JP5195051B2 - 紫外線照射装置 - Google Patents
紫外線照射装置 Download PDFInfo
- Publication number
- JP5195051B2 JP5195051B2 JP2008150748A JP2008150748A JP5195051B2 JP 5195051 B2 JP5195051 B2 JP 5195051B2 JP 2008150748 A JP2008150748 A JP 2008150748A JP 2008150748 A JP2008150748 A JP 2008150748A JP 5195051 B2 JP5195051 B2 JP 5195051B2
- Authority
- JP
- Japan
- Prior art keywords
- transformer
- excimer lamp
- ultraviolet irradiation
- transformers
- excimer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 title description 2
- 238000001816 cooling Methods 0.000 claims description 44
- 238000005192 partition Methods 0.000 claims description 38
- 238000007664 blowing Methods 0.000 claims description 18
- 239000002826 coolant Substances 0.000 claims description 7
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 18
- 230000032258 transport Effects 0.000 description 17
- 239000007789 gas Substances 0.000 description 15
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008150748A JP5195051B2 (ja) | 2008-06-09 | 2008-06-09 | 紫外線照射装置 |
TW098114431A TWI409848B (zh) | 2008-06-09 | 2009-04-30 | Ultraviolet radiation device |
KR1020090039843A KR101255408B1 (ko) | 2008-06-09 | 2009-05-07 | 자외선 조사 장치 |
CN2009101413532A CN101603640B (zh) | 2008-06-09 | 2009-06-02 | 紫外线照射装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008150748A JP5195051B2 (ja) | 2008-06-09 | 2008-06-09 | 紫外線照射装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009295923A JP2009295923A (ja) | 2009-12-17 |
JP5195051B2 true JP5195051B2 (ja) | 2013-05-08 |
Family
ID=41469482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008150748A Active JP5195051B2 (ja) | 2008-06-09 | 2008-06-09 | 紫外線照射装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5195051B2 (zh) |
KR (1) | KR101255408B1 (zh) |
CN (1) | CN101603640B (zh) |
TW (1) | TWI409848B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5651985B2 (ja) * | 2010-04-01 | 2015-01-14 | ウシオ電機株式会社 | 紫外線照射装置 |
CN103962346B (zh) * | 2014-05-21 | 2016-08-24 | 深圳市华星光电技术有限公司 | 可调整紫外光照射能量的紫外光清洗基板的方法 |
CN111359994B (zh) * | 2020-03-16 | 2021-06-01 | Tcl华星光电技术有限公司 | 清洗装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08146097A (ja) * | 1994-11-24 | 1996-06-07 | Advantest Corp | 半導体ic試験装置用一体型密閉筐体冷却装置 |
DE20114380U1 (de) * | 2001-08-31 | 2002-02-21 | Hoenle Ag Dr | UV-Bestrahlungsvorrichtung |
JP2003303694A (ja) * | 2002-04-08 | 2003-10-24 | Ushio Inc | エキシマ光照射装置 |
JP4260588B2 (ja) * | 2003-09-22 | 2009-04-30 | ウシオ電機株式会社 | 高電圧パルス発生装置並びに高電圧パルス発生装置を備えた放電励起ガスレーザ装置 |
JP4424296B2 (ja) * | 2005-10-13 | 2010-03-03 | ウシオ電機株式会社 | 紫外線照射装置 |
US20070295012A1 (en) * | 2006-06-26 | 2007-12-27 | Applied Materials, Inc. | Nitrogen enriched cooling air module for uv curing system |
JP5019156B2 (ja) * | 2006-08-21 | 2012-09-05 | ウシオ電機株式会社 | エキシマランプ装置 |
-
2008
- 2008-06-09 JP JP2008150748A patent/JP5195051B2/ja active Active
-
2009
- 2009-04-30 TW TW098114431A patent/TWI409848B/zh active
- 2009-05-07 KR KR1020090039843A patent/KR101255408B1/ko active IP Right Grant
- 2009-06-02 CN CN2009101413532A patent/CN101603640B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101603640B (zh) | 2013-05-08 |
JP2009295923A (ja) | 2009-12-17 |
CN101603640A (zh) | 2009-12-16 |
TWI409848B (zh) | 2013-09-21 |
TW201009888A (en) | 2010-03-01 |
KR101255408B1 (ko) | 2013-04-17 |
KR20090127804A (ko) | 2009-12-14 |
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