JP5239178B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP5239178B2
JP5239178B2 JP2007062686A JP2007062686A JP5239178B2 JP 5239178 B2 JP5239178 B2 JP 5239178B2 JP 2007062686 A JP2007062686 A JP 2007062686A JP 2007062686 A JP2007062686 A JP 2007062686A JP 5239178 B2 JP5239178 B2 JP 5239178B2
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plasma
processing
workpiece
processed
shielding member
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Japanese (ja)
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JP2008226628A5 (enExample
JP2008226628A (ja
Inventor
慎太郎 足助
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2007062686A priority Critical patent/JP5239178B2/ja
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Publication of JP2008226628A5 publication Critical patent/JP2008226628A5/ja
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  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Drying Of Semiconductors (AREA)
JP2007062686A 2007-03-12 2007-03-12 プラズマ処理装置 Active JP5239178B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007062686A JP5239178B2 (ja) 2007-03-12 2007-03-12 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007062686A JP5239178B2 (ja) 2007-03-12 2007-03-12 プラズマ処理装置

Publications (3)

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JP2008226628A JP2008226628A (ja) 2008-09-25
JP2008226628A5 JP2008226628A5 (enExample) 2010-04-30
JP5239178B2 true JP5239178B2 (ja) 2013-07-17

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JP2007062686A Active JP5239178B2 (ja) 2007-03-12 2007-03-12 プラズマ処理装置

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2297377B1 (en) * 2008-05-30 2017-12-27 Colorado State University Research Foundation Plasma-based chemical source device and method of use thereof
JP5814074B2 (ja) * 2011-10-27 2015-11-17 富士フイルム株式会社 高分子膜の製造方法および高分子膜
JP5677328B2 (ja) * 2012-01-16 2015-02-25 三菱電機株式会社 プラズマ処理装置及びプラズマ処理方法
JP6155455B2 (ja) * 2012-06-29 2017-07-05 京セラ株式会社 大気圧プラズマ発生用電極および大気圧プラズマ発生装置、ならびにそれを用いた大気圧プラズマ加工物の製造方法
JP6683513B2 (ja) * 2016-03-22 2020-04-22 京セラ株式会社 プラズマトーチ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3184682B2 (ja) * 1993-09-30 2001-07-09 東京エレクトロン株式会社 プラズマ処理装置
JP3180092B2 (ja) * 1997-12-03 2001-06-25 松下電工株式会社 プラズマ処理システム及びプラズマ処理方法
JP3666789B2 (ja) * 1999-04-30 2005-06-29 株式会社小松製作所 プラズマ切断方法、装置及びプラズマ切断トーチへのガス供給系統
JP2002151473A (ja) * 2000-11-13 2002-05-24 Tokyo Electron Ltd プラズマ処理装置及びその組立方法
US6777638B2 (en) * 2002-11-14 2004-08-17 The Esab Group, Inc. Plasma arc torch and method of operation for reduced erosion of electrode and nozzle
JP2004253647A (ja) * 2003-02-20 2004-09-09 Tokyo Electron Ltd プラズマ処理装置
JP2005074414A (ja) * 2003-08-28 2005-03-24 Mecaworld Co Ltd 大気圧プラズマ発生装置

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JP2008226628A (ja) 2008-09-25

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