JP2010080230A5 - - Google Patents

Download PDF

Info

Publication number
JP2010080230A5
JP2010080230A5 JP2008246503A JP2008246503A JP2010080230A5 JP 2010080230 A5 JP2010080230 A5 JP 2010080230A5 JP 2008246503 A JP2008246503 A JP 2008246503A JP 2008246503 A JP2008246503 A JP 2008246503A JP 2010080230 A5 JP2010080230 A5 JP 2010080230A5
Authority
JP
Japan
Prior art keywords
vacuum
organic
wiring
cableveyor
outgas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008246503A
Other languages
English (en)
Japanese (ja)
Other versions
JP5231917B2 (ja
JP2010080230A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008246503A priority Critical patent/JP5231917B2/ja
Priority claimed from JP2008246503A external-priority patent/JP5231917B2/ja
Publication of JP2010080230A publication Critical patent/JP2010080230A/ja
Publication of JP2010080230A5 publication Critical patent/JP2010080230A5/ja
Application granted granted Critical
Publication of JP5231917B2 publication Critical patent/JP5231917B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008246503A 2008-09-25 2008-09-25 成膜装置 Expired - Fee Related JP5231917B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008246503A JP5231917B2 (ja) 2008-09-25 2008-09-25 成膜装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008246503A JP5231917B2 (ja) 2008-09-25 2008-09-25 成膜装置

Publications (3)

Publication Number Publication Date
JP2010080230A JP2010080230A (ja) 2010-04-08
JP2010080230A5 true JP2010080230A5 (enrdf_load_stackoverflow) 2011-02-03
JP5231917B2 JP5231917B2 (ja) 2013-07-10

Family

ID=42210432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008246503A Expired - Fee Related JP5231917B2 (ja) 2008-09-25 2008-09-25 成膜装置

Country Status (1)

Country Link
JP (1) JP5231917B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5476227B2 (ja) * 2010-06-29 2014-04-23 株式会社日立ハイテクノロジーズ 成膜装置及び成膜方法
JP6009685B2 (ja) * 2013-09-26 2016-10-19 株式会社アルバック 基板処理装置、および、成膜装置
KR101553626B1 (ko) * 2013-12-19 2015-09-16 주식회사 에스에프에이 기판 턴장치
JP2020518123A (ja) * 2018-04-03 2020-06-18 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 真空チャンバ内でキャリアを位置合わせするための装置および真空システム、ならびにキャリアを位置合わせする方法
WO2019192680A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus for handling a carrier in a vacuum chamber, vacuum deposition system, and method of handling a carrier in a vacuum chamber
JP6627181B1 (ja) * 2018-07-31 2020-01-08 キヤノントッキ株式会社 蒸発源及び蒸着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4286496B2 (ja) * 2002-07-04 2009-07-01 株式会社半導体エネルギー研究所 蒸着装置及び薄膜作製方法
JP3965479B2 (ja) * 2003-07-28 2007-08-29 株式会社エフ・ティ・エスコーポレーション 箱型対向ターゲット式スパッタ装置及び化合物薄膜の製造方法
JP4345057B2 (ja) * 2004-04-19 2009-10-14 日本精工株式会社 位置決め装置
JP2006241489A (ja) * 2005-03-01 2006-09-14 Canon Inc 位置決め装置、及び有機エレクトロルミネッセンスパネルの製造装置
JP2007332458A (ja) * 2006-05-18 2007-12-27 Sony Corp 蒸着装置および蒸着源ならびに表示装置の製造方法
KR20090130559A (ko) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 이송 장치 및 이를 구비하는 유기물 증착 장치
JP2010040956A (ja) * 2008-08-08 2010-02-18 Tokyo Electron Ltd 基板の処理装置

Similar Documents

Publication Publication Date Title
JP2010080230A5 (enrdf_load_stackoverflow)
SG171605A1 (en) Method for the wet-chemical treatment of a semiconductor wafer
JP2018503259A5 (enrdf_load_stackoverflow)
GB2510727A (en) Degradable slip element
EP4358119A3 (en) Improved self-assembled monolayer blocking with intermittent air-water exposure
TW200802585A (en) Substrate processing apparatus, substrate processing method, and storage medium
DE602006007596D1 (de) Vorrichtung zum bilden von ringförmigen nuten in der aussenfläche eines kabels oder rohrs
WO2013052509A3 (en) Remote plasma burn-in
WO2016138218A8 (en) Methods and apparatus for using alkyl amines for the selective removal of metal nitride
TW200728071A (en) Gas barrier film, gas barrier laminated body and its fabrication method
JP2010183085A5 (enrdf_load_stackoverflow)
SG169306A1 (en) Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatus
JP2009527676A5 (enrdf_load_stackoverflow)
EP2113939A3 (en) Semiconductor wafer processing method and apparatus
JP2015138913A5 (enrdf_load_stackoverflow)
TW200633016A (en) Method and system for fabricating free-standing nanostructures
EP2228684A3 (en) Coating and developing apparatus, coating and developing method, and storage medium
JP2016131210A5 (enrdf_load_stackoverflow)
JP2013510442A5 (enrdf_load_stackoverflow)
EP2863259A3 (en) Method for manufacturing photomask blank
TW200702941A (en) Fluids for immersion lithography systems
ES2555306T3 (es) Procedimiento de envoltura de productos alimentarios
JP2015207638A5 (enrdf_load_stackoverflow)
JP2008279385A5 (enrdf_load_stackoverflow)
GB2495256A (en) Integrated processing and critical point drying systems for semiconductor and MEMS devices