JP5232592B2 - 光取出率を改善するための発光デバイスにおける光学エレメントの形成 - Google Patents
光取出率を改善するための発光デバイスにおける光学エレメントの形成 Download PDFInfo
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- JP5232592B2 JP5232592B2 JP2008267869A JP2008267869A JP5232592B2 JP 5232592 B2 JP5232592 B2 JP 5232592B2 JP 2008267869 A JP2008267869 A JP 2008267869A JP 2008267869 A JP2008267869 A JP 2008267869A JP 5232592 B2 JP5232592 B2 JP 5232592B2
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- light emitting
- emitting device
- semiconductor light
- fresnel lens
- semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/32—Holograms used as optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Description
θc=arcsine(nsurrounding/nLED)
によって定義される。ここで、nsurrounding及びnLEDはそれぞれ、発光デバイスの周囲の材料と発光デバイスの屈折率を示している。LEDはしばしばエポキシ内に封入されるが、その屈折率(nepoxy)は大体1.5程度である。前述のIII-V半導体材料の一つで作られたLEDでは、その屈折率は約2.4から約4.1までの範囲である。平均的な屈折率(nLED)を約3.5とすると、θcの典型的な値は約25°である。したがって、活性層22内の点光源27から発せられる光子のうち半角が25°の「取出円錐」内の任意の表面を通るものは、LEDから外部へ放射される。LED100と取出円錐の外側の材料との間の境界面に当たる光子は、全反射を繰り返し受け、例えば半導体層(活性層22を含む)又はコンタクト31及び32によって吸収されることになる。すなわち、表面に垂直な軸に対して25°よりも大きい角度で表面に当たる多くの光子は、最初の段階でLEDから外部へは放射されない。発せられた光子のうちのより多くの部分が取り出される高い光の取出効率を有するLEDが必要とされている。
Claims (9)
- 半導体発光素子によって放射される光に作用を及ぼすよう、前記半導体発光素子の少なくとも一つの面にフレネルレンズ及びホログラフィックディフューザのうちの少なくとも一つを形成する工程を含み、
前記少なくとも一つの面は、(AlxGa1-x)yIn1-yP(0≦x≦1、0≦y≦1)を含む化合物及びIII-窒化物半導体化合物のうちの一方であり、
前記形成工程は、ウェハーボンディングプロセスと同時に実行され、前記ウェハーボンディングプロセスは、
前記半導体発光素子の第一のサブストレートを取り除く工程と、
第二のサブストレートを前記半導体発光素子にボンディングする工程とを含んでいる、ことを特徴とする、発光デバイスを形成する方法。 - 前記少なくとも一つの面は光を取り出すことを意図した少なくとも一つの光取出面であり、前記形成工程を、前記半導体発光素子の少なくとも一つの光取出面において行うものである請求項1に記載の方法。
- 前記光取出面と反対の面に光学エレメントを形成する工程をさらに含んでいる請求項2に記載の方法。
- 前記半導体発光素子の一又は二以上の側面を傾斜させる工程を含んでいる請求項1に記載の方法。
- 請求項1に記載の方法において、前記半導体発光素子は発光層を有しており、前記方法は、さらに、前記発光層の予め選択された部分に光放射を制限することを含んでいる方法。
- 請求項1に記載の方法において、前記半導体発光素子は発光層を有しており、前記方法は、さらに、前記発光層の予め選択された部分に光放射を制限することを含んでおり、前記制限することには、ホロニアクプロセスの適用、選択領域成長の使用、パターン化ウェハボンディングの使用、ディフィージョンの使用、そしてイオン注入の使用の中から選択された少なくとも一つの方法が含まれている方法。
- 請求項1に記載の方法において、さらに、前記半導体発光素子の一又は二以上の面に反射材をコーティングする工程を含んでいる方法。
- 請求項1に記載の方法において、さらに、前記フレネルレンズ又は前記ホログラフィックディフューザに反射材をコーティングする工程を含んでいる方法。
- 前記形成工程は、スタンピングブロックを、前記半導体発光素子の少なくとも一つの面にプレスする工程を含んでおり、前記スタンピングブロックの材料は、TZM(モリブデン、チタン、ジルコン、そしてカーボンの化合物)などのモリブデン合金、グラファイト、シリコンカーバイド、そしてサファイア、ステンレススチール、Hastalloy(商標)、Kovar(商標)、Nichrome(商標)、タングステン及びタングステン合金、タンタル、ニオブ、チタン合金のグループから選択されたものである、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/823,841 US6987613B2 (en) | 2001-03-30 | 2001-03-30 | Forming an optical element on the surface of a light emitting device for improved light extraction |
US09/823841 | 2001-03-30 |
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JP2002098327A Division JP4260411B2 (ja) | 2001-03-30 | 2002-04-01 | 光取出率を改善するための発光デバイスにおける光学エレメントの形成 |
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JP2012117744A Division JP5542871B2 (ja) | 2001-03-30 | 2012-05-23 | 光取出率を改善するための発光デバイスにおける光学エレメントの形成 |
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JP2009010435A JP2009010435A (ja) | 2009-01-15 |
JP5232592B2 true JP5232592B2 (ja) | 2013-07-10 |
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JP2002098327A Expired - Lifetime JP4260411B2 (ja) | 2001-03-30 | 2002-04-01 | 光取出率を改善するための発光デバイスにおける光学エレメントの形成 |
JP2008267869A Expired - Lifetime JP5232592B2 (ja) | 2001-03-30 | 2008-10-16 | 光取出率を改善するための発光デバイスにおける光学エレメントの形成 |
JP2012117744A Expired - Lifetime JP5542871B2 (ja) | 2001-03-30 | 2012-05-23 | 光取出率を改善するための発光デバイスにおける光学エレメントの形成 |
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Country Status (4)
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US (1) | US6987613B2 (ja) |
JP (3) | JP4260411B2 (ja) |
DE (1) | DE10213611A1 (ja) |
TW (1) | TW541719B (ja) |
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Also Published As
Publication number | Publication date |
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JP5542871B2 (ja) | 2014-07-09 |
US6987613B2 (en) | 2006-01-17 |
JP4260411B2 (ja) | 2009-04-30 |
DE10213611A1 (de) | 2002-10-10 |
JP2012156566A (ja) | 2012-08-16 |
US20020141006A1 (en) | 2002-10-03 |
TW541719B (en) | 2003-07-11 |
JP2003017740A (ja) | 2003-01-17 |
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