JP5188094B2 - 駆動装置、露光装置及びデバイス製造方法 - Google Patents
駆動装置、露光装置及びデバイス製造方法 Download PDFInfo
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- JP5188094B2 JP5188094B2 JP2007112292A JP2007112292A JP5188094B2 JP 5188094 B2 JP5188094 B2 JP 5188094B2 JP 2007112292 A JP2007112292 A JP 2007112292A JP 2007112292 A JP2007112292 A JP 2007112292A JP 5188094 B2 JP5188094 B2 JP 5188094B2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
- H02N2/0075—Electrical details, e.g. drive or control circuits or methods
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0095—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing combined linear and rotary motion, e.g. multi-direction positioners
Description
電圧制御部345は、本実施形態では、位置制御部341から入力される複数の圧電素子310a乃至310cにそれぞれ電圧を印加するための入力信号を制限する。例えば、電圧制御部345は、演算部344で算出された電位差と予め記憶していた電位差とを比較し、電圧検出部342によって検出される複数の圧電素子310a乃至310cの間の電位差が予め記憶していた電位差となる(所定値を超えない)ようにする。具体的には、電圧制御部345は、演算部344から入力される電位差に基づいて、かかる電位差が所定値を超えないように、位置制御部341から入力される複数の圧電素子310a乃至310cにそれぞれ電圧を印加するための入力信号を制限する。その結果、複数の電圧印加部320a乃至320cによって複数の圧電素子310a乃至310cのそれぞれに印加される電圧(即ち、電圧印加部320a乃至320cの出力電圧)が制限される。
10 セル
20 保持部
30 駆動部
310a乃至310c 圧電素子
312a乃至312c 第1端子
314a乃至314c 第2端子
320a乃至320c 電圧印加部
330 制御部
331a乃至331c ダイオード
332a乃至332c ダイオード
333 ツェナーダイオード
330A 制御部
334a、334b及び338 抵抗器
335及び337 トランジスタ
336 ツェナーダイオード
330B 制御部
341 位置制御部
342 電圧検出部
343 A/D変換器
344 演算部
345 電圧制御部
346 D/A変換器
40 変位センサ
40x、40y及び40z センサ
OE 光学素子
FN 第1ノード
SN 第2ノード
600 露光装置
610 照明装置
612 光源部
614 照明光学系
620 レチクル
625 レチクルステージ
630 投影光学系
640 ウエハ
645 ウエハステージ
Claims (3)
- 物体を駆動する駆動装置であって、
前記物体の2つの部分をそれぞれ駆動する2つの圧電素子と、
前記2つの圧電素子のそれぞれに電流を流して電圧を印加する2つの電圧印加部と、
前記2つの圧電素子にそれぞれ印加される電圧の差が所定値を超えた場合に、前記2つの電圧印加部のうち高い電圧を印加する電圧印加部から前記2つの圧電素子のうち低い電圧が印加される圧電素子に電流を流して、前記2つの圧電素子にそれぞれ印加される電圧の差の増大を制限する制御部とを有し、
前記2つの圧電素子は、それぞれ第1端子と、第2端子とを有し、
前記2つの電圧印加部は、それぞれ前記2つの圧電素子の前記第1端子と前記第2端子との間に電圧を印加し、
前記制御部は、
第1ノードと前記2つの圧電素子の前記第1端子のそれぞれとの間に、前記第1端子側にアノードが向くように配置された2つの第1ダイオードと、
第2ノードと前記2つの圧電素子の前記第1端子のそれぞれとの間に、前記第1端子側にカソードが向くように配置された2つの第2ダイオードと、
前記第1ノードと前記第2ノードとの間に、第2ノード側にアノードが向くように配置されたツェナーダイオードとを含むことを特徴とする駆動装置。 - 請求項1記載の駆動装置と、
前記駆動装置に駆動される光学素子を介して、レチクルのパターンを基板に露光する光学系とを有することを特徴とする露光装置。 - 請求項2記載の露光装置を用いて基板を露光するステップと、
露光された前記基板を現像するステップとを有することを特徴とするデバイス製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007112292A JP5188094B2 (ja) | 2007-04-20 | 2007-04-20 | 駆動装置、露光装置及びデバイス製造方法 |
US12/100,044 US8080917B2 (en) | 2007-04-20 | 2008-04-09 | Driving apparatus, holding apparatus, exposure apparatus, and device fabrication method |
TW097113826A TWI385710B (zh) | 2007-04-20 | 2008-04-16 | 驅動設備、保持設備、曝光設備、及半導體裝置製造方法 |
KR1020080035870A KR101078465B1 (ko) | 2007-04-20 | 2008-04-18 | 구동장치, 유지 장치, 노광 장치 및 디바이스 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007112292A JP5188094B2 (ja) | 2007-04-20 | 2007-04-20 | 駆動装置、露光装置及びデバイス製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012116889A Division JP5335965B2 (ja) | 2012-05-22 | 2012-05-22 | 駆動装置、露光装置及びデバイス製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008271717A JP2008271717A (ja) | 2008-11-06 |
JP2008271717A5 JP2008271717A5 (ja) | 2010-06-03 |
JP5188094B2 true JP5188094B2 (ja) | 2013-04-24 |
Family
ID=40050514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007112292A Expired - Fee Related JP5188094B2 (ja) | 2007-04-20 | 2007-04-20 | 駆動装置、露光装置及びデバイス製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8080917B2 (ja) |
JP (1) | JP5188094B2 (ja) |
KR (1) | KR101078465B1 (ja) |
TW (1) | TWI385710B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113841090A (zh) * | 2019-05-20 | 2021-12-24 | Asml荷兰有限公司 | 包括压电致动器或电致伸缩致动器的致动器组件 |
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-
2007
- 2007-04-20 JP JP2007112292A patent/JP5188094B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-09 US US12/100,044 patent/US8080917B2/en not_active Expired - Fee Related
- 2008-04-16 TW TW097113826A patent/TWI385710B/zh not_active IP Right Cessation
- 2008-04-18 KR KR1020080035870A patent/KR101078465B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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US8080917B2 (en) | 2011-12-20 |
TWI385710B (zh) | 2013-02-11 |
TW200903586A (en) | 2009-01-16 |
KR101078465B1 (ko) | 2011-10-31 |
JP2008271717A (ja) | 2008-11-06 |
US20090001851A1 (en) | 2009-01-01 |
KR20080094595A (ko) | 2008-10-23 |
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