JP5233888B2 - 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法 - Google Patents

両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法 Download PDF

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Publication number
JP5233888B2
JP5233888B2 JP2009170138A JP2009170138A JP5233888B2 JP 5233888 B2 JP5233888 B2 JP 5233888B2 JP 2009170138 A JP2009170138 A JP 2009170138A JP 2009170138 A JP2009170138 A JP 2009170138A JP 5233888 B2 JP5233888 B2 JP 5233888B2
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Japan
Prior art keywords
wafer
carrier
double
resin insert
side polishing
Prior art date
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JP2009170138A
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English (en)
Japanese (ja)
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JP2011025322A5 (enExample
JP2011025322A (ja
Inventor
太一 安田
辰男 榎本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP2009170138A priority Critical patent/JP5233888B2/ja
Priority to PCT/JP2010/004077 priority patent/WO2011010423A1/ja
Priority to US13/379,482 priority patent/US9050698B2/en
Priority to TW099120481A priority patent/TWI461256B/zh
Publication of JP2011025322A publication Critical patent/JP2011025322A/ja
Publication of JP2011025322A5 publication Critical patent/JP2011025322A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009170138A 2009-07-21 2009-07-21 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法 Active JP5233888B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009170138A JP5233888B2 (ja) 2009-07-21 2009-07-21 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法
PCT/JP2010/004077 WO2011010423A1 (ja) 2009-07-21 2010-06-18 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法
US13/379,482 US9050698B2 (en) 2009-07-21 2010-06-18 Manufacturing method of carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method of wafer
TW099120481A TWI461256B (zh) 2009-07-21 2010-06-23 A method for manufacturing a carrier for a double-sided polishing apparatus, a double-sided polishing method for a double-sided polishing apparatus, and a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009170138A JP5233888B2 (ja) 2009-07-21 2009-07-21 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法

Publications (3)

Publication Number Publication Date
JP2011025322A JP2011025322A (ja) 2011-02-10
JP2011025322A5 JP2011025322A5 (enExample) 2012-02-02
JP5233888B2 true JP5233888B2 (ja) 2013-07-10

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JP2009170138A Active JP5233888B2 (ja) 2009-07-21 2009-07-21 両面研磨装置用キャリアの製造方法、両面研磨装置用キャリア及びウェーハの両面研磨方法

Country Status (4)

Country Link
US (1) US9050698B2 (enExample)
JP (1) JP5233888B2 (enExample)
TW (1) TWI461256B (enExample)
WO (1) WO2011010423A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10145013B2 (en) 2014-01-27 2018-12-04 Veeco Instruments Inc. Wafer carrier having retention pockets with compound radii for chemical vapor desposition systems

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5605260B2 (ja) * 2011-02-18 2014-10-15 信越半導体株式会社 インサート材及び両面研磨装置
JP5648623B2 (ja) * 2011-12-01 2015-01-07 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
JP5741497B2 (ja) * 2012-02-15 2015-07-01 信越半導体株式会社 ウェーハの両面研磨方法
JP5748717B2 (ja) 2012-09-06 2015-07-15 信越半導体株式会社 両面研磨方法
DE102013200072A1 (de) * 2013-01-04 2014-07-10 Siltronic Ag Läuferscheibe und Verfahren zur gleichzeitig beidseitigen Politur von Halbleiterscheiben
JP5807648B2 (ja) * 2013-01-29 2015-11-10 信越半導体株式会社 両面研磨装置用キャリア及びウェーハの両面研磨方法
JP5847789B2 (ja) * 2013-02-13 2016-01-27 信越半導体株式会社 両面研磨装置用キャリアの製造方法およびウエーハの両面研磨方法
JP6280355B2 (ja) * 2013-11-29 2018-02-14 Hoya株式会社 磁気ディスク用基板の製造方法及び研磨処理用キャリア
JP6056793B2 (ja) * 2014-03-14 2017-01-11 信越半導体株式会社 両面研磨装置用キャリアの製造方法及び両面研磨方法
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
JP6673772B2 (ja) * 2016-07-27 2020-03-25 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
JP6743785B2 (ja) * 2017-08-30 2020-08-19 株式会社Sumco キャリアの製造方法およびウェーハの研磨方法
JP6870623B2 (ja) * 2018-01-18 2021-05-12 信越半導体株式会社 キャリアの製造方法及びウェーハの両面研磨方法
JP7070010B2 (ja) * 2018-04-16 2022-05-18 株式会社Sumco キャリアの製造方法および半導体ウェーハの研磨方法
JP7276246B2 (ja) * 2020-05-19 2023-05-18 信越半導体株式会社 両面研磨装置用キャリアの製造方法及びウェーハの両面研磨方法
CN115847281A (zh) * 2022-12-07 2023-03-28 西安奕斯伟材料科技有限公司 一种硅片的双面抛光用的载具以及装置
CN116475934B (zh) * 2023-03-31 2025-03-28 西安奕斯伟材料科技股份有限公司 静压垫、研磨设备及硅片

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US5244555A (en) * 1991-11-27 1993-09-14 Komag, Inc. Floating pocket memory disk carrier, memory disk and method
US6439984B1 (en) * 1998-09-16 2002-08-27 Entegris, Inc. Molded non-abrasive substrate carrier for use in polishing operations
JP2000210863A (ja) * 1999-01-22 2000-08-02 Toshiba Ceramics Co Ltd キャリア
JP2001198804A (ja) * 2000-01-18 2001-07-24 Hitachi Cable Ltd 両面一次ポリッシュ用ウェハキャリア
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
JP2003305637A (ja) * 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
JP2003340711A (ja) * 2002-05-22 2003-12-02 Sagami Pci Kk 研磨機用キャリア
WO2006001340A1 (ja) 2004-06-23 2006-01-05 Komatsu Denshi Kinzoku Kabushiki Kaisha 両面研磨用キャリアおよびその製造方法
DE102005034119B3 (de) * 2005-07-21 2006-12-07 Siltronic Ag Verfahren zum Bearbeiten einer Halbleiterscheibe, die in einer Aussparung einer Läuferscheibe geführt wird
JP5114113B2 (ja) * 2007-07-02 2013-01-09 スピードファム株式会社 ワークキャリア
JP4605233B2 (ja) * 2008-02-27 2011-01-05 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10145013B2 (en) 2014-01-27 2018-12-04 Veeco Instruments Inc. Wafer carrier having retention pockets with compound radii for chemical vapor desposition systems
US11248295B2 (en) 2014-01-27 2022-02-15 Veeco Instruments Inc. Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems

Also Published As

Publication number Publication date
WO2011010423A1 (ja) 2011-01-27
US9050698B2 (en) 2015-06-09
TW201114546A (en) 2011-05-01
JP2011025322A (ja) 2011-02-10
TWI461256B (zh) 2014-11-21
US20120100788A1 (en) 2012-04-26

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