JP5233041B2 - 半導体集積回路 - Google Patents
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0711—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with bipolar transistors and diodes, or capacitors, or resistors
- H01L27/0722—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with bipolar transistors and diodes, or capacitors, or resistors in combination with lateral bipolar transistors and diodes, or capacitors, or resistors
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- H01L21/76—Making of isolation regions between components
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- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823878—Complementary field-effect transistors, e.g. CMOS isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823892—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- H01L21/8248—Combination of bipolar and field-effect technology
- H01L21/8249—Bipolar and MOS technology
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Description
図1は、本発明の実施形態に係る半導体集積回路の断面図である。
101 素子分離構造
102 素子分離構造
103 素子分離構造
104A 深いウェル
104B コレクタ
104C コレクタ
105A ウェル
105B ベース
106 ゲート絶縁膜
107 ゲート導電膜
108 ゲート電極
109 スペーサ
110A ソース及びドレイン領域
110B エミッタ
110C ピックアップ領域
111 ベース
112 エミッタ
Claims (29)
- デジタル回路及びアナログ回路が単一の基板上に集積された半導体集積回路において、
前記デジタル回路の形成される領域及び前記アナログ回路の形成される領域を含む基板と、
前記アナログ回路素子と前記デジタル回路素子との間のクロストークを防止するため、前記デジタル回路素子の形成される領域又は前記アナログ回路素子の形成される領域を取り囲むように、前記基板内に一定の深さに形成された深いウェルと
を備える半導体集積回路であって、
前記基板上に形成されたRF(Radio Frequency)回路素子をさらに備え、前記RF回路素子が、前記深いウェルに取り囲まれるように形成され、
前記デジタル回路素子と、前記アナログ回路素子および前記RF回路素子をそれぞれ分離するように形成され、前記各素子の動作範囲に応じて前記基板の上側表面から異なる深さを有する複数の素子分離構造(Device Isolation Structures)を更に含み、
前記深いウェルは埋込層であることを特徴とする半導体集積回路。 - 前記深いウェルが、N型ウェル又はP型ウェルであることを特徴とする請求項1に記載の半導体集積回路。
- 前記アナログ回路素子が、互いに異なる動作範囲を有する複数の素子を備えることを特徴とする請求項1に記載の半導体集積回路。
- 前記デジタル回路素子が、互いに異なる動作範囲を有する複数の素子を備えることを特徴とする請求項1に記載の半導体集積回路。
- 前記互いに異なる動作範囲を有する複数の素子をそれぞれ分離及び隔離させるため、前記基板の上面から互いに異なる深さを有するように形成された複数の素子分離構造をさらに備えることを特徴とする請求項3又は4に記載の半導体集積回路。
- 前記互いに異なる動作範囲を有する素子が、
第1の動作範囲を有する第1の素子と、
前記第1の動作範囲よりも高い第2の動作範囲を有する第2の素子と、
前記第2の動作範囲よりも高い第3の動作範囲を有する第3の素子と
を備えることを特徴とする請求項5に記載の半導体集積回路。 - 前記第1の動作範囲が、1V〜10Vの範囲であることを特徴とする請求項6に記載の半導体集積回路。
- 前記第2の動作範囲が、10V〜30Vの範囲であることを特徴とする請求項6に記載の半導体集積回路。
- 前記第3の動作範囲が、30V〜50Vの範囲であることを特徴とする請求項6に記載の半導体集積回路。
- 前記互いに異なる動作範囲を有する素子が、前記第3の動作範囲よりも高い第4の動作範囲を有する第4の素子をさらに備えることを特徴とする請求項6に記載の半導体集積回路。
- 前記第4の動作範囲が、50V〜900Vの範囲であることを特徴とする請求項10に記載の半導体集積回路。
- 前記複数の素子分離構造のうち、前記第1の素子を分離及び隔離させる素子分離構造が、前記基板の上面から0.1μm〜1μmの範囲の深さに形成されることを特徴とする請求項6に記載の半導体集積回路。
- 前記複数の素子分離構造のうち、前記第2の素子を分離及び隔離させる素子分離構造が、前記基板の上面から1μm〜3μmの範囲の深さに形成されることを特徴とする請求項6に記載の半導体集積回路。
- 前記複数の素子分離構造のうち、前記第3の素子を分離及び隔離させる素子分離構造が、前記基板の上面から3μm〜50μmの範囲の深さに形成されることを特徴とする請求項6に記載の半導体集積回路。
- 前記複数の素子分離構造が、前記基板内にトレンチ状に絶縁膜が埋め込まれる構造で形成されることを特徴とする請求項6に記載の半導体集積回路。
- 前記複数の素子分離構造が、前記基板内に、O2イオンを用いた積層注入(stack implant)法にて形成されることを特徴とする請求項6に記載の半導体集積回路。
- 前記デジタル回路素子が、ST−LDMOS(Shallow Trench Isolation−LDMOS)、MT−LDMOS(Medium Trench Isolation−LDMOS)、DT−LDMOS(Deep Trench Isolation−LDMOS)、及びHV−LDMOS(High Voltage Well−LDMOS)素子を備えることを特徴とする請求項1に記載の半導体集積回路。
- 前記HV−LDMOS素子が、高電圧ウェルに取り囲まれるように形成されることを特徴とする請求項17に記載の半導体集積回路。
- 前記高電圧ウェルが、N型ウェル又はP型ウェルであることを特徴とする請求項18に記載の半導体集積回路。
- 前記高電圧ウェルが、前記基板の上面から一定の深さに不純物イオンを注入した後、注入された不純物イオンを、ドライブイン処理により拡散させて形成されることを特徴とする請求項18に記載の半導体集積回路。
- 前記注入された不純物イオンが、前記基板の上面から1μm〜3μmの範囲の深さに注入されることを特徴とする請求項20に記載の半導体集積回路。
- 前記ドライブイン処理が、1000℃〜1200℃の範囲の温度にて、2〜15時間にわたって行われることを特徴とする請求項20に記載の半導体集積回路。
- 前記アナログ回路素子が、BJT(Bipolar Junction Transistor)、CMOS(Complementary Metal Oxide Semiconductor)素子、及びHBT(Hetero Junction Bipolar Transistor)の少なくともいずれか1つを備えることを特徴とする請求項1に記載の半導体集積回路。
- 前記BJT(Bipolar Junction Transistor)が、
前記基板内に一定の深さに形成されたコレクタと、
該コレクタから離隔するように、前記基板内に形成されたエミッタと、
前記コレクタと前記エミッタとの間に形成されたベースと
を備えることを特徴とする請求項23に記載の半導体集積回路。 - 前記コレクタが、前記深いウェルと同じ濃度及び深さで形成されることを特徴とする請求項24に記載の半導体集積回路。
- 前記コレクタが、前記アナログ回路素子のうち、隣接する素子を取り囲むように形成された前記深いウェルよりも、前記基板の上面を基準に、より低い深さに形成されることを特徴とする請求項24に記載の半導体集積回路。
- 前記HBT(Hetero Junction Bipolar Transistor)が、
前記基板内に一定の深さに形成されたコレクタと、
前記基板の上面に形成されたベースと、
該ベース上に形成されたエミッタと
を備えることを特徴とする請求項23に記載の半導体集積回路。 - 前記コレクタが、前記深いウェルと同じ濃度及び深さで形成されることを特徴とする請求項27に記載の半導体集積回路。
- 前記コレクタが、積層注入(stack implant)法にて形成されることを特徴とする請求項27又は28に記載の半導体集積回路。
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KR10-2006-0037865 | 2006-04-26 | ||
KR20060037865 | 2006-04-26 | ||
KR10-2007-0026209 | 2007-03-16 | ||
KR1020070026209A KR100854440B1 (ko) | 2006-04-26 | 2007-03-16 | 반도체 집적회로 |
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JP2007294973A JP2007294973A (ja) | 2007-11-08 |
JP5233041B2 true JP5233041B2 (ja) | 2013-07-10 |
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US7781292B2 (en) * | 2007-04-30 | 2010-08-24 | International Business Machines Corporation | High power device isolation and integration |
US20090020813A1 (en) * | 2007-07-16 | 2009-01-22 | Steven Howard Voldman | Formation of lateral trench fets (field effect transistors) using steps of ldmos (lateral double-diffused metal oxide semiconductor) technology |
US8163621B2 (en) * | 2008-06-06 | 2012-04-24 | Globalfoundries Singapore Pte. Ltd. | High performance LDMOS device having enhanced dielectric strain layer |
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