JP5248631B2 - プローブ基板のリペア方法及びこれを利用するプローブ基板 - Google Patents
プローブ基板のリペア方法及びこれを利用するプローブ基板 Download PDFInfo
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- JP5248631B2 JP5248631B2 JP2011001786A JP2011001786A JP5248631B2 JP 5248631 B2 JP5248631 B2 JP 5248631B2 JP 2011001786 A JP2011001786 A JP 2011001786A JP 2011001786 A JP2011001786 A JP 2011001786A JP 5248631 B2 JP5248631 B2 JP 5248631B2
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- Prior art keywords
- probe
- filling material
- substrate
- probe substrate
- repairing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000523 sample Substances 0.000 title claims description 67
- 238000000034 method Methods 0.000 title claims description 40
- 230000008439 repair process Effects 0.000 title description 13
- 239000000758 substrate Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 46
- 239000000919 ceramic Substances 0.000 claims description 28
- 238000005245 sintering Methods 0.000 claims description 14
- 238000005553 drilling Methods 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011858 nanopowder Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49718—Repairing
- Y10T29/49721—Repairing with disassembling
- Y10T29/49723—Repairing with disassembling including reconditioning of part
- Y10T29/49725—Repairing with disassembling including reconditioning of part by shaping
- Y10T29/49726—Removing material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49718—Repairing
- Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Claims (8)
- セラミック焼結体からなる基板本体に、第1の充填物質で充填された複数の第1のビア電極を形成する段階と、
前記複数の第1のビア電極のうち導通不良の第1のビア電極にビア孔を形成する段階と、
前記ビア孔に第1の充填物質より低い焼結温度を有する第2の充填物質を充填する段階と、
前記第2の充填物質を焼結して第2のビア電極を形成する段階と、
を含む、プローブ基板のリペア方法。 - 前記第1の充填物質は、銅又は銀である、請求項1に記載のプローブ基板のリペア方法。
- 前記第2の充填物質は、銀ナノ粒子である、請求項1に記載のプローブ基板のリペア方法。
- 前記第2の充填物質の焼結温度は、400℃以下である、請求項1に記載のプローブ基板のリペア方法。
- 前記導通不良の第1のビア電極に形成されたビア孔の深さは、1〜4mmである、請求項1に記載のプローブ基板のリペア方法。
- 前記導通不良の第1のビア電極に形成されたビア孔の直径は、100〜500μmである、請求項1に記載のプローブ基板のリペア方法。
- 前記ビア孔は、レーザードリリング又は機械的ドリリングによって形成される、請求項1に記載のプローブ基板のリペア方法。
- 前記第2の充填物質を構成する粒子のサイズは、50〜500nmである、請求項1に記載のプローブ基板のリペア方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0078499 | 2010-08-13 | ||
KR1020100078499A KR101141385B1 (ko) | 2010-08-13 | 2010-08-13 | 프로브 기판의 리페어 방법 및 이를 이용한 프로브 기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012042446A JP2012042446A (ja) | 2012-03-01 |
JP5248631B2 true JP5248631B2 (ja) | 2013-07-31 |
Family
ID=45563976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011001786A Active JP5248631B2 (ja) | 2010-08-13 | 2011-01-07 | プローブ基板のリペア方法及びこれを利用するプローブ基板 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8806731B2 (ja) |
JP (1) | JP5248631B2 (ja) |
KR (1) | KR101141385B1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8692136B2 (en) * | 2010-07-13 | 2014-04-08 | Samsung Electro-Mechanics Co., Ltd. | Method of repairing probe card and probe board using the same |
KR101598271B1 (ko) * | 2013-07-26 | 2016-02-26 | 삼성전기주식회사 | 커패시터 내장형 프로브 카드용 기판 그 제조방법 및 프로브 카드 |
KR101527941B1 (ko) * | 2015-03-17 | 2015-06-11 | 김창열 | 다층 구조의 반도체 디바이스 테스트 보드의 수리방법 |
KR102520449B1 (ko) * | 2021-04-29 | 2023-05-03 | (주)샘씨엔에스 | 프로브 카드용 공간 변환기의 리페어 방법 및 이를 이용한 공간 변환기 |
CN113932605B (zh) * | 2021-11-12 | 2023-11-14 | 中冶长天(长沙)智能科技有限公司 | 一种烧结机台车栏板的检测方法、装置及系统 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62277791A (ja) * | 1986-05-26 | 1987-12-02 | 三菱電機株式会社 | 信号用スルホ−ルの修復方法 |
JPH04348595A (ja) * | 1991-05-27 | 1992-12-03 | Hitachi Ltd | 多層印刷回路基板の修復方法 |
US6329829B1 (en) * | 1997-08-22 | 2001-12-11 | Micron Technology, Inc. | Interconnect and system for making temporary electrical connections to semiconductor components |
KR200188365Y1 (ko) * | 2000-02-03 | 2000-07-15 | 주식회사셀라이트 | 웨이퍼 테두리 결함 검사장치 |
JP4527267B2 (ja) * | 2000-11-13 | 2010-08-18 | 東京エレクトロン株式会社 | コンタクタの製造方法 |
JP3867523B2 (ja) * | 2000-12-26 | 2007-01-10 | 株式会社デンソー | プリント基板およびその製造方法 |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
JP2005079144A (ja) * | 2003-08-28 | 2005-03-24 | Kyocera Corp | 多層配線基板およびプローブカード |
EP1753039B1 (en) * | 2004-03-29 | 2012-10-24 | Kyocera Corporation | Multilayer piezoelectric element |
KR20070090240A (ko) * | 2004-12-10 | 2007-09-05 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 미세 입자 스케일러빌리티를 위한 디지털 비디오의 실시간트랜스코딩을 위한 시스템 및 방법 |
EP1887583A4 (en) | 2005-05-30 | 2009-06-17 | Sumitomo Electric Industries | CONDUCTIVE PASTE AND MULTILAYER PRINTED CIRCUIT BOARD USING THE SAME |
JP2008251070A (ja) * | 2007-03-29 | 2008-10-16 | Hitachi Ltd | 半導体記憶装置 |
KR100946017B1 (ko) * | 2008-02-19 | 2010-03-09 | 삼성전기주식회사 | 세라믹 기판의 제조 방법 |
KR20090117097A (ko) * | 2008-05-08 | 2009-11-12 | 삼성전자주식회사 | 재배선 탐침 구조물을 갖는 프로브 카드 및 이를 이용하는프로브 카드 모듈 |
KR100992238B1 (ko) * | 2008-07-07 | 2010-11-05 | 삼성전기주식회사 | 무수축 세라믹 기판의 제조 방법 |
JP2010135714A (ja) * | 2008-10-28 | 2010-06-17 | Kyocera Corp | 多数個取り配線基板およびその製造方法ならびに配線基板およびその製造方法 |
-
2010
- 2010-08-13 KR KR1020100078499A patent/KR101141385B1/ko active IP Right Grant
-
2011
- 2011-01-07 JP JP2011001786A patent/JP5248631B2/ja active Active
- 2011-01-10 US US12/987,697 patent/US8806731B2/en active Active
-
2014
- 2014-07-14 US US14/330,882 patent/US9095065B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012042446A (ja) | 2012-03-01 |
KR101141385B1 (ko) | 2012-05-03 |
US9095065B2 (en) | 2015-07-28 |
US8806731B2 (en) | 2014-08-19 |
KR20120015949A (ko) | 2012-02-22 |
US20120037408A1 (en) | 2012-02-16 |
US20140318838A1 (en) | 2014-10-30 |
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