JP2010080230A5 - - Google Patents

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Publication number
JP2010080230A5
JP2010080230A5 JP2008246503A JP2008246503A JP2010080230A5 JP 2010080230 A5 JP2010080230 A5 JP 2010080230A5 JP 2008246503 A JP2008246503 A JP 2008246503A JP 2008246503 A JP2008246503 A JP 2008246503A JP 2010080230 A5 JP2010080230 A5 JP 2010080230A5
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JP
Japan
Prior art keywords
vacuum
organic
wiring
cableveyor
outgas
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JP2008246503A
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Japanese (ja)
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JP2010080230A (en
JP5231917B2 (en
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Priority to JP2008246503A priority Critical patent/JP5231917B2/en
Priority claimed from JP2008246503A external-priority patent/JP5231917B2/en
Publication of JP2010080230A publication Critical patent/JP2010080230A/en
Publication of JP2010080230A5 publication Critical patent/JP2010080230A5/ja
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Publication of JP5231917B2 publication Critical patent/JP5231917B2/en
Expired - Fee Related legal-status Critical Current
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Description

有機ELデバイスを製造する有力な方法として真空蒸着法がある。真空蒸着工程などの真空を利用する機構において、その真空チャンバ中に繰り返し移動する機構を有し、且つその移動体に配線、配管を施す必要がある。その場合、大気中で使用するような一般的な動的結束具(ex.ケーブルベア(登録商標))などを用いて真空中に暴露することは、(1)配線の被覆材質からのアウトガスの問題や、(2)配管疲労による損傷がもたらす流体漏洩の恐れなど、の理由から、通常難しいとされている。特に有機ELデバイス製造装置は、水漏洩に対してデリケートであり、再度所定の真空度を得るのに時間がかかる。この課題に対する従来技術としては下記のものがある。
There exists a vacuum evaporation method as an influential method of manufacturing an organic EL device. In a mechanism using vacuum, such as a vacuum deposition process, it is necessary to have a mechanism that repeatedly moves into the vacuum chamber, and to provide wiring and piping to the moving body. In that case, exposure to the vacuum using a general dynamic tying tool (ex. Cableveyor (registered trademark) ) used in the atmosphere will cause (1) outgas from the coating material of the wiring. problems and, (2), such as fear of fluid leakage resulting damage due to pipeline fatigue, the reasons are usually difficult. In particular, the organic EL device manufacturing apparatus is sensitive to water leakage, and it takes time to obtain a predetermined degree of vacuum again. Conventional techniques for this problem include the following.

JP2008246503A 2008-09-25 2008-09-25 Deposition equipment Expired - Fee Related JP5231917B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008246503A JP5231917B2 (en) 2008-09-25 2008-09-25 Deposition equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008246503A JP5231917B2 (en) 2008-09-25 2008-09-25 Deposition equipment

Publications (3)

Publication Number Publication Date
JP2010080230A JP2010080230A (en) 2010-04-08
JP2010080230A5 true JP2010080230A5 (en) 2011-02-03
JP5231917B2 JP5231917B2 (en) 2013-07-10

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ID=42210432

Family Applications (1)

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JP2008246503A Expired - Fee Related JP5231917B2 (en) 2008-09-25 2008-09-25 Deposition equipment

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JP (1) JP5231917B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5476227B2 (en) * 2010-06-29 2014-04-23 株式会社日立ハイテクノロジーズ Film forming apparatus and film forming method
WO2015045980A1 (en) * 2013-09-26 2015-04-02 株式会社 アルバック Substrate processing device and film forming device
KR101553626B1 (en) * 2013-12-19 2015-09-16 주식회사 에스에프에이 Apparatus for turning glass
CN110557953B (en) * 2018-04-03 2021-10-29 应用材料公司 Device and vacuum system for alignment of a carrier in a vacuum chamber and method for aligning a carrier
KR102215483B1 (en) * 2018-04-03 2021-02-10 어플라이드 머티어리얼스, 인코포레이티드 Apparatus for handling carrier in vacuum chamber, vacuum deposition system, and method of handling carrier in vacuum chamber
JP6627181B1 (en) * 2018-07-31 2020-01-08 キヤノントッキ株式会社 Evaporation source and evaporation equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4286496B2 (en) * 2002-07-04 2009-07-01 株式会社半導体エネルギー研究所 Vapor deposition apparatus and thin film manufacturing method
JP3965479B2 (en) * 2003-07-28 2007-08-29 株式会社エフ・ティ・エスコーポレーション Box type opposed target type sputtering apparatus and compound thin film manufacturing method
JP4345057B2 (en) * 2004-04-19 2009-10-14 日本精工株式会社 Positioning device
JP2006241489A (en) * 2005-03-01 2006-09-14 Canon Inc Positioning device, and apparatus for manufacturing organic electroluminescence panel
JP2007332458A (en) * 2006-05-18 2007-12-27 Sony Corp Vapor deposition apparatus, and vapor deposition source, and display device manufacturing method
KR20090130559A (en) * 2008-06-16 2009-12-24 삼성모바일디스플레이주식회사 Transfer apparatus and organic deposition device with the same
JP2010040956A (en) * 2008-08-08 2010-02-18 Tokyo Electron Ltd Substrate processing apparatus

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