JP5232823B2 - エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 - Google Patents

エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 Download PDF

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Publication number
JP5232823B2
JP5232823B2 JP2010078106A JP2010078106A JP5232823B2 JP 5232823 B2 JP5232823 B2 JP 5232823B2 JP 2010078106 A JP2010078106 A JP 2010078106A JP 2010078106 A JP2010078106 A JP 2010078106A JP 5232823 B2 JP5232823 B2 JP 5232823B2
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JP
Japan
Prior art keywords
copper foil
atomic concentration
copper
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010078106A
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English (en)
Japanese (ja)
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JP2011211008A (ja
Inventor
秀樹 古澤
美里 中願寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2010078106A priority Critical patent/JP5232823B2/ja
Priority to PCT/JP2011/057894 priority patent/WO2011122645A1/ja
Priority to TW100110725A priority patent/TWI397359B/zh
Publication of JP2011211008A publication Critical patent/JP2011211008A/ja
Application granted granted Critical
Publication of JP5232823B2 publication Critical patent/JP5232823B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2010078106A 2010-03-30 2010-03-30 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 Active JP5232823B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010078106A JP5232823B2 (ja) 2010-03-30 2010-03-30 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
PCT/JP2011/057894 WO2011122645A1 (ja) 2010-03-30 2011-03-29 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
TW100110725A TWI397359B (zh) 2010-03-30 2011-03-29 A copper foil for printed wiring board excellent in etching and a laminate for use thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010078106A JP5232823B2 (ja) 2010-03-30 2010-03-30 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体

Publications (2)

Publication Number Publication Date
JP2011211008A JP2011211008A (ja) 2011-10-20
JP5232823B2 true JP5232823B2 (ja) 2013-07-10

Family

ID=44712340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010078106A Active JP5232823B2 (ja) 2010-03-30 2010-03-30 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体

Country Status (3)

Country Link
JP (1) JP5232823B2 (zh)
TW (1) TWI397359B (zh)
WO (1) WO2011122645A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503062B (zh) * 2012-05-21 2015-10-01 Jx Nippon Mining & Metals Corp Surface treatment of copper foil and the use of its laminated board, printed wiring board, electronic equipment and manufacturing printed wiring board method
JP6717835B2 (ja) * 2015-08-21 2020-07-08 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327184A (ja) * 1992-05-19 1993-12-10 Ibiden Co Ltd 電子部品搭載用基板の製造方法
US6534192B1 (en) * 1999-09-24 2003-03-18 Lucent Technologies Inc. Multi-purpose finish for printed wiring boards and method of manufacture of such boards
JP2001111201A (ja) * 1999-10-14 2001-04-20 Matsushita Electric Ind Co Ltd 配線板の製造方法およびそれを用いて製造された配線板
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3510839B2 (ja) * 2000-03-28 2004-03-29 三洋電機株式会社 半導体装置およびその製造方法
JP4592936B2 (ja) * 2000-12-05 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子回路用銅箔及び電子回路の形成方法
TWI251536B (en) * 2003-03-20 2006-03-21 Hitachi Chemical Co Ltd Material for multilayer printed circuit board with built-in capacitor, substrate for multilayer printed circuit board, multilayer printed circuit board and methods for producing those
JP2007136677A (ja) * 2005-11-14 2007-06-07 Toyobo Co Ltd 金属被覆ポリイミドフィルム
EP2384101A4 (en) * 2009-01-29 2012-08-29 Jx Nippon Mining & Metals Corp ROLLED COPPER FOIL OR ELECTROLYTE COPPER FOIL FOR ELECTRONIC CIRCUITS, AND METHOD FOR CONSTRUCTION OF ELECTRONIC SWITCHING THEREWITH

Also Published As

Publication number Publication date
TW201212753A (en) 2012-03-16
JP2011211008A (ja) 2011-10-20
WO2011122645A1 (ja) 2011-10-06
TWI397359B (zh) 2013-05-21

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