JP5231917B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP5231917B2
JP5231917B2 JP2008246503A JP2008246503A JP5231917B2 JP 5231917 B2 JP5231917 B2 JP 5231917B2 JP 2008246503 A JP2008246503 A JP 2008246503A JP 2008246503 A JP2008246503 A JP 2008246503A JP 5231917 B2 JP5231917 B2 JP 5231917B2
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Japan
Prior art keywords
link
vacuum
substrate
moving
forming apparatus
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Expired - Fee Related
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JP2008246503A
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English (en)
Japanese (ja)
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JP2010080230A (ja
JP2010080230A5 (enrdf_load_stackoverflow
Inventor
雅 若林
信広 韮沢
賢治 弓場
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2008246503A priority Critical patent/JP5231917B2/ja
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JP2008246503A 2008-09-25 2008-09-25 成膜装置 Expired - Fee Related JP5231917B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008246503A JP5231917B2 (ja) 2008-09-25 2008-09-25 成膜装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008246503A JP5231917B2 (ja) 2008-09-25 2008-09-25 成膜装置

Publications (3)

Publication Number Publication Date
JP2010080230A JP2010080230A (ja) 2010-04-08
JP2010080230A5 JP2010080230A5 (enrdf_load_stackoverflow) 2011-02-03
JP5231917B2 true JP5231917B2 (ja) 2013-07-10

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ID=42210432

Family Applications (1)

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JP2008246503A Expired - Fee Related JP5231917B2 (ja) 2008-09-25 2008-09-25 成膜装置

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JP (1) JP5231917B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5476227B2 (ja) * 2010-06-29 2014-04-23 株式会社日立ハイテクノロジーズ 成膜装置及び成膜方法
JP6009685B2 (ja) * 2013-09-26 2016-10-19 株式会社アルバック 基板処理装置、および、成膜装置
KR101553626B1 (ko) * 2013-12-19 2015-09-16 주식회사 에스에프에이 기판 턴장치
JP2020518123A (ja) * 2018-04-03 2020-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを位置合わせするための装置および真空システム、ならびにキャリアを位置合わせする方法
WO2019192680A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus for handling a carrier in a vacuum chamber, vacuum deposition system, and method of handling a carrier in a vacuum chamber
JP6627181B1 (ja) * 2018-07-31 2020-01-08 キヤノントッキ株式会社 蒸発源及び蒸着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4286496B2 (ja) * 2002-07-04 2009-07-01 株式会社半導体エネルギー研究所 蒸着装置及び薄膜作製方法
JP3965479B2 (ja) * 2003-07-28 2007-08-29 株式会社エフ・ティ・エスコーポレーション 箱型対向ターゲット式スパッタ装置及び化合物薄膜の製造方法
JP4345057B2 (ja) * 2004-04-19 2009-10-14 日本精工株式会社 位置決め装置
JP2006241489A (ja) * 2005-03-01 2006-09-14 Canon Inc 位置決め装置、及び有機エレクトロルミネッセンスパネルの製造装置
JP2007332458A (ja) * 2006-05-18 2007-12-27 Sony Corp 蒸着装置および蒸着源ならびに表示装置の製造方法
KR20090130559A (ko) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 이송 장치 및 이를 구비하는 유기물 증착 장치
JP2010040956A (ja) * 2008-08-08 2010-02-18 Tokyo Electron Ltd 基板の処理装置

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JP2010080230A (ja) 2010-04-08

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