JP5188671B2 - メモリセルのしきい値電圧を調節する方法 - Google Patents
メモリセルのしきい値電圧を調節する方法 Download PDFInfo
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- JP5188671B2 JP5188671B2 JP2004124675A JP2004124675A JP5188671B2 JP 5188671 B2 JP5188671 B2 JP 5188671B2 JP 2004124675 A JP2004124675 A JP 2004124675A JP 2004124675 A JP2004124675 A JP 2004124675A JP 5188671 B2 JP5188671 B2 JP 5188671B2
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- Japan
- Prior art keywords
- pulse
- applying
- threshold voltage
- chalcogenide
- vth
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 30
- 150000004770 chalcogenides Chemical class 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 38
- 239000012528 membrane Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 7
- 238000012827 research and development Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000009849 deactivation Effects 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052699 polonium Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/041—Modification of switching materials after formation, e.g. doping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Description
Claims (16)
- しきい値電圧を変化させることのできるカルコゲン化物材料から構成された膜に、所定の強さと所定の波形を有するパルスの形式のエネルギを所定の期間付与して、前記膜のしきい値電圧が、前記付与されたパルスの強さが増大するに従って増大するように前記膜のしきい値電圧を調整するメモリセルのしきい値電圧を調節する方法。
- 前記エネルギを付与することが、膜に電気パルスを印加することを備えている、請求項1に記載の方法。
- 前記電気パルスが電圧パルスである請求項2に記載の方法。
- 前記電気パルスが電流パルスである請求項2に記載の方法。
- 前記エネルギを付与することが、膜に光パルスを印加することを備えている、請求項1に記載の方法。
- 前記光パルスがレーザパルスである請求項5に記載の方法。
- 前記エネルギを付与することが、膜に熱パルスを印加することを備えている、請求項1に記載の方法。
- 前記エネルギを付与することが、膜にマイクロ波のパルスを印加することを備えている、請求項1に記載の方法。
- カルコゲン化物材料に、所定の強さと所定の波形を有するパルスの形式のエネルギを所定の期間付与して、前記カルコゲン化物材料のしきい値電圧が、前記付与されたパルスの強さが増大するに従って増大するように前記カルコゲン化物材料のしきい値電圧を調整する、カルコゲン化物材料のしきい値電圧を調節する方法。
- 前記エネルギを付与することが、カルコゲン化物材料に電気パルスを印加することを備えている、請求項9に記載の方法。
- 前記電気パルスが電圧パルスである請求項10に記載の方法。
- 前記電気パルスが電流パルスである請求項10に記載の方法。
- 前記エネルギを付与することが、カルコゲン化物材料に光パルスを印加することを備えている、請求項9に記載の方法。
- 前記光パルスがレーザパルスである請求項13に記載の方法。
- 前記エネルギを付与することが、カルコゲン化物材料に熱パルスを印加することを備えている、請求項9に記載の方法。
- 前記エネルギを付与することが、カルコゲン化物材料にマイクロ波のパルスを印加することを備えている、請求項9に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/465,120 | 2003-06-18 | ||
US10/465,120 US20040257848A1 (en) | 2003-06-18 | 2003-06-18 | Method for adjusting the threshold voltage of a memory cell |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005012183A JP2005012183A (ja) | 2005-01-13 |
JP5188671B2 true JP5188671B2 (ja) | 2013-04-24 |
Family
ID=33418185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004124675A Expired - Lifetime JP5188671B2 (ja) | 2003-06-18 | 2004-04-20 | メモリセルのしきい値電圧を調節する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040257848A1 (ja) |
EP (1) | EP1489670B1 (ja) |
JP (1) | JP5188671B2 (ja) |
CN (1) | CN100505362C (ja) |
DE (1) | DE60318692T2 (ja) |
TW (1) | TW594940B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7323707B2 (en) * | 2004-06-30 | 2008-01-29 | Intel Corporation | Initializing phase change memories |
US7626859B2 (en) * | 2006-02-16 | 2009-12-01 | Samsung Electronics Co., Ltd. | Phase-change random access memory and programming method |
US7990761B2 (en) * | 2008-03-31 | 2011-08-02 | Ovonyx, Inc. | Immunity of phase change material to disturb in the amorphous phase |
US20100090189A1 (en) * | 2008-09-15 | 2010-04-15 | Savransky Semyon D | Nanoscale electrical device |
US8605495B2 (en) | 2011-05-09 | 2013-12-10 | Macronix International Co., Ltd. | Isolation device free memory |
US20150380063A1 (en) * | 2014-06-29 | 2015-12-31 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and methods of use |
GB2532086A (en) * | 2014-11-10 | 2016-05-11 | Provost Fellows Found Scholars & Other Members Board College Holy & Und | An associative memory learning device |
US10546632B2 (en) * | 2017-12-14 | 2020-01-28 | Micron Technology, Inc. | Multi-level self-selecting memory device |
US11587612B2 (en) * | 2019-07-03 | 2023-02-21 | Micron Technology, Inc. | Neural network memory with an array of variable resistance memory cells |
FR3102884B1 (fr) | 2019-11-04 | 2021-11-12 | Commissariat Energie Atomique | Dispositif memoire non volatile selecteur et procede de lecture associe |
Family Cites Families (21)
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US3530441A (en) * | 1969-01-15 | 1970-09-22 | Energy Conversion Devices Inc | Method and apparatus for storing and retrieving information |
US3801966A (en) * | 1971-08-18 | 1974-04-02 | Hitachi Ltd | Optical memory device |
US4115872A (en) * | 1977-05-31 | 1978-09-19 | Burroughs Corporation | Amorphous semiconductor memory device for employment in an electrically alterable read-only memory |
US4180866A (en) * | 1977-08-01 | 1979-12-25 | Burroughs Corporation | Single transistor memory cell employing an amorphous semiconductor threshold device |
US4199692A (en) * | 1978-05-16 | 1980-04-22 | Harris Corporation | Amorphous non-volatile ram |
US4845533A (en) * | 1986-08-22 | 1989-07-04 | Energy Conversion Devices, Inc. | Thin film electrical devices with amorphous carbon electrodes and method of making same |
US4804490A (en) * | 1987-10-13 | 1989-02-14 | Energy Conversion Devices, Inc. | Method of fabricating stabilized threshold switching material |
JP2794974B2 (ja) * | 1991-04-10 | 1998-09-10 | 日本電気株式会社 | 不揮発性半導体記憶装置の起動方法 |
JPH06232271A (ja) * | 1993-01-29 | 1994-08-19 | Nippon Telegr & Teleph Corp <Ntt> | 結線材料及び入出力制御方法 |
US5714768A (en) * | 1995-10-24 | 1998-02-03 | Energy Conversion Devices, Inc. | Second-layer phase change memory array on top of a logic device |
JP3584607B2 (ja) * | 1996-05-10 | 2004-11-04 | ソニー株式会社 | 不揮発性記憶装置 |
US6141241A (en) * | 1998-06-23 | 2000-10-31 | Energy Conversion Devices, Inc. | Universal memory element with systems employing same and apparatus and method for reading, writing and programming same |
US6507552B2 (en) * | 2000-12-01 | 2003-01-14 | Hewlett-Packard Company | AFM version of diode-and cathodoconductivity-and cathodoluminescence-based data storage media |
JP2002246561A (ja) * | 2001-02-19 | 2002-08-30 | Dainippon Printing Co Ltd | 記憶セル、この記録セルを用いたメモリマトリックス及びこれらの製造方法 |
JP3999549B2 (ja) * | 2002-04-01 | 2007-10-31 | 株式会社リコー | 相変化材料素子および半導体メモリ |
US6671710B2 (en) * | 2002-05-10 | 2003-12-30 | Energy Conversion Devices, Inc. | Methods of computing with digital multistate phase change materials |
US6768665B2 (en) * | 2002-08-05 | 2004-07-27 | Intel Corporation | Refreshing memory cells of a phase change material memory device |
US6967344B2 (en) * | 2003-03-10 | 2005-11-22 | Energy Conversion Devices, Inc. | Multi-terminal chalcogenide switching devices |
DE102004016408B4 (de) * | 2003-03-27 | 2008-08-07 | Samsung Electronics Co., Ltd., Suwon | Phasenwechselspeicherbaustein und zugehöriges Programmierverfahren |
KR100498493B1 (ko) * | 2003-04-04 | 2005-07-01 | 삼성전자주식회사 | 저전류 고속 상변화 메모리 및 그 구동 방식 |
US6819469B1 (en) * | 2003-05-05 | 2004-11-16 | Igor M. Koba | High-resolution spatial light modulator for 3-dimensional holographic display |
-
2003
- 2003-06-18 US US10/465,120 patent/US20040257848A1/en not_active Abandoned
- 2003-10-30 TW TW092130179A patent/TW594940B/zh not_active IP Right Cessation
- 2003-11-19 EP EP03026608A patent/EP1489670B1/en not_active Expired - Fee Related
- 2003-11-19 DE DE60318692T patent/DE60318692T2/de not_active Expired - Lifetime
- 2003-11-24 CN CNB2003101152412A patent/CN100505362C/zh not_active Expired - Fee Related
-
2004
- 2004-04-20 JP JP2004124675A patent/JP5188671B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005012183A (ja) | 2005-01-13 |
EP1489670B1 (en) | 2008-01-16 |
DE60318692T2 (de) | 2009-01-22 |
CN1574409A (zh) | 2005-02-02 |
CN100505362C (zh) | 2009-06-24 |
TW594940B (en) | 2004-06-21 |
EP1489670A1 (en) | 2004-12-22 |
DE60318692D1 (de) | 2008-03-06 |
US20040257848A1 (en) | 2004-12-23 |
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