JP5233535B2 - 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置 - Google Patents

撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置 Download PDF

Info

Publication number
JP5233535B2
JP5233535B2 JP2008233948A JP2008233948A JP5233535B2 JP 5233535 B2 JP5233535 B2 JP 5233535B2 JP 2008233948 A JP2008233948 A JP 2008233948A JP 2008233948 A JP2008233948 A JP 2008233948A JP 5233535 B2 JP5233535 B2 JP 5233535B2
Authority
JP
Japan
Prior art keywords
light
layer
light receiving
imaging
concentration distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008233948A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010067861A (ja
JP2010067861A5 (https=
Inventor
陽一 永井
康博 猪口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2008233948A priority Critical patent/JP5233535B2/ja
Priority to PCT/JP2009/063246 priority patent/WO2010029813A1/ja
Priority to US13/063,444 priority patent/US8243139B2/en
Priority to EP09812961.2A priority patent/EP2328187B1/en
Publication of JP2010067861A publication Critical patent/JP2010067861A/ja
Publication of JP2010067861A5 publication Critical patent/JP2010067861A5/ja
Priority to US13/548,668 priority patent/US8564666B2/en
Application granted granted Critical
Publication of JP5233535B2 publication Critical patent/JP5233535B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/021Manufacture or treatment of image sensors covered by group H10F39/12 of image sensors having active layers comprising only Group III-V materials, e.g. GaAs, AlGaAs or InP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/14Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/146Superlattices; Multiple quantum well structures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Light Receiving Elements (AREA)
  • Traffic Control Systems (AREA)
  • Alarm Systems (AREA)
JP2008233948A 2008-09-11 2008-09-11 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置 Expired - Fee Related JP5233535B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008233948A JP5233535B2 (ja) 2008-09-11 2008-09-11 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置
PCT/JP2009/063246 WO2010029813A1 (ja) 2008-09-11 2009-07-24 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置
US13/063,444 US8243139B2 (en) 2008-09-11 2009-07-24 Image pickup device, visibility support apparatus, night vision device, navigation support apparatus, and monitoring device
EP09812961.2A EP2328187B1 (en) 2008-09-11 2009-07-24 Image pickup device, visibility support apparatus, night vision device, navigation support apparatus, and monitoring device
US13/548,668 US8564666B2 (en) 2008-09-11 2012-07-13 Image pickup device, visibility support apparatus, night vision device, navigation support apparatus, and monitoring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008233948A JP5233535B2 (ja) 2008-09-11 2008-09-11 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011011131A Division JP4706805B2 (ja) 2011-01-21 2011-01-21 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置

Publications (3)

Publication Number Publication Date
JP2010067861A JP2010067861A (ja) 2010-03-25
JP2010067861A5 JP2010067861A5 (https=) 2011-10-20
JP5233535B2 true JP5233535B2 (ja) 2013-07-10

Family

ID=42005074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008233948A Expired - Fee Related JP5233535B2 (ja) 2008-09-11 2008-09-11 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置

Country Status (4)

Country Link
US (2) US8243139B2 (https=)
EP (1) EP2328187B1 (https=)
JP (1) JP5233535B2 (https=)
WO (1) WO2010029813A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662188B2 (ja) 2008-02-01 2011-03-30 住友電気工業株式会社 受光素子、受光素子アレイおよびそれらの製造方法
JP5498662B2 (ja) * 2008-03-26 2014-05-21 国立大学法人 東京大学 半導体装置および半導体装置の製造方法
JP4743453B2 (ja) * 2008-12-25 2011-08-10 住友電気工業株式会社 気体モニタリング装置、燃焼状態モニタリング装置、経年変化モニタリング装置、および不純物濃度モニタリング装置
WO2010146903A1 (ja) * 2009-06-15 2010-12-23 シャープ株式会社 発光モジュール、照明装置、表示装置、およびテレビ受像装置
JP5218476B2 (ja) * 2010-06-03 2013-06-26 住友電気工業株式会社 半導体素子、光学センサ装置および半導体素子の製造方法
JP2012015170A (ja) * 2010-06-29 2012-01-19 Sumitomo Electric Ind Ltd 受光素子およびその製造方法
JP5748176B2 (ja) * 2011-11-01 2015-07-15 住友電気工業株式会社 受光素子、エピタキシャルウエハおよびその製造方法
EP2713409B1 (en) * 2012-09-27 2020-08-26 ams AG Photodiode with a field electrode for reducing the space charge region
US20140217540A1 (en) * 2013-02-04 2014-08-07 Teledyne Scientific & Imaging, Llc Fully depleted diode passivation active passivation architecture
JP6454981B2 (ja) * 2014-04-24 2019-01-23 住友電気工業株式会社 半導体積層体および受光素子
JP6877815B2 (ja) * 2014-10-17 2021-05-26 日本無線株式会社 画像生成装置
US10126582B2 (en) * 2015-07-07 2018-11-13 B. G. Negev Technologies and Applications, Ltd., at Ben-Gurion University SWIR to visible up-conversion optical system
JP2018190798A (ja) * 2017-04-28 2018-11-29 住友電気工業株式会社 赤外線検知半導体デバイス
US10461118B2 (en) 2017-12-15 2019-10-29 Atomera Incorporated Method for making CMOS image sensor including photodiodes with overlying superlattices to reduce crosstalk
US10276625B1 (en) * 2017-12-15 2019-04-30 Atomera Incorporated CMOS image sensor including superlattice to enhance infrared light absorption
US10396223B2 (en) 2017-12-15 2019-08-27 Atomera Incorporated Method for making CMOS image sensor with buried superlattice layer to reduce crosstalk
US10304881B1 (en) 2017-12-15 2019-05-28 Atomera Incorporated CMOS image sensor with buried superlattice layer to reduce crosstalk
US10361243B2 (en) 2017-12-15 2019-07-23 Atomera Incorporated Method for making CMOS image sensor including superlattice to enhance infrared light absorption
US10355151B2 (en) 2017-12-15 2019-07-16 Atomera Incorporated CMOS image sensor including photodiodes with overlying superlattices to reduce crosstalk
US11101119B2 (en) * 2018-12-20 2021-08-24 Elbit Systems Of America, Llc Usage and temperature compensation of performance parameters for night vision device
US11641003B2 (en) * 2019-12-03 2023-05-02 Northwestern University Methods of fabricating planar infrared photodetectors
TWI832715B (zh) * 2023-03-02 2024-02-11 聯亞光電工業股份有限公司 半導體元件
US12334321B1 (en) * 2024-08-07 2025-06-17 L3Harris Technologies, Inc. And manufacturing methods of SWIR I2TUBE via heterogeneous wafer integration

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708409B2 (ja) * 1986-06-20 1998-02-04 株式会社日立製作所 半導体受光素子およびその製造方法
JPH0338887A (ja) * 1989-07-06 1991-02-19 Fujitsu Ltd 半導体受光素子
JPH05160426A (ja) * 1991-12-06 1993-06-25 Nec Corp 半導体受光素子
JPH05160429A (ja) * 1991-12-09 1993-06-25 Nec Corp 赤外線検知器
JPH07302928A (ja) 1994-05-09 1995-11-14 Mitsubishi Electric Corp 半導体受光素子ならびに半導体受光素子アレイおよび画像処理装置ならびに画像処理方法
JP4019182B2 (ja) 1995-07-19 2007-12-12 本田技研工業株式会社 視覚装置
JPH09219563A (ja) 1996-02-09 1997-08-19 Hitachi Ltd 半導体光素子とそれを用いた応用システム
JP2001144278A (ja) 1999-11-12 2001-05-25 Nippon Sheet Glass Co Ltd 受光素子アレイ
JP4688196B2 (ja) 2001-03-23 2011-05-25 スタンレー電気株式会社 自動車用暗視システム
JP2004350228A (ja) 2003-05-26 2004-12-09 Denso Corp 車両用夜間後方視界支援システム
JP5008874B2 (ja) * 2005-02-23 2012-08-22 住友電気工業株式会社 受光素子と受光素子を用いた光通信用受信モジュールおよび受光素子を用いた計測器
JP4956944B2 (ja) * 2005-09-12 2012-06-20 三菱電機株式会社 アバランシェフォトダイオード
JP2007201432A (ja) * 2005-12-28 2007-08-09 Sumitomo Electric Ind Ltd 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置
US7679059B2 (en) 2006-04-19 2010-03-16 Spectrasensors, Inc. Measuring water vapor in hydrocarbons
JP2007324572A (ja) 2006-05-02 2007-12-13 Sumitomo Electric Ind Ltd 受光素子アレイ、その製造方法、および光計測システム
US7608825B2 (en) * 2006-12-14 2009-10-27 Sumitomo Electric Industries, Ltd. Image pickup device, vision enhancement apparatus, night-vision apparatus, navigation support apparatus, and monitoring apparatus
JP2008153311A (ja) * 2006-12-14 2008-07-03 Sumitomo Electric Ind Ltd 半導体受光素子、視界支援装置および生体医療装置
JP2008171885A (ja) * 2007-01-09 2008-07-24 Sumitomo Electric Ind Ltd 半導体受光素子およびその製造方法
JP2008205001A (ja) * 2007-02-16 2008-09-04 Sumitomo Electric Ind Ltd 受光素子、センサおよび撮像装置
JP5515162B2 (ja) * 2007-03-23 2014-06-11 住友電気工業株式会社 半導体ウエハの製造方法
JP2008288293A (ja) 2007-05-16 2008-11-27 Nippon Telegr & Teleph Corp <Ntt> 半導体受光素子
JP5195172B2 (ja) * 2008-08-29 2013-05-08 住友電気工業株式会社 水分検出装置、生体中水分検出装置、自然産物中水分検出装置、および製品・材料中水分検出装置
JP5233549B2 (ja) * 2008-09-22 2013-07-10 住友電気工業株式会社 食品品質検査装置、食品成分検査装置、異物成分検査装置、食味検査装置および変移状態検査装置

Also Published As

Publication number Publication date
US20110164136A1 (en) 2011-07-07
WO2010029813A1 (ja) 2010-03-18
EP2328187A1 (en) 2011-06-01
EP2328187B1 (en) 2016-11-16
US8564666B2 (en) 2013-10-22
JP2010067861A (ja) 2010-03-25
US20120274771A1 (en) 2012-11-01
US8243139B2 (en) 2012-08-14
EP2328187A4 (en) 2014-08-06

Similar Documents

Publication Publication Date Title
JP5233535B2 (ja) 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置
JP2010067861A5 (https=)
US7608825B2 (en) Image pickup device, vision enhancement apparatus, night-vision apparatus, navigation support apparatus, and monitoring apparatus
JP2007201432A (ja) 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置
US11646341B2 (en) Light-receiving device, method of manufacturing light-receiving device, and electronic apparatus
US10818718B2 (en) Light receiving element, method of manufacturing light receiving element, imaging device, and electronic apparatus
US8642943B2 (en) Semiconductor wafer, light-receiving element, light-receiving element array, hybrid-type detection device, optical sensor device, and process for production of semiconductor wafer
KR102660131B1 (ko) 고체 촬상 장치 및 전자 기기
JP2008153311A (ja) 半導体受光素子、視界支援装置および生体医療装置
US12352896B2 (en) Light detection apparatus and control method of light detection apparatus, and ranging apparatus
US10115764B2 (en) Multi-band position sensitive imaging arrays
US20220026541A1 (en) Photodetection device and distance measurement device
JP5560818B2 (ja) 受光素子、受光素子アレイ、ハイブリッド型検出装置、光学センサ装置
KR20220156541A (ko) 수광 장치 및 측거 장치
US12418733B2 (en) Imaging apparatus and electronic device
JP4706805B2 (ja) 撮像装置、視界支援装置、暗視装置、航海支援装置および監視装置
US20130009045A1 (en) Self-Aligned Contacts for Photosensitive Detection Devices
US20240055448A1 (en) Photoelectric conversion element and imaging device
Rutz et al. Low-light-level SWIR photodetectors based on the InGaAs material system
US20240395833A1 (en) Photoelectric conversion element and imaging device
JP2011258817A (ja) 受光素子、受光素子アレイ、ハイブリッド型検出装置、光学センサ装置、および受光素子アレイの製造方法
JP2008124182A (ja) 光検出装置および視界支援装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110906

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110906

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130311

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5233535

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160405

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees