CN102929104B - 光学成像装置 - Google Patents
光学成像装置 Download PDFInfo
- Publication number
- CN102929104B CN102929104B CN201210424595.4A CN201210424595A CN102929104B CN 102929104 B CN102929104 B CN 102929104B CN 201210424595 A CN201210424595 A CN 201210424595A CN 102929104 B CN102929104 B CN 102929104B
- Authority
- CN
- China
- Prior art keywords
- optical
- unit
- compo
- imaging device
- imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012634 optical imaging Methods 0.000 title claims abstract description 111
- 230000003287 optical effect Effects 0.000 claims abstract description 379
- 238000003384 imaging method Methods 0.000 claims abstract description 205
- 239000000758 substrate Substances 0.000 claims abstract description 168
- 238000005259 measurement Methods 0.000 claims abstract description 159
- 238000000034 method Methods 0.000 claims description 87
- 238000002955 isolation Methods 0.000 claims description 77
- 238000010276 construction Methods 0.000 claims description 18
- 238000012546 transfer Methods 0.000 claims description 18
- 238000009790 rate-determining step (RDS) Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 19
- 238000010586 diagram Methods 0.000 description 18
- 230000008901 benefit Effects 0.000 description 17
- 230000033001 locomotion Effects 0.000 description 10
- 239000007767 bonding agent Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005305 interferometry Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000013519 translation Methods 0.000 description 5
- 239000006094 Zerodur Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 108010014173 Factor X Proteins 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Microscoopes, Condenser (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68684905P | 2005-06-02 | 2005-06-02 | |
| US60/686,849 | 2005-06-02 | ||
| US71497505P | 2005-09-08 | 2005-09-08 | |
| US60/714,975 | 2005-09-08 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800265792A Division CN101248392B (zh) | 2005-06-02 | 2006-06-02 | 光学成像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102929104A CN102929104A (zh) | 2013-02-13 |
| CN102929104B true CN102929104B (zh) | 2016-08-03 |
Family
ID=36952670
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210424595.4A Active CN102929104B (zh) | 2005-06-02 | 2006-06-02 | 光学成像装置 |
| CN2006800265792A Active CN101248392B (zh) | 2005-06-02 | 2006-06-02 | 光学成像装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800265792A Active CN101248392B (zh) | 2005-06-02 | 2006-06-02 | 光学成像装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7817248B2 (enExample) |
| EP (2) | EP2357529A3 (enExample) |
| JP (2) | JP5237091B2 (enExample) |
| KR (2) | KR20130014602A (enExample) |
| CN (2) | CN102929104B (enExample) |
| WO (1) | WO2006128713A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008110212A1 (en) * | 2007-03-15 | 2008-09-18 | Carl Zeiss Smt Ag | Optical imaging arrangement |
| US7903866B2 (en) | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
| WO2009039883A1 (en) * | 2007-09-26 | 2009-04-02 | Carl Zeiss Smt Ag | Optical imaging device with thermal stabilization |
| US8792079B2 (en) * | 2007-12-28 | 2014-07-29 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method having encoders to measure displacement between optical member and measurement mount and between measurement mount and movable body |
| DE102008004762A1 (de) | 2008-01-16 | 2009-07-30 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung |
| NL1036579A1 (nl) * | 2008-02-19 | 2009-08-20 | Asml Netherlands Bv | Lithographic apparatus and methods. |
| DE102008026077B4 (de) * | 2008-05-30 | 2017-11-09 | Integrated Dynamics Engineering Gmbh | Lithographiesystem |
| DE102008030664A1 (de) * | 2008-07-01 | 2010-01-21 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit Bestimmung von Abbildungsfehlern |
| DE102009013720A1 (de) * | 2009-03-20 | 2010-09-23 | Carl Zeiss Smt Ag | Verfahren zur Ausrichtung von Referenzkomponenten von Projektionsobjektiven, Projektionsobjektiv für die Halbleiterlithographie und Hilfselement |
| DE102009043501A1 (de) | 2009-09-30 | 2011-03-31 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| DE102009054860A1 (de) | 2009-12-17 | 2011-06-22 | Carl Zeiss SMT GmbH, 73447 | Optisches System, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| JP5432382B2 (ja) | 2009-09-30 | 2014-03-05 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 特にマイクロリソグラフィ投影露光装置の光学システム |
| US20120127445A1 (en) * | 2010-11-18 | 2012-05-24 | Akimitsu Ebihara | Isolation system for an optical element of an exposure apparatus |
| EP2726939B1 (en) | 2011-07-01 | 2020-09-16 | Carl Zeiss SMT GmbH | Optical imaging arrangement with individually actively supported components |
| JP6121524B2 (ja) * | 2012-05-31 | 2017-04-26 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 複数の計測支持ユニットを有する光学結像装置 |
| JP6066592B2 (ja) | 2012-06-12 | 2017-01-25 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| CN105593761B (zh) * | 2013-09-30 | 2018-03-20 | 卡尔蔡司Smt有限责任公司 | 具有简化制造的光学成像布置 |
| WO2015169329A1 (de) * | 2014-05-05 | 2015-11-12 | Carl Zeiss Industrielle Messtechnik Gmbh | Koordinatenmessgeraet zum bestimmen von geometrischen eigenschaften eines messobjekts |
| WO2015173362A1 (de) * | 2014-05-14 | 2015-11-19 | Carl Zeiss Smt Gmbh | Optimale anordnung von aktuier- und sensorpunkten auf einem optischen element |
| DE102014212104A1 (de) * | 2014-06-24 | 2015-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und verfahren zur relativen positionierung einer multiaperturoptik mit mehreren optischen kanälen relativ zu einem bildsensor |
| DE102015211286A1 (de) | 2015-06-18 | 2016-12-22 | Carl Zeiss Smt Gmbh | Abbildungssystem und verfahren |
| JP6830486B2 (ja) * | 2015-12-03 | 2021-02-17 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 能動的に調整可能なメトロロジー支持ユニットを備える光学結像装置 |
| JP2019523437A (ja) * | 2016-07-22 | 2019-08-22 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びリソグラフィ投影装置 |
| EP3563197B1 (en) * | 2016-12-30 | 2024-01-31 | ASML Netherlands B.V. | Substrate exposure system |
| US10048599B2 (en) * | 2016-12-30 | 2018-08-14 | Mapper Lithography Ip B.V. | Adjustment assembly and substrate exposure system comprising such an adjustment assembly |
| US10348306B2 (en) * | 2017-03-09 | 2019-07-09 | University Of Utah Research Foundation | Resistive random access memory based multiplexers and field programmable gate arrays |
| CN109945777A (zh) * | 2017-12-21 | 2019-06-28 | 北京矩阵空间科技有限公司 | 一种三维自动成像系统 |
| DE102020206249A1 (de) * | 2020-05-18 | 2021-11-18 | Carl Zeiss Smt Gmbh | Verfahren zur Instandhaltung einer Projektionsbelichtungsanlage, Servicemodul und Anordnung für die Halbleiterlithographie |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4758091A (en) * | 1986-11-20 | 1988-07-19 | Ateo Corporation | Pattern generator part holder |
| US4790642A (en) * | 1986-12-01 | 1988-12-13 | Gca Corporation/Tropel Division | Integrated metrology for microlithographic objective reducing lens |
| EP0502583A1 (en) * | 1991-03-07 | 1992-09-09 | Koninklijke Philips Electronics N.V. | Imaging apparatus comprising a focus-error and/or tilt detection device |
| US6741358B1 (en) * | 1999-09-20 | 2004-05-25 | Nikon Corporation | Exposure apparatus and device production method in which position of reference plate provided on substrate stage is measured |
| EP1503246A2 (en) * | 2003-07-31 | 2005-02-02 | Canon Kabushiki Kaisha | Positioning mechanism, exposure apparatus, and device manufacturing method |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01122119A (ja) * | 1987-11-05 | 1989-05-15 | Canon Inc | 露光装置 |
| NL9100407A (nl) * | 1991-03-07 | 1992-10-01 | Philips Nv | Optisch lithografische inrichting met een krachtgecompenseerd machinegestel. |
| JP3226704B2 (ja) * | 1994-03-15 | 2001-11-05 | キヤノン株式会社 | 露光装置 |
| US6031598A (en) * | 1998-09-25 | 2000-02-29 | Euv Llc | Extreme ultraviolet lithography machine |
| JP2000286189A (ja) | 1999-03-31 | 2000-10-13 | Nikon Corp | 露光装置および露光方法ならびにデバイス製造方法 |
| US6344083B1 (en) * | 2000-02-14 | 2002-02-05 | Memc Electronic Materials, Inc. | Process for producing a silicon melt |
| US7289212B2 (en) * | 2000-08-24 | 2007-10-30 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufacturing thereby |
| EP1182509B1 (en) | 2000-08-24 | 2009-04-08 | ASML Netherlands B.V. | Lithographic apparatus, calibration method thereof and device manufacturing method |
| US20020080339A1 (en) * | 2000-12-25 | 2002-06-27 | Nikon Corporation | Stage apparatus, vibration control method and exposure apparatus |
| US6881963B2 (en) * | 2002-11-08 | 2005-04-19 | Canon Kabushiki Kaisha | Vibration control of an object |
| JP4298305B2 (ja) * | 2003-01-20 | 2009-07-15 | キヤノン株式会社 | 露光装置及び半導体デバイスの製造方法 |
| JP2004246060A (ja) * | 2003-02-13 | 2004-09-02 | Canon Inc | 反射型投影光学系の調整方法 |
| JP2004281654A (ja) * | 2003-03-14 | 2004-10-07 | Canon Inc | 駆動機構及びそれを用いた露光装置、デバイスの製造方法 |
| JP4307140B2 (ja) * | 2003-04-25 | 2009-08-05 | キヤノン株式会社 | 光学素子位置決め装置、それを用いた露光装置、デバイスの製造方法 |
| EP1469348B1 (en) * | 2003-04-14 | 2012-01-18 | ASML Netherlands B.V. | Projection system and method of use thereof |
| KR101209540B1 (ko) | 2003-07-09 | 2012-12-07 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| EP1643543B1 (en) | 2003-07-09 | 2010-11-24 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
| JP4366152B2 (ja) * | 2003-09-09 | 2009-11-18 | キヤノン株式会社 | 露光装置 |
| JP4534986B2 (ja) | 2003-09-17 | 2010-09-01 | 不二製油株式会社 | 油脂の乾式分別方法 |
| US7589911B2 (en) * | 2003-09-18 | 2009-09-15 | Canon Kabushiki Kaisha | Technique for positioning optical system element |
| JP2005236258A (ja) * | 2003-09-18 | 2005-09-02 | Canon Inc | 光学装置およびデバイス製造方法 |
-
2006
- 2006-06-02 WO PCT/EP2006/005263 patent/WO2006128713A2/en not_active Ceased
- 2006-06-02 CN CN201210424595.4A patent/CN102929104B/zh active Active
- 2006-06-02 KR KR1020127032926A patent/KR20130014602A/ko not_active Ceased
- 2006-06-02 EP EP11163699.9A patent/EP2357529A3/en not_active Withdrawn
- 2006-06-02 CN CN2006800265792A patent/CN101248392B/zh active Active
- 2006-06-02 KR KR1020087000102A patent/KR101346957B1/ko not_active Expired - Fee Related
- 2006-06-02 EP EP06761961A patent/EP1886191A2/en not_active Withdrawn
- 2006-06-02 JP JP2008514024A patent/JP5237091B2/ja active Active
-
2007
- 2007-11-30 US US11/947,900 patent/US7817248B2/en not_active Expired - Fee Related
-
2010
- 2010-09-16 US US12/883,639 patent/US8416392B2/en not_active Expired - Fee Related
-
2012
- 2012-10-04 JP JP2012222394A patent/JP5816152B2/ja not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4758091A (en) * | 1986-11-20 | 1988-07-19 | Ateo Corporation | Pattern generator part holder |
| US4790642A (en) * | 1986-12-01 | 1988-12-13 | Gca Corporation/Tropel Division | Integrated metrology for microlithographic objective reducing lens |
| EP0502583A1 (en) * | 1991-03-07 | 1992-09-09 | Koninklijke Philips Electronics N.V. | Imaging apparatus comprising a focus-error and/or tilt detection device |
| US6741358B1 (en) * | 1999-09-20 | 2004-05-25 | Nikon Corporation | Exposure apparatus and device production method in which position of reference plate provided on substrate stage is measured |
| EP1503246A2 (en) * | 2003-07-31 | 2005-02-02 | Canon Kabushiki Kaisha | Positioning mechanism, exposure apparatus, and device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006128713A2 (en) | 2006-12-07 |
| CN101248392B (zh) | 2012-12-19 |
| US7817248B2 (en) | 2010-10-19 |
| KR101346957B1 (ko) | 2014-01-02 |
| JP5816152B2 (ja) | 2015-11-18 |
| EP2357529A2 (en) | 2011-08-17 |
| KR20130014602A (ko) | 2013-02-07 |
| CN101248392A (zh) | 2008-08-20 |
| KR20080019047A (ko) | 2008-02-29 |
| US20080212083A1 (en) | 2008-09-04 |
| JP2008543070A (ja) | 2008-11-27 |
| JP2013051424A (ja) | 2013-03-14 |
| EP2357529A3 (en) | 2015-09-02 |
| CN102929104A (zh) | 2013-02-13 |
| WO2006128713A3 (en) | 2007-05-31 |
| EP1886191A2 (en) | 2008-02-13 |
| US8416392B2 (en) | 2013-04-09 |
| JP5237091B2 (ja) | 2013-07-17 |
| US20110001949A1 (en) | 2011-01-06 |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |