JP5164833B2 - 印刷可能な半導体構造の製造方法 - Google Patents

印刷可能な半導体構造の製造方法 Download PDF

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JP5164833B2
JP5164833B2 JP2008514820A JP2008514820A JP5164833B2 JP 5164833 B2 JP5164833 B2 JP 5164833B2 JP 2008514820 A JP2008514820 A JP 2008514820A JP 2008514820 A JP2008514820 A JP 2008514820A JP 5164833 B2 JP5164833 B2 JP 5164833B2
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printable semiconductor
semiconductor element
silicon wafer
wafer
etching
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JP2009508322A5 (enExample
JP2009508322A (ja
Inventor
ラルフ ジー． ヌゾー，
ジョン エー． ロジャース，
エティエンヌ メナード，
ケオン ジャエ リー，
ダール−ヤン カン，
ユーガン サン，
マシュー メイトル，
ツェンタオ ツ，
フエン チョー コー，
シャウン マック，
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ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ
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Priority claimed from US11/145,542 external-priority patent/US7557367B2/en
Application filed by ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ filed Critical ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ
Priority claimed from PCT/US2006/021161 external-priority patent/WO2006130721A2/en
Publication of JP2009508322A publication Critical patent/JP2009508322A/ja
Publication of JP2009508322A5 publication Critical patent/JP2009508322A5/ja
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Recrystallisation Techniques (AREA)
JP2008514820A 2005-06-02 2006-06-01 印刷可能な半導体構造の製造方法 Active JP5164833B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US11/145,574 2005-06-02
US11/145,542 US7557367B2 (en) 2004-06-04 2005-06-02 Stretchable semiconductor elements and stretchable electrical circuits
PCT/US2005/019354 WO2005122285A2 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,574 US7622367B1 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,542 2005-06-02
USPCT/US2005/019354 2005-06-02
PCT/US2006/021161 WO2006130721A2 (en) 2005-06-02 2006-06-01 Printable semiconductor structures and related methods of making and assembling

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JP2012246602A Division JP5734261B2 (ja) 2005-06-02 2012-11-08 印刷可能な半導体構造、並びに関連する製造方法及び組立方法

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JP2009508322A JP2009508322A (ja) 2009-02-26
JP2009508322A5 JP2009508322A5 (enExample) 2012-05-10
JP5164833B2 true JP5164833B2 (ja) 2013-03-21

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JP2008514820A Active JP5164833B2 (ja) 2005-06-02 2006-06-01 印刷可能な半導体構造の製造方法
JP2006154975A Active JP5297581B2 (ja) 2005-06-02 2006-06-02 エラストマースタンプへの接着の動的コントロールによるパターン転送印刷
JP2012246602A Active JP5734261B2 (ja) 2005-06-02 2012-11-08 印刷可能な半導体構造、並びに関連する製造方法及び組立方法
JP2013095896A Active JP5701331B2 (ja) 2005-06-02 2013-04-30 エラストマースタンプへの接着の動的コントロールによるパターン転送印刷
JP2014177486A Active JP6002725B2 (ja) 2005-06-02 2014-09-01 印刷可能な半導体構造、並びに関連する製造方法及び組立方法

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JP2006154975A Active JP5297581B2 (ja) 2005-06-02 2006-06-02 エラストマースタンプへの接着の動的コントロールによるパターン転送印刷
JP2012246602A Active JP5734261B2 (ja) 2005-06-02 2012-11-08 印刷可能な半導体構造、並びに関連する製造方法及び組立方法
JP2013095896A Active JP5701331B2 (ja) 2005-06-02 2013-04-30 エラストマースタンプへの接着の動的コントロールによるパターン転送印刷
JP2014177486A Active JP6002725B2 (ja) 2005-06-02 2014-09-01 印刷可能な半導体構造、並びに関連する製造方法及び組立方法

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EP (2) EP4040474A1 (enExample)
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JP2016521457A (ja) * 2013-04-18 2016-07-21 フォルシュングスツェントルム・ユーリッヒ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 改善された導電率を有する高周波数導電体

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