており、前記第2のメモリセルのセット内の各メモリセルにおいて、前記複数の不連続記憶素子のうちの第2のセットが、前記制御ゲート電極と前記トレンチの前記第2の壁との間に該第2の壁に沿って存在している、複数の不連続記憶素子と、
を備える電子デバイス。 - 前記第1および第2のメモリセルのセット内の各メモリセルは、選択ゲート電極および前記制御ゲート電極を含む不揮発性メモリセルからなる、請求項3に記載の電子デバイス。
- 前記第1および第2のメモリセルのセットのチャネル領域と前記制御ゲート電極との間に前記不連続記憶素子が存在し、
前記第1および第2のメモリセルのセットのチャネル領域と前記選択ゲート電極との間には前記不連続記憶素子が実質的に存在しない、請求項4に記載の電子デバイス。
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US11/188,588 US7642594B2 (en) | 2005-07-25 | 2005-07-25 | Electronic device including gate lines, bit lines, or a combination thereof |
US11/188,588 | 2005-07-25 | ||
PCT/US2006/028578 WO2007014117A2 (en) | 2005-07-25 | 2006-07-24 | Non-volatile memory |
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-
2005
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-
2006
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- 2006-07-24 JP JP2008524015A patent/JP5249757B2/ja active Active
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WO2007014117A2 (en) | 2007-02-01 |
US7642594B2 (en) | 2010-01-05 |
WO2007014117A3 (en) | 2007-08-30 |
US20070018234A1 (en) | 2007-01-25 |
TWI404172B (zh) | 2013-08-01 |
TW200711050A (en) | 2007-03-16 |
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