JP5194602B2 - 金属被覆ポリイミド基板の製造方法 - Google Patents

金属被覆ポリイミド基板の製造方法 Download PDF

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Publication number
JP5194602B2
JP5194602B2 JP2007189234A JP2007189234A JP5194602B2 JP 5194602 B2 JP5194602 B2 JP 5194602B2 JP 2007189234 A JP2007189234 A JP 2007189234A JP 2007189234 A JP2007189234 A JP 2007189234A JP 5194602 B2 JP5194602 B2 JP 5194602B2
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Prior art keywords
metal
film
plating
current density
polyimide substrate
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JP2007189234A
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Japanese (ja)
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JP2009026990A (ja
Inventor
啓一 大滝
宏 竹之内
修一 小笠原
雅男 浅田
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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Priority to JP2007189234A priority Critical patent/JP5194602B2/ja
Priority to KR1020080040196A priority patent/KR20090009692A/ko
Priority to CN2008100969448A priority patent/CN101350315B/zh
Priority to TW97118311A priority patent/TWI441569B/zh
Publication of JP2009026990A publication Critical patent/JP2009026990A/ja
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Publication of JP5194602B2 publication Critical patent/JP5194602B2/ja
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  • Electroplating Methods And Accessories (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
JP2007189234A 2007-07-20 2007-07-20 金属被覆ポリイミド基板の製造方法 Active JP5194602B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007189234A JP5194602B2 (ja) 2007-07-20 2007-07-20 金属被覆ポリイミド基板の製造方法
KR1020080040196A KR20090009692A (ko) 2007-07-20 2008-04-30 금속 피복 폴리이미드 기판의 제조 방법
CN2008100969448A CN101350315B (zh) 2007-07-20 2008-05-12 覆金属聚酰亚胺基板的制造方法
TW97118311A TWI441569B (zh) 2007-07-20 2008-05-19 金屬被覆聚醯亞胺基板之製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007189234A JP5194602B2 (ja) 2007-07-20 2007-07-20 金属被覆ポリイミド基板の製造方法

Publications (2)

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JP2009026990A JP2009026990A (ja) 2009-02-05
JP5194602B2 true JP5194602B2 (ja) 2013-05-08

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JP2007189234A Active JP5194602B2 (ja) 2007-07-20 2007-07-20 金属被覆ポリイミド基板の製造方法

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JP (1) JP5194602B2 (zh)
KR (1) KR20090009692A (zh)
CN (1) CN101350315B (zh)
TW (1) TWI441569B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5146397B2 (ja) * 2009-04-21 2013-02-20 住友金属鉱山株式会社 ２層フレキシブル基板およびその製造方法
CN102021576B (zh) 2010-09-30 2012-06-27 深圳市信诺泰创业投资企业(普通合伙) 一种连续生产挠性覆铜板的方法
CN102477549B (zh) * 2010-11-25 2014-04-16 中国电子科技集团公司第十八研究所 一种柔性衬底上沉积半导体薄膜的方法
CN102477550B (zh) * 2010-11-25 2014-04-16 中国电子科技集团公司第十八研究所 在柔性衬底上沉积半导体薄膜用装置
JP5858286B2 (ja) * 2012-01-11 2016-02-10 住友金属鉱山株式会社 長尺導電性基板の電解めっき方法および銅張積層板の製造方法
JP6083433B2 (ja) * 2012-04-24 2017-02-22 住友金属鉱山株式会社 ２層フレキシブル配線用基板及びフレキシブル配線板並びにそれらの製造方法
CN104216149B (zh) * 2014-09-30 2017-03-22 南京中电熊猫液晶显示科技有限公司 一种具有修补线结构的液晶显示面板
CN107636209B (zh) * 2015-06-26 2021-07-02 住友金属矿山股份有限公司 导电性基板
JP6880723B2 (ja) 2016-12-27 2021-06-02 住友金属鉱山株式会社 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法
JP7273361B2 (ja) * 2019-02-28 2023-05-15 住友金属鉱山株式会社 フレキシブル基板の製造方法
CN114449772A (zh) * 2020-10-30 2022-05-06 昆山东威科技股份有限公司 一种覆金属导电层的板的制备方法及生产系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293200A (ja) * 1987-05-27 1988-11-30 Nkk Corp 電気メッキ装置
JPH0722473A (ja) * 1993-06-30 1995-01-24 Sumitomo Metal Mining Co Ltd 連続めっき方法
US6440576B1 (en) * 1999-02-03 2002-08-27 Ube Industries, Ltd. Metal plated aromatic polyimide film
JP2004006735A (ja) * 2002-03-22 2004-01-08 Ube Ind Ltd 半導体パッケ−ジ内部絶縁用ポリイミドフィルムおよび積層基板
CN1276167C (zh) * 2002-07-26 2006-09-20 盘锦纵横声光电子技术有限责任公司 光缆传输信号的多频率声学探头组合检测方法及下井仪器
JP4929596B2 (ja) * 2005-01-18 2012-05-09 東洋紡績株式会社 ポリイミドフィルムとその製造方法

Also Published As

Publication number Publication date
CN101350315B (zh) 2011-03-30
KR20090009692A (ko) 2009-01-23
JP2009026990A (ja) 2009-02-05
TWI441569B (zh) 2014-06-11
CN101350315A (zh) 2009-01-21
TW200908818A (en) 2009-02-16

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