JP5156192B2 - 極端紫外光源装置 - Google Patents
極端紫外光源装置 Download PDFInfo
- Publication number
- JP5156192B2 JP5156192B2 JP2006015410A JP2006015410A JP5156192B2 JP 5156192 B2 JP5156192 B2 JP 5156192B2 JP 2006015410 A JP2006015410 A JP 2006015410A JP 2006015410 A JP2006015410 A JP 2006015410A JP 5156192 B2 JP5156192 B2 JP 5156192B2
- Authority
- JP
- Japan
- Prior art keywords
- droplet
- light source
- target material
- chamber
- droplets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000903 blocking effect Effects 0.000 claims abstract description 140
- 239000013077 target material Substances 0.000 claims abstract description 71
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 60
- 238000010586 diagram Methods 0.000 description 44
- 238000000034 method Methods 0.000 description 16
- 239000011135 tin Substances 0.000 description 14
- 230000003749 cleanliness Effects 0.000 description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 12
- 238000000889 atomisation Methods 0.000 description 12
- 238000011084 recovery Methods 0.000 description 12
- 229910052718 tin Inorganic materials 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 6
- 229910052744 lithium Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 229910001111 Fine metal Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- 230000010287 polarization Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910052724 xenon Inorganic materials 0.000 description 5
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 239000013076 target substance Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000005469 synchrotron radiation Effects 0.000 description 2
- 230000005457 Black-body radiation Effects 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/002—Supply of the plasma generating material
- H05G2/0027—Arrangements for controlling the supply; Arrangements for measurements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- X-Ray Techniques (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006015410A JP5156192B2 (ja) | 2006-01-24 | 2006-01-24 | 極端紫外光源装置 |
| US11/655,109 US7608846B2 (en) | 2006-01-24 | 2007-01-19 | Extreme ultra violet light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006015410A JP5156192B2 (ja) | 2006-01-24 | 2006-01-24 | 極端紫外光源装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012094542A Division JP5563012B2 (ja) | 2012-04-18 | 2012-04-18 | 極端紫外光源装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007200615A JP2007200615A (ja) | 2007-08-09 |
| JP2007200615A5 JP2007200615A5 (enExample) | 2008-12-04 |
| JP5156192B2 true JP5156192B2 (ja) | 2013-03-06 |
Family
ID=38284625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006015410A Expired - Fee Related JP5156192B2 (ja) | 2006-01-24 | 2006-01-24 | 極端紫外光源装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7608846B2 (enExample) |
| JP (1) | JP5156192B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9699877B2 (en) | 2013-11-07 | 2017-07-04 | Gigaphoton Inc. | Extreme ultraviolet light generation apparatus including target droplet joining apparatus |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7897947B2 (en) * | 2007-07-13 | 2011-03-01 | Cymer, Inc. | Laser produced plasma EUV light source having a droplet stream produced using a modulated disturbance wave |
| US8653437B2 (en) * | 2010-10-04 | 2014-02-18 | Cymer, Llc | EUV light source with subsystem(s) for maintaining LPP drive laser output during EUV non-output periods |
| EP1837897A4 (en) * | 2005-01-12 | 2008-04-16 | Nikon Corp | LASER PLASMA EUV LIGHT SOURCE, TARGET MEMBER, MANUFACTURING PROCESS FOR A TARGET MEMBER, TARGET PROCESSING METHOD AND EUV EXPOSURE SYSTEM |
| US8158960B2 (en) * | 2007-07-13 | 2012-04-17 | Cymer, Inc. | Laser produced plasma EUV light source |
| JP5076087B2 (ja) * | 2006-10-19 | 2012-11-21 | ギガフォトン株式会社 | 極端紫外光源装置及びノズル保護装置 |
| US8748785B2 (en) * | 2007-01-18 | 2014-06-10 | Amastan Llc | Microwave plasma apparatus and method for materials processing |
| JP5358060B2 (ja) * | 2007-02-20 | 2013-12-04 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP2009099390A (ja) * | 2007-10-17 | 2009-05-07 | Tokyo Institute Of Technology | 極端紫外光光源装置および極端紫外光発生方法 |
| JP5280066B2 (ja) | 2008-02-28 | 2013-09-04 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP2010062141A (ja) | 2008-08-04 | 2010-03-18 | Komatsu Ltd | 極端紫外光源装置 |
| EP2157481A3 (en) * | 2008-08-14 | 2012-06-13 | ASML Netherlands B.V. | Radiation source, lithographic apparatus, and device manufacturing method |
| JP5362515B2 (ja) * | 2008-10-17 | 2013-12-11 | ギガフォトン株式会社 | 極端紫外光源装置のターゲット供給装置及びその製造方法 |
| JP5486797B2 (ja) * | 2008-12-22 | 2014-05-07 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP5455661B2 (ja) * | 2009-01-29 | 2014-03-26 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP5619779B2 (ja) * | 2009-02-13 | 2014-11-05 | ケーエルエー−テンカー コーポレイション | 高温プラズマを持続させるための光ポンピング |
| US8138487B2 (en) * | 2009-04-09 | 2012-03-20 | Cymer, Inc. | System, method and apparatus for droplet catcher for prevention of backsplash in a EUV generation chamber |
| JP5603135B2 (ja) * | 2009-05-21 | 2014-10-08 | ギガフォトン株式会社 | チャンバ装置におけるターゲット軌道を計測及び制御する装置及び方法 |
| JPWO2010137625A1 (ja) * | 2009-05-27 | 2012-11-15 | ギガフォトン株式会社 | ターゲット出力装置及び極端紫外光源装置 |
| WO2011013779A1 (ja) * | 2009-07-29 | 2011-02-03 | 株式会社小松製作所 | 極端紫外光源装置、極端紫外光源装置の制御方法、およびそのプログラムを記録した記録媒体 |
| WO2011116898A1 (en) * | 2010-03-25 | 2011-09-29 | Eth Zurich | Steering device for controlling the direction and/or velocity of droplets of a target material and extreme euv source with such a steering device |
| US8368039B2 (en) * | 2010-04-05 | 2013-02-05 | Cymer, Inc. | EUV light source glint reduction system |
| US8263953B2 (en) * | 2010-04-09 | 2012-09-11 | Cymer, Inc. | Systems and methods for target material delivery protection in a laser produced plasma EUV light source |
| JP5726587B2 (ja) * | 2010-10-06 | 2015-06-03 | ギガフォトン株式会社 | チャンバ装置 |
| JP2012119098A (ja) * | 2010-11-29 | 2012-06-21 | Gigaphoton Inc | 光学装置、レーザ装置および極端紫外光生成装置 |
| JP2013065804A (ja) * | 2010-12-20 | 2013-04-11 | Gigaphoton Inc | レーザ装置およびそれを備える極端紫外光生成システム |
| JP5745964B2 (ja) * | 2011-07-22 | 2015-07-08 | ラピスセミコンダクタ株式会社 | 半導体装置の製造方法及び半導体製造装置 |
| WO2013023710A1 (en) * | 2011-08-12 | 2013-02-21 | Asml Netherlands B.V. | Radiation source |
| JP5901210B2 (ja) * | 2011-10-06 | 2016-04-06 | 浜松ホトニクス株式会社 | 放射線発生装置及び放射線発生方法 |
| JP5946649B2 (ja) | 2012-02-14 | 2016-07-06 | ギガフォトン株式会社 | ターゲット供給装置 |
| WO2013131706A1 (en) * | 2012-03-07 | 2013-09-12 | Asml Netherlands B.V. | Radiation source and lithographic apparatus |
| US10477665B2 (en) * | 2012-04-13 | 2019-11-12 | Amastan Technologies Inc. | Microwave plasma torch generating laminar flow for materials processing |
| JP6099241B2 (ja) * | 2012-06-28 | 2017-03-22 | ギガフォトン株式会社 | ターゲット供給装置 |
| WO2014019803A1 (en) * | 2012-08-01 | 2014-02-06 | Asml Netherlands B.V. | Method and apparatus for generating radiation |
| KR20140036538A (ko) * | 2012-09-17 | 2014-03-26 | 삼성전자주식회사 | 극자외선 생성 장치, 이를 포함하는 노광 장치 및 이러한 노광 장치를 사용해서 제조된 전자 디바이스 |
| JP6010438B2 (ja) * | 2012-11-27 | 2016-10-19 | 浜松ホトニクス株式会社 | 量子ビーム生成装置、量子ビーム生成方法、及び、レーザ核融合装置 |
| US8872143B2 (en) | 2013-03-14 | 2014-10-28 | Asml Netherlands B.V. | Target for laser produced plasma extreme ultraviolet light source |
| US8791440B1 (en) * | 2013-03-14 | 2014-07-29 | Asml Netherlands B.V. | Target for extreme ultraviolet light source |
| US8680495B1 (en) * | 2013-03-15 | 2014-03-25 | Cymer, Llc | Extreme ultraviolet light source |
| KR102257748B1 (ko) * | 2013-04-05 | 2021-05-28 | 에이에스엠엘 네델란즈 비.브이. | 소스 콜렉터 장치, 리소그래피 장치 및 방법 |
| KR102115543B1 (ko) * | 2013-04-26 | 2020-05-26 | 삼성전자주식회사 | 극자외선 광원 장치 |
| WO2014203804A1 (ja) * | 2013-06-20 | 2014-12-24 | ギガフォトン株式会社 | 極端紫外光生成システム |
| ES2431266B1 (es) * | 2013-07-31 | 2014-09-15 | Universidad De Málaga | Procedimiento y dispositivo para la producción de nanopartículas mediante irradiación láser de precursores líquidos de tamaño microscópico |
| US8901523B1 (en) * | 2013-09-04 | 2014-12-02 | Asml Netherlands B.V. | Apparatus for protecting EUV optical elements |
| US9338870B2 (en) | 2013-12-30 | 2016-05-10 | Asml Netherlands B.V. | Extreme ultraviolet light source |
| WO2015139900A1 (en) * | 2014-03-18 | 2015-09-24 | Asml Netherlands B.V. | Fuel stream generator |
| US9357625B2 (en) | 2014-07-07 | 2016-05-31 | Asml Netherlands B.V. | Extreme ultraviolet light source |
| KR102336300B1 (ko) | 2014-11-17 | 2021-12-07 | 삼성전자주식회사 | 극자외선 광원 장치 및 극자외선 광 발생 방법 |
| KR102269695B1 (ko) | 2015-03-19 | 2021-06-25 | 삼성전자주식회사 | 극자외선 광 생성 장치 |
| JP6541785B2 (ja) * | 2015-07-30 | 2019-07-10 | ギガフォトン株式会社 | 極端紫外光生成装置 |
| US9426872B1 (en) * | 2015-08-12 | 2016-08-23 | Asml Netherlands B.V. | System and method for controlling source laser firing in an LPP EUV light source |
| US9832854B2 (en) * | 2015-08-12 | 2017-11-28 | Asml Netherlands B.V. | Systems and methods for stabilization of droplet-plasma interaction via laser energy modulation |
| US11550233B2 (en) | 2018-08-14 | 2023-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography system and operation method thereof |
| NL2023879A (en) * | 2018-09-26 | 2020-05-01 | Asml Netherlands Bv | Apparatus for and method of controlling introduction of euv target material into an euv chamber |
| CN112684676B (zh) * | 2020-12-30 | 2022-04-26 | 广东省智能机器人研究院 | 极紫外光产生方法和装置 |
| JP7731247B2 (ja) * | 2021-09-08 | 2025-08-29 | ギガフォトン株式会社 | 極端紫外光生成装置、及び電子デバイスの製造方法 |
| KR102895880B1 (ko) * | 2021-09-10 | 2025-12-03 | 경희대학교 산학협력단 | 전자빔 및 액적 기반 극자외선 광원 장치 |
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| JPS61153935A (ja) * | 1984-12-26 | 1986-07-12 | Toshiba Corp | プラズマx線発生装置 |
| US4969169A (en) * | 1986-04-15 | 1990-11-06 | Hampshire Instruments, Inc. | X-ray lithography system |
| GB2195070B (en) * | 1986-09-11 | 1991-04-03 | Hoya Corp | Laser plasma x-ray generator capable of continuously generating x-rays |
| JPH01109646A (ja) * | 1987-10-22 | 1989-04-26 | Fujitsu Ltd | レーザプラズマx線源 |
| US6831963B2 (en) * | 2000-10-20 | 2004-12-14 | University Of Central Florida | EUV, XUV, and X-Ray wavelength sources created from laser plasma produced from liquid metal solutions |
| US6304630B1 (en) | 1999-12-24 | 2001-10-16 | U.S. Philips Corporation | Method of generating EUV radiation, method of manufacturing a device by means of said radiation, EUV radiation source unit, and lithographic projection apparatus provided with such a radiation source unit |
| US6724608B2 (en) * | 2000-01-14 | 2004-04-20 | Paul Hensley | Method for plasma charging a probe |
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| US6855943B2 (en) | 2002-05-28 | 2005-02-15 | Northrop Grumman Corporation | Droplet target delivery method for high pulse-rate laser-plasma extreme ultraviolet light source |
| US6792076B2 (en) * | 2002-05-28 | 2004-09-14 | Northrop Grumman Corporation | Target steering system for EUV droplet generators |
| JP2004047517A (ja) * | 2002-07-08 | 2004-02-12 | Canon Inc | 放射線生成装置、放射線生成方法、露光装置並びに露光方法 |
| CN100391316C (zh) * | 2003-03-18 | 2008-05-28 | 皇家飞利浦电子股份有限公司 | 借助于等离子体产生远紫外线和/或软x射线辐射的装置和方法 |
| JP4264505B2 (ja) * | 2003-03-24 | 2009-05-20 | 独立行政法人産業技術総合研究所 | レーザープラズマ発生方法及び装置 |
| DE10314849B3 (de) * | 2003-03-28 | 2004-12-30 | Xtreme Technologies Gmbh | Anordnung zur Stabilisierung der Strahlungsemission eines Plasmas |
| US6973164B2 (en) * | 2003-06-26 | 2005-12-06 | University Of Central Florida Research Foundation, Inc. | Laser-produced plasma EUV light source with pre-pulse enhancement |
| JP4478440B2 (ja) * | 2003-12-02 | 2010-06-09 | キヤノン株式会社 | ロードロック装置および方法 |
| DE102004005241B4 (de) * | 2004-01-30 | 2006-03-02 | Xtreme Technologies Gmbh | Verfahren und Einrichtung zur plasmabasierten Erzeugung weicher Röntgenstrahlung |
| WO2005089131A2 (en) * | 2004-03-17 | 2005-09-29 | Cymer, Inc. | Lpp euv light source |
| DE102004036441B4 (de) * | 2004-07-23 | 2007-07-12 | Xtreme Technologies Gmbh | Vorrichtung und Verfahren zum Dosieren von Targetmaterial für die Erzeugung kurzwelliger elektromagnetischer Strahlung |
| DE102004037521B4 (de) * | 2004-07-30 | 2011-02-10 | Xtreme Technologies Gmbh | Vorrichtung zur Bereitstellung von Targetmaterial für die Erzeugung kurzwelliger elektromagnetischer Strahlung |
| JP4578883B2 (ja) * | 2004-08-02 | 2010-11-10 | 株式会社小松製作所 | 極端紫外光源装置 |
-
2006
- 2006-01-24 JP JP2006015410A patent/JP5156192B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-19 US US11/655,109 patent/US7608846B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9699877B2 (en) | 2013-11-07 | 2017-07-04 | Gigaphoton Inc. | Extreme ultraviolet light generation apparatus including target droplet joining apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007200615A (ja) | 2007-08-09 |
| US20070170377A1 (en) | 2007-07-26 |
| US7608846B2 (en) | 2009-10-27 |
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