JP5213400B2 - 配線基板、ピン付き配線基板及びそれらの製造方法 - Google Patents

配線基板、ピン付き配線基板及びそれらの製造方法 Download PDF

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Publication number
JP5213400B2
JP5213400B2 JP2007242392A JP2007242392A JP5213400B2 JP 5213400 B2 JP5213400 B2 JP 5213400B2 JP 2007242392 A JP2007242392 A JP 2007242392A JP 2007242392 A JP2007242392 A JP 2007242392A JP 5213400 B2 JP5213400 B2 JP 5213400B2
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Prior art keywords
wiring board
external terminal
plating
solder
wiring
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JP2007242392A
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Japanese (ja)
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JP2009076564A (ja
JP2009076564A5 (enExample
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泰志 横田
章夫 堀内
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2007242392A 2007-09-19 2007-09-19 配線基板、ピン付き配線基板及びそれらの製造方法 Active JP5213400B2 (ja)

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JP2007242392A JP5213400B2 (ja) 2007-09-19 2007-09-19 配線基板、ピン付き配線基板及びそれらの製造方法

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JP2007242392A JP5213400B2 (ja) 2007-09-19 2007-09-19 配線基板、ピン付き配線基板及びそれらの製造方法

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JP2009076564A JP2009076564A (ja) 2009-04-09
JP2009076564A5 JP2009076564A5 (enExample) 2010-09-16
JP5213400B2 true JP5213400B2 (ja) 2013-06-19

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7169793B2 (ja) * 2018-07-09 2022-11-11 日本特殊陶業株式会社 保持装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3526508B2 (ja) * 1997-02-25 2004-05-17 京セラ株式会社 半導体素子収納用パッケージ
JP2000232178A (ja) * 1999-02-09 2000-08-22 Sumitomo Metal Mining Co Ltd セラミックキャリアとその製造方法
JP3653222B2 (ja) * 2000-12-26 2005-05-25 シャープ株式会社 半導体装置の実装構造および半導体装置

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