JP5237091B2 - 光学結像装置 - Google Patents

光学結像装置 Download PDF

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Publication number
JP5237091B2
JP5237091B2 JP2008514024A JP2008514024A JP5237091B2 JP 5237091 B2 JP5237091 B2 JP 5237091B2 JP 2008514024 A JP2008514024 A JP 2008514024A JP 2008514024 A JP2008514024 A JP 2008514024A JP 5237091 B2 JP5237091 B2 JP 5237091B2
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JP
Japan
Prior art keywords
component
unit
optical
imaging device
substrate
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Expired - Fee Related
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JP2008514024A
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English (en)
Japanese (ja)
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JP2008543070A (ja
JP2008543070A5 (enExample
Inventor
パトリック クワン，イム−ブン
Original Assignee
カール・ツァイス・エスエムティー・ゲーエムベーハー
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Publication of JP2008543070A publication Critical patent/JP2008543070A/ja
Publication of JP2008543070A5 publication Critical patent/JP2008543070A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)
JP2008514024A 2005-06-02 2006-06-02 光学結像装置 Expired - Fee Related JP5237091B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US68684905P 2005-06-02 2005-06-02
US60/686,849 2005-06-02
US71497505P 2005-09-08 2005-09-08
US60/714,975 2005-09-08
PCT/EP2006/005263 WO2006128713A2 (en) 2005-06-02 2006-06-02 Optical imaging arrangement

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012222394A Division JP5816152B2 (ja) 2005-06-02 2012-10-04 光学結像装置

Publications (3)

Publication Number Publication Date
JP2008543070A JP2008543070A (ja) 2008-11-27
JP2008543070A5 JP2008543070A5 (enExample) 2009-07-16
JP5237091B2 true JP5237091B2 (ja) 2013-07-17

Family

ID=36952670

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008514024A Expired - Fee Related JP5237091B2 (ja) 2005-06-02 2006-06-02 光学結像装置
JP2012222394A Expired - Fee Related JP5816152B2 (ja) 2005-06-02 2012-10-04 光学結像装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012222394A Expired - Fee Related JP5816152B2 (ja) 2005-06-02 2012-10-04 光学結像装置

Country Status (6)

Country Link
US (2) US7817248B2 (enExample)
EP (2) EP2357529A3 (enExample)
JP (2) JP5237091B2 (enExample)
KR (2) KR101346957B1 (enExample)
CN (2) CN101248392B (enExample)
WO (1) WO2006128713A2 (enExample)

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US7903866B2 (en) 2007-03-29 2011-03-08 Asml Netherlands B.V. Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object
WO2009039883A1 (en) * 2007-09-26 2009-04-02 Carl Zeiss Smt Ag Optical imaging device with thermal stabilization
US8792079B2 (en) * 2007-12-28 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method having encoders to measure displacement between optical member and measurement mount and between measurement mount and movable body
DE102008004762A1 (de) 2008-01-16 2009-07-30 Carl Zeiss Smt Ag Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung
NL1036579A1 (nl) * 2008-02-19 2009-08-20 Asml Netherlands Bv Lithographic apparatus and methods.
DE102008026077B4 (de) * 2008-05-30 2017-11-09 Integrated Dynamics Engineering Gmbh Lithographiesystem
DE102008030664A1 (de) 2008-07-01 2010-01-21 Carl Zeiss Smt Ag Optische Abbildungseinrichtung mit Bestimmung von Abbildungsfehlern
DE102009013720A1 (de) * 2009-03-20 2010-09-23 Carl Zeiss Smt Ag Verfahren zur Ausrichtung von Referenzkomponenten von Projektionsobjektiven, Projektionsobjektiv für die Halbleiterlithographie und Hilfselement
CN102648402B (zh) 2009-09-30 2015-11-25 卡尔蔡司Smt有限责任公司 光学系统、特别是微光刻投射曝光设备中的光学系统
DE102009054860A1 (de) 2009-12-17 2011-06-22 Carl Zeiss SMT GmbH, 73447 Optisches System, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage
DE102009043501A1 (de) 2009-09-30 2011-03-31 Carl Zeiss Smt Gmbh Optisches System, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage
US20120127445A1 (en) * 2010-11-18 2012-05-24 Akimitsu Ebihara Isolation system for an optical element of an exposure apparatus
CN103765315B (zh) * 2011-07-01 2016-03-30 卡尔蔡司Smt有限责任公司 具有各个主动支撑组件的光学成像布置
JP6121524B2 (ja) * 2012-05-31 2017-04-26 カール・ツァイス・エスエムティー・ゲーエムベーハー 複数の計測支持ユニットを有する光学結像装置
JP6066592B2 (ja) 2012-06-12 2017-01-25 キヤノン株式会社 露光装置及びデバイス製造方法
KR102162035B1 (ko) * 2013-09-30 2020-10-07 칼 짜이스 에스엠테 게엠베하 간단화된 제조를 갖는 광학 영상화 장치
WO2015169329A1 (de) * 2014-05-05 2015-11-12 Carl Zeiss Industrielle Messtechnik Gmbh Koordinatenmessgeraet zum bestimmen von geometrischen eigenschaften eines messobjekts
JP6754699B2 (ja) * 2014-05-14 2020-09-16 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学素子上のアクチュエータ及びセンサ点の最適配置
DE102014212104A1 (de) * 2014-06-24 2015-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur relativen positionierung einer multiaperturoptik mit mehreren optischen kanälen relativ zu einem bildsensor
DE102015211286A1 (de) 2015-06-18 2016-12-22 Carl Zeiss Smt Gmbh Abbildungssystem und verfahren
JP6830486B2 (ja) * 2015-12-03 2021-02-17 カール・ツァイス・エスエムティー・ゲーエムベーハー 能動的に調整可能なメトロロジー支持ユニットを備える光学結像装置
JP2019523437A (ja) * 2016-07-22 2019-08-22 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びリソグラフィ投影装置
IL267672B2 (en) 2016-12-30 2023-04-01 Asml Netherlands Bv An adjustable assembly and a substrate exposure system containing this adjustable assembly
US10048599B2 (en) * 2016-12-30 2018-08-14 Mapper Lithography Ip B.V. Adjustment assembly and substrate exposure system comprising such an adjustment assembly
US10348306B2 (en) * 2017-03-09 2019-07-09 University Of Utah Research Foundation Resistive random access memory based multiplexers and field programmable gate arrays
CN109945777A (zh) * 2017-12-21 2019-06-28 北京矩阵空间科技有限公司 一种三维自动成像系统
DE102020206249A1 (de) * 2020-05-18 2021-11-18 Carl Zeiss Smt Gmbh Verfahren zur Instandhaltung einer Projektionsbelichtungsanlage, Servicemodul und Anordnung für die Halbleiterlithographie

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Also Published As

Publication number Publication date
KR20130014602A (ko) 2013-02-07
KR101346957B1 (ko) 2014-01-02
EP1886191A2 (en) 2008-02-13
WO2006128713A3 (en) 2007-05-31
JP5816152B2 (ja) 2015-11-18
KR20080019047A (ko) 2008-02-29
EP2357529A2 (en) 2011-08-17
US20110001949A1 (en) 2011-01-06
US8416392B2 (en) 2013-04-09
CN102929104B (zh) 2016-08-03
US20080212083A1 (en) 2008-09-04
WO2006128713A2 (en) 2006-12-07
EP2357529A3 (en) 2015-09-02
CN101248392A (zh) 2008-08-20
JP2008543070A (ja) 2008-11-27
US7817248B2 (en) 2010-10-19
CN101248392B (zh) 2012-12-19
CN102929104A (zh) 2013-02-13
JP2013051424A (ja) 2013-03-14

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