JP5214031B2 - 半導体リソグラフィのための投影露光装置における振動減衰方法 - Google Patents

半導体リソグラフィのための投影露光装置における振動減衰方法 Download PDF

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JP5214031B2
JP5214031B2 JP2011526508A JP2011526508A JP5214031B2 JP 5214031 B2 JP5214031 B2 JP 5214031B2 JP 2011526508 A JP2011526508 A JP 2011526508A JP 2011526508 A JP2011526508 A JP 2011526508A JP 5214031 B2 JP5214031 B2 JP 5214031B2
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Prior art keywords
assembly
replaceable
exposure apparatus
replaceable assembly
projection exposure
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Japanese (ja)
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JP2012503305A (ja
JP2012503305A5 (enExample
Inventor
クレッシュ ピーター
リンゲル ミカエル
ヴァイス マルクス
Original Assignee
カール・ツァイス・エスエムティー・ゲーエムベーハー
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lens Barrels (AREA)
JP2011526508A 2008-09-16 2009-09-15 半導体リソグラフィのための投影露光装置における振動減衰方法 Active JP5214031B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008047562.9 2008-09-16
DE102008047562A DE102008047562B4 (de) 2008-09-16 2008-09-16 Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie
PCT/EP2009/061917 WO2010031754A1 (en) 2008-09-16 2009-09-15 Vibration damping in projection exposure apparatuses for semiconductor lithography

Publications (3)

Publication Number Publication Date
JP2012503305A JP2012503305A (ja) 2012-02-02
JP2012503305A5 JP2012503305A5 (enExample) 2012-11-01
JP5214031B2 true JP5214031B2 (ja) 2013-06-19

Family

ID=41228717

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JP2011526508A Active JP5214031B2 (ja) 2008-09-16 2009-09-15 半導体リソグラフィのための投影露光装置における振動減衰方法

Country Status (8)

Country Link
US (1) US8212992B2 (enExample)
EP (1) EP2326989B1 (enExample)
JP (1) JP5214031B2 (enExample)
KR (1) KR101608555B1 (enExample)
CN (1) CN102159996B (enExample)
DE (1) DE102008047562B4 (enExample)
TW (1) TWI610139B (enExample)
WO (1) WO2010031754A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2469340B1 (en) 2010-12-21 2021-01-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102015224743A1 (de) * 2015-12-09 2016-10-20 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem pseudoelastischen Dämpfungselement
DE102020206591A1 (de) * 2020-05-27 2021-12-02 Carl Zeiss Smt Gmbh Schwingungstilger und Verfahren zur Auslegung eines Schwingungstilgers sowie Projektionsbelichtungsanlage für die Halbleiterlithographie
US12000455B2 (en) * 2022-03-10 2024-06-04 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for reducing vibration of apparatuses
DE102022214186A1 (de) * 2022-12-21 2024-06-27 Carl Zeiss Smt Gmbh Optisches system und projektionsbelichtungsanlage

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
US6420819B1 (en) * 1994-01-27 2002-07-16 Active Control Experts, Inc. Packaged strain actuator
US20030040818A1 (en) 1994-01-27 2003-02-27 Baruch Pletner Method and device for vibration control
JPH1089403A (ja) * 1996-09-10 1998-04-07 Nikon Corp 防振装置
DE19917104A1 (de) * 1999-04-15 2000-10-26 System 3R International Ab Vae Halter zum exakten Positionieren eines Werkstückes
DE10062786A1 (de) * 2000-12-15 2002-06-20 Zeiss Carl System zur Dämpfung von Schwingungen
TWI298427B (en) * 2001-02-13 2008-07-01 Asml Netherlands Bv Damped mount for use in lithographic projection apparatus
DE10106605A1 (de) * 2001-02-13 2002-08-22 Zeiss Carl System zur Beseitigung oder wenigstens Dämpfung von Schwingungen
DE10121346A1 (de) * 2001-05-02 2002-11-07 Zeiss Carl Objektiv, insbesondere Projektionsobjektiv für die Halbleiter-Lithographie
DE10225266A1 (de) 2001-12-19 2003-07-03 Zeiss Carl Smt Ag Abbildungseinrichtung in einer Projektionsbelichtungsanlage
EP1321822A1 (en) * 2001-12-21 2003-06-25 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10229623A1 (de) * 2002-06-28 2004-01-15 Carl Zeiss Jena Gmbh Baugruppe mit einer äußeren Fassung und einem optischen Element
US20040100007A1 (en) 2002-11-21 2004-05-27 Nikon Corporation Vibration damping devices and methods
EP1457825A1 (en) * 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
JP4574206B2 (ja) * 2003-04-25 2010-11-04 キヤノン株式会社 駆動装置、それを用いた露光装置、デバイスの製造方法
TW200507066A (en) * 2003-07-25 2005-02-16 Nikon Corp Exposure apparatus
KR101218864B1 (ko) 2005-02-11 2013-01-07 칼 짜이스 에스엠테 게엠베하 광 리소그래피 렌즈 지지 장치용 진동 감쇄 장치
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
US20070097340A1 (en) * 2005-10-31 2007-05-03 Nikon Corporation Active damper with counter mass to compensate for structural vibrations of a lithographic system
US7724351B2 (en) 2006-01-30 2010-05-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and exchangeable optical element
JP5036259B2 (ja) * 2006-09-14 2012-09-26 キヤノン株式会社 除振装置、露光装置及びデバイス製造方法
DE102006046200A1 (de) * 2006-09-29 2008-04-03 Carl Zeiss Smt Ag Verfahren und Vorrichtung zur Positionierung eines Elements in einem optischen System
DE102006050835A1 (de) 2006-10-27 2008-05-08 Carl Zeiss Smt Ag Verfahren und Vorrichtung zum Austausch von Objetkivteilen
US8044373B2 (en) * 2007-06-14 2011-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5641878B2 (ja) 2010-10-29 2014-12-17 キヤノン株式会社 振動制御装置、リソグラフィー装置、および、物品の製造方法

Also Published As

Publication number Publication date
JP2012503305A (ja) 2012-02-02
US20110205507A1 (en) 2011-08-25
US8212992B2 (en) 2012-07-03
CN102159996A (zh) 2011-08-17
CN102159996B (zh) 2014-12-10
DE102008047562B4 (de) 2012-11-08
DE102008047562A1 (de) 2010-03-25
TWI610139B (zh) 2018-01-01
KR20110076929A (ko) 2011-07-06
TW201020692A (en) 2010-06-01
EP2326989A1 (en) 2011-06-01
EP2326989B1 (en) 2017-01-25
WO2010031754A1 (en) 2010-03-25
KR101608555B1 (ko) 2016-04-01

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