DE102008047562B4 - Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie - Google Patents

Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie Download PDF

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Publication number
DE102008047562B4
DE102008047562B4 DE102008047562A DE102008047562A DE102008047562B4 DE 102008047562 B4 DE102008047562 B4 DE 102008047562B4 DE 102008047562 A DE102008047562 A DE 102008047562A DE 102008047562 A DE102008047562 A DE 102008047562A DE 102008047562 B4 DE102008047562 B4 DE 102008047562B4
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DE
Germany
Prior art keywords
assembly
projection exposure
damping
exposure apparatus
semiconductor lithography
Prior art date
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Active
Application number
DE102008047562A
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German (de)
English (en)
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DE102008047562A1 (de
Inventor
Peter Klösch
Dr. Ringel Michael
Dr. Weiß Markus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102008047562A priority Critical patent/DE102008047562B4/de
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Priority to KR1020117008600A priority patent/KR101608555B1/ko
Priority to CN200980136165.9A priority patent/CN102159996B/zh
Priority to EP09783010.3A priority patent/EP2326989B1/en
Priority to PCT/EP2009/061917 priority patent/WO2010031754A1/en
Priority to JP2011526508A priority patent/JP5214031B2/ja
Priority to TW098131174A priority patent/TWI610139B/zh
Publication of DE102008047562A1 publication Critical patent/DE102008047562A1/de
Priority to US13/045,697 priority patent/US8212992B2/en
Application granted granted Critical
Publication of DE102008047562B4 publication Critical patent/DE102008047562B4/de
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lens Barrels (AREA)
DE102008047562A 2008-09-16 2008-09-16 Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie Active DE102008047562B4 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102008047562A DE102008047562B4 (de) 2008-09-16 2008-09-16 Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie
CN200980136165.9A CN102159996B (zh) 2008-09-16 2009-09-15 用于半导体光刻的投射曝光设备中的振动衰减
EP09783010.3A EP2326989B1 (en) 2008-09-16 2009-09-15 Vibration damping in projection exposure apparatuses for semiconductor lithography
PCT/EP2009/061917 WO2010031754A1 (en) 2008-09-16 2009-09-15 Vibration damping in projection exposure apparatuses for semiconductor lithography
KR1020117008600A KR101608555B1 (ko) 2008-09-16 2009-09-15 반도체 리소그래피용 투영 노광 장치의 진동 댐핑
JP2011526508A JP5214031B2 (ja) 2008-09-16 2009-09-15 半導体リソグラフィのための投影露光装置における振動減衰方法
TW098131174A TWI610139B (zh) 2008-09-16 2009-09-16 半導體微影投射曝光設備中消減振動的裝置
US13/045,697 US8212992B2 (en) 2008-09-16 2011-03-11 Device for damping vibrations in projection exposure apparatuses for semiconductor lithography

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008047562A DE102008047562B4 (de) 2008-09-16 2008-09-16 Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie

Publications (2)

Publication Number Publication Date
DE102008047562A1 DE102008047562A1 (de) 2010-03-25
DE102008047562B4 true DE102008047562B4 (de) 2012-11-08

Family

ID=41228717

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008047562A Active DE102008047562B4 (de) 2008-09-16 2008-09-16 Vorrichtung zur Dämpfung von Schwingungen in Projektionsbelichtungsanlagen für die Halbleiterlithographie

Country Status (8)

Country Link
US (1) US8212992B2 (enExample)
EP (1) EP2326989B1 (enExample)
JP (1) JP5214031B2 (enExample)
KR (1) KR101608555B1 (enExample)
CN (1) CN102159996B (enExample)
DE (1) DE102008047562B4 (enExample)
TW (1) TWI610139B (enExample)
WO (1) WO2010031754A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224743A1 (de) * 2015-12-09 2016-10-20 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem pseudoelastischen Dämpfungselement

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2469340B1 (en) 2010-12-21 2021-01-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102020206591A1 (de) * 2020-05-27 2021-12-02 Carl Zeiss Smt Gmbh Schwingungstilger und Verfahren zur Auslegung eines Schwingungstilgers sowie Projektionsbelichtungsanlage für die Halbleiterlithographie
US12000455B2 (en) * 2022-03-10 2024-06-04 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for reducing vibration of apparatuses
DE102022214186A1 (de) * 2022-12-21 2024-06-27 Carl Zeiss Smt Gmbh Optisches system und projektionsbelichtungsanlage

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Publication number Priority date Publication date Assignee Title
US6036162A (en) * 1996-09-10 2000-03-14 Nikon Corporation Vibration isolator and method of isolating vibration
DE10062786A1 (de) * 2000-12-15 2002-06-20 Zeiss Carl System zur Dämpfung von Schwingungen
DE10106605A1 (de) * 2001-02-13 2002-08-22 Zeiss Carl System zur Beseitigung oder wenigstens Dämpfung von Schwingungen
DE10229623A1 (de) * 2002-06-28 2004-01-15 Carl Zeiss Jena Gmbh Baugruppe mit einer äußeren Fassung und einem optischen Element
US20070024829A1 (en) * 2003-04-25 2007-02-01 Canon Kabushiki Kaisha Driving unit, exposure apparatus using the same, and device fabrication method

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US6420819B1 (en) * 1994-01-27 2002-07-16 Active Control Experts, Inc. Packaged strain actuator
US20030040818A1 (en) 1994-01-27 2003-02-27 Baruch Pletner Method and device for vibration control
DE19917104A1 (de) * 1999-04-15 2000-10-26 System 3R International Ab Vae Halter zum exakten Positionieren eines Werkstückes
TWI298427B (en) * 2001-02-13 2008-07-01 Asml Netherlands Bv Damped mount for use in lithographic projection apparatus
DE10121346A1 (de) * 2001-05-02 2002-11-07 Zeiss Carl Objektiv, insbesondere Projektionsobjektiv für die Halbleiter-Lithographie
DE10225266A1 (de) 2001-12-19 2003-07-03 Zeiss Carl Smt Ag Abbildungseinrichtung in einer Projektionsbelichtungsanlage
EP1321822A1 (en) * 2001-12-21 2003-06-25 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US20040100007A1 (en) 2002-11-21 2004-05-27 Nikon Corporation Vibration damping devices and methods
EP1457825A1 (en) * 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
TW200507066A (en) * 2003-07-25 2005-02-16 Nikon Corp Exposure apparatus
KR101218864B1 (ko) 2005-02-11 2013-01-07 칼 짜이스 에스엠테 게엠베하 광 리소그래피 렌즈 지지 장치용 진동 감쇄 장치
US7607543B2 (en) * 2005-02-27 2009-10-27 Entegris, Inc. Reticle pod with isolation system
US20070097340A1 (en) * 2005-10-31 2007-05-03 Nikon Corporation Active damper with counter mass to compensate for structural vibrations of a lithographic system
US7724351B2 (en) 2006-01-30 2010-05-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and exchangeable optical element
JP5036259B2 (ja) * 2006-09-14 2012-09-26 キヤノン株式会社 除振装置、露光装置及びデバイス製造方法
DE102006046200A1 (de) * 2006-09-29 2008-04-03 Carl Zeiss Smt Ag Verfahren und Vorrichtung zur Positionierung eines Elements in einem optischen System
DE102006050835A1 (de) 2006-10-27 2008-05-08 Carl Zeiss Smt Ag Verfahren und Vorrichtung zum Austausch von Objetkivteilen
US8044373B2 (en) * 2007-06-14 2011-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5641878B2 (ja) 2010-10-29 2014-12-17 キヤノン株式会社 振動制御装置、リソグラフィー装置、および、物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036162A (en) * 1996-09-10 2000-03-14 Nikon Corporation Vibration isolator and method of isolating vibration
DE10062786A1 (de) * 2000-12-15 2002-06-20 Zeiss Carl System zur Dämpfung von Schwingungen
DE10106605A1 (de) * 2001-02-13 2002-08-22 Zeiss Carl System zur Beseitigung oder wenigstens Dämpfung von Schwingungen
DE10229623A1 (de) * 2002-06-28 2004-01-15 Carl Zeiss Jena Gmbh Baugruppe mit einer äußeren Fassung und einem optischen Element
US20070024829A1 (en) * 2003-04-25 2007-02-01 Canon Kabushiki Kaisha Driving unit, exposure apparatus using the same, and device fabrication method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224743A1 (de) * 2015-12-09 2016-10-20 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem pseudoelastischen Dämpfungselement

Also Published As

Publication number Publication date
JP2012503305A (ja) 2012-02-02
US20110205507A1 (en) 2011-08-25
US8212992B2 (en) 2012-07-03
CN102159996A (zh) 2011-08-17
JP5214031B2 (ja) 2013-06-19
CN102159996B (zh) 2014-12-10
DE102008047562A1 (de) 2010-03-25
TWI610139B (zh) 2018-01-01
KR20110076929A (ko) 2011-07-06
TW201020692A (en) 2010-06-01
EP2326989A1 (en) 2011-06-01
EP2326989B1 (en) 2017-01-25
WO2010031754A1 (en) 2010-03-25
KR101608555B1 (ko) 2016-04-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: CARL ZEISS SMT GMBH, 73447 OBERKOCHEN, DE

R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20130209