TWI610139B - 半導體微影投射曝光設備中消減振動的裝置 - Google Patents

半導體微影投射曝光設備中消減振動的裝置 Download PDF

Info

Publication number
TWI610139B
TWI610139B TW098131174A TW98131174A TWI610139B TW I610139 B TWI610139 B TW I610139B TW 098131174 A TW098131174 A TW 098131174A TW 98131174 A TW98131174 A TW 98131174A TW I610139 B TWI610139 B TW I610139B
Authority
TW
Taiwan
Prior art keywords
projection exposure
exposure apparatus
lithographic projection
item
patent application
Prior art date
Application number
TW098131174A
Other languages
English (en)
Chinese (zh)
Other versions
TW201020692A (en
Inventor
Peter Kloesch
彼得 克勞區
Michael Ringel
麥可 瑞傑
Markus Weiss
馬可斯 懷斯
Original Assignee
Carl Zeiss Smt Gmbh
卡爾蔡司Ｓｍｔ有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Gmbh, 卡爾蔡司Ｓｍｔ有限公司 filed Critical Carl Zeiss Smt Gmbh
Publication of TW201020692A publication Critical patent/TW201020692A/zh
Application granted granted Critical
Publication of TWI610139B publication Critical patent/TWI610139B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Landscapes

  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lens Barrels (AREA)
TW098131174A 2008-09-16 2009-09-16 半導體微影投射曝光設備中消減振動的裝置 TWI610139B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008047562.9 2008-09-16
DE102008047562A DE102008047562B4 (de) 2008-09-16 2008-09-16 Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie

Publications (2)

Publication Number Publication Date
TW201020692A TW201020692A (en) 2010-06-01
TWI610139B true TWI610139B (zh) 2018-01-01

Family

ID=41228717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098131174A TWI610139B (zh) 2008-09-16 2009-09-16 半導體微影投射曝光設備中消減振動的裝置

Country Status (8)

Country Link
US (1) US8212992B2 (enExample)
EP (1) EP2326989B1 (enExample)
JP (1) JP5214031B2 (enExample)
KR (1) KR101608555B1 (enExample)
CN (1) CN102159996B (enExample)
DE (1) DE102008047562B4 (enExample)
TW (1) TWI610139B (enExample)
WO (1) WO2010031754A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2469340B1 (en) 2010-12-21 2021-01-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102015224743A1 (de) * 2015-12-09 2016-10-20 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem pseudoelastischen Dämpfungselement
DE102020206591A1 (de) * 2020-05-27 2021-12-02 Carl Zeiss Smt Gmbh Schwingungstilger und Verfahren zur Auslegung eines Schwingungstilgers sowie Projektionsbelichtungsanlage für die Halbleiterlithographie
US12000455B2 (en) * 2022-03-10 2024-06-04 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for reducing vibration of apparatuses
DE102022214186A1 (de) * 2022-12-21 2024-06-27 Carl Zeiss Smt Gmbh Optisches system und projektionsbelichtungsanlage

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656882A (en) * 1994-01-27 1997-08-12 Active Control Experts, Inc. Packaged strain actuator
TW200426532A (en) * 2003-03-11 2004-12-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby.
US20070097340A1 (en) * 2005-10-31 2007-05-03 Nikon Corporation Active damper with counter mass to compensate for structural vibrations of a lithographic system
TW200732857A (en) * 2006-01-30 2007-09-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method and exchangeable optical element
US20080080070A1 (en) * 2006-09-29 2008-04-03 Karl-Eugen Aubele Method and a device for positioning an element in an optical system
TW200817844A (en) * 2006-09-14 2008-04-16 Canon Kk Anti-vibration apparatus, exposure apparatus, and device manufacturing method
TWI298427B (en) * 2001-02-13 2008-07-01 Asml Netherlands Bv Damped mount for use in lithographic projection apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030040818A1 (en) 1994-01-27 2003-02-27 Baruch Pletner Method and device for vibration control
JPH1089403A (ja) * 1996-09-10 1998-04-07 Nikon Corp 防振装置
DE19917104A1 (de) * 1999-04-15 2000-10-26 System 3R International Ab Vae Halter zum exakten Positionieren eines Werkstückes
DE10062786A1 (de) * 2000-12-15 2002-06-20 Zeiss Carl System zur Dämpfung von Schwingungen
DE10106605A1 (de) * 2001-02-13 2002-08-22 Zeiss Carl System zur Beseitigung oder wenigstens Dämpfung von Schwingungen
DE10121346A1 (de) * 2001-05-02 2002-11-07 Zeiss Carl Objektiv, insbesondere Projektionsobjektiv für die Halbleiter-Lithographie
DE10225266A1 (de) 2001-12-19 2003-07-03 Zeiss Carl Smt Ag Abbildungseinrichtung in einer Projektionsbelichtungsanlage
EP1321822A1 (en) * 2001-12-21 2003-06-25 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10229623A1 (de) * 2002-06-28 2004-01-15 Carl Zeiss Jena Gmbh Baugruppe mit einer äußeren Fassung und einem optischen Element
US20040100007A1 (en) 2002-11-21 2004-05-27 Nikon Corporation Vibration damping devices and methods
JP4574206B2 (ja) * 2003-04-25 2010-11-04 キヤノン株式会社 駆動装置、それを用いた露光装置、デバイスの製造方法
TW200507066A (en) * 2003-07-25 2005-02-16 Nikon Corp Exposure apparatus
KR101218864B1 (ko) 2005-02-11 2013-01-07 칼 짜이스 에스엠테 게엠베하 광 리소그래피 렌즈 지지 장치용 진동 감쇄 장치
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
DE102006050835A1 (de) 2006-10-27 2008-05-08 Carl Zeiss Smt Ag Verfahren und Vorrichtung zum Austausch von Objetkivteilen
US8044373B2 (en) * 2007-06-14 2011-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5641878B2 (ja) 2010-10-29 2014-12-17 キヤノン株式会社 振動制御装置、リソグラフィー装置、および、物品の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656882A (en) * 1994-01-27 1997-08-12 Active Control Experts, Inc. Packaged strain actuator
TWI298427B (en) * 2001-02-13 2008-07-01 Asml Netherlands Bv Damped mount for use in lithographic projection apparatus
TW200426532A (en) * 2003-03-11 2004-12-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby.
US20070097340A1 (en) * 2005-10-31 2007-05-03 Nikon Corporation Active damper with counter mass to compensate for structural vibrations of a lithographic system
TW200732857A (en) * 2006-01-30 2007-09-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method and exchangeable optical element
TW200817844A (en) * 2006-09-14 2008-04-16 Canon Kk Anti-vibration apparatus, exposure apparatus, and device manufacturing method
US20080080070A1 (en) * 2006-09-29 2008-04-03 Karl-Eugen Aubele Method and a device for positioning an element in an optical system

Also Published As

Publication number Publication date
JP2012503305A (ja) 2012-02-02
US20110205507A1 (en) 2011-08-25
US8212992B2 (en) 2012-07-03
CN102159996A (zh) 2011-08-17
JP5214031B2 (ja) 2013-06-19
CN102159996B (zh) 2014-12-10
DE102008047562B4 (de) 2012-11-08
DE102008047562A1 (de) 2010-03-25
KR20110076929A (ko) 2011-07-06
TW201020692A (en) 2010-06-01
EP2326989A1 (en) 2011-06-01
EP2326989B1 (en) 2017-01-25
WO2010031754A1 (en) 2010-03-25
KR101608555B1 (ko) 2016-04-01

Similar Documents

Publication Publication Date Title
KR101043356B1 (ko) 능동 댐핑 서브조립체를 갖는 리소그래피 장치
KR101155066B1 (ko) 리소그래피 장치, 투영 조립체 및 능동 감쇠
JP6316973B2 (ja) ステージ位置決めシステムおよびリソグラフィ装置
JP4824054B2 (ja) リソグラフィ装置およびデバイス製造方法
JP5008630B2 (ja) リソグラフィ装置およびデバイス製造方法
JP2009127861A (ja) 構造物と２以上の能動減衰システムの組合せ、リソグラフィ装置、および投影アセンブリ
JP2010093253A (ja) 投影組立体およびリソグラフィ装置
JP2005109441A (ja) リソグラフィ装置及びデバイス製造方法
US8212992B2 (en) Device for damping vibrations in projection exposure apparatuses for semiconductor lithography
JP2013026500A (ja) 露光装置、それを用いたデバイスの製造方法
US9958793B2 (en) Lithographic apparatus, positioning system for use in a lithographic apparatus and method
JP2000031040A (ja) 露光方法とその露光方法を用いた回路パタ―ン体製造方法、及び露光装置とその露光装置により製造された回路パタ―ン体