JP5148723B2 - 多機能構造回路 - Google Patents
多機能構造回路 Download PDFInfo
- Publication number
- JP5148723B2 JP5148723B2 JP2011044569A JP2011044569A JP5148723B2 JP 5148723 B2 JP5148723 B2 JP 5148723B2 JP 2011044569 A JP2011044569 A JP 2011044569A JP 2011044569 A JP2011044569 A JP 2011044569A JP 5148723 B2 JP5148723 B2 JP 5148723B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- lcp
- structural element
- structural
- thermoforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/02—Alignment layer characterised by chemical composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/919—Delaminating in preparation for post processing recycling step
- Y10S156/922—Specified electronic component delaminating in preparation for recycling
- Y10S156/924—Delaminating display screen, e.g. cathode-ray, LCD screen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Liquid Crystal (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Reinforced Plastic Materials (AREA)
- Moulding By Coating Moulds (AREA)
Description
105 頂面
110 底面
115 導体
120 構造素子
125 頂面
130 型
135 被覆層
140 回路構成部品
300 LCP回路
305 頂部
310 底部
315 構造素子
320 型
325 頂部
340 LCP回路
400 LCP回路
405 頂部
410 底部
415 構造素子
420 外面
Claims (6)
- 構造回路を構成する方法であって、
液晶ポリマー(LCP)基板上に電子回路を形成するステップと、
構造物の耐荷重フレーム部材の少なくとも一部として機能する構造素子を形成するステップと、
前記構造素子と前記LCP基板とを含む2つの層の積層体を形成するステップと、
3次元形状を有する金型の表面に前記積層体を配置するステップと、
前記構造素子及び前記LCP基板の形状を前記3次元形状に一致させるために単一の熱成形工程を実行し、前記耐荷重フレーム部材と前記電子回路とを含む単一の一体的な複合構造回路を形成するステップと、
前記複合構造回路の前記電子回路の表面に少なくとも1つの回路構成部品を取り付けるステップと
を含む方法。 - 前記電子回路の表面の少なくとも一部に被覆層を設けるステップをさらに含む、請求項1に記載の方法。
- 前記設けるステップは、前記電子回路の表面の前記少なくとも一部に前記被覆層を熱成形するステップを含む、請求項2に記載の方法。
- 前記被覆層は液晶ポリマー膜である、請求項2に記載の方法。
- 前記構造物は、建造物、乗り物、機械又は計算装置である、請求項1に記載の方法。
- 前記熱成形工程は前記複合構造回路を前記構造物に一体化する、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/987,285 US7343675B2 (en) | 2004-11-12 | 2004-11-12 | Method of constructing a structural circuit |
US10/987,285 | 2004-11-12 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007541206A Division JP2008520099A (ja) | 2004-11-12 | 2005-10-20 | 多機能構造回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011176318A JP2011176318A (ja) | 2011-09-08 |
JP5148723B2 true JP5148723B2 (ja) | 2013-02-20 |
Family
ID=36386040
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007541206A Pending JP2008520099A (ja) | 2004-11-12 | 2005-10-20 | 多機能構造回路 |
JP2011044569A Expired - Fee Related JP5148723B2 (ja) | 2004-11-12 | 2011-03-02 | 多機能構造回路 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007541206A Pending JP2008520099A (ja) | 2004-11-12 | 2005-10-20 | 多機能構造回路 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7343675B2 (ja) |
EP (1) | EP1812955A4 (ja) |
JP (2) | JP2008520099A (ja) |
CA (1) | CA2586855C (ja) |
WO (1) | WO2006055164A2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8161633B2 (en) * | 2007-04-03 | 2012-04-24 | Harris Corporation | Method of fabricating non-planar circuit board |
US20090186169A1 (en) * | 2008-01-17 | 2009-07-23 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods |
US9117602B2 (en) * | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
US9270016B2 (en) | 2011-07-15 | 2016-02-23 | The Boeing Company | Integrated antenna system |
US9057016B2 (en) | 2011-08-29 | 2015-06-16 | Ticona Llc | Melt polymerization of low melt viscosity liquid crystalline polymers |
WO2013032967A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Cast molded parts formed form a liquid crystalline polymer |
JP2014525501A (ja) | 2011-08-29 | 2014-09-29 | ティコナ・エルエルシー | 高流動性液晶ポリマー組成物 |
JP2014525499A (ja) | 2011-08-29 | 2014-09-29 | ティコナ・エルエルシー | 低い融解温度をもつ耐熱性液晶ポリマー組成物 |
US8852730B2 (en) | 2011-08-29 | 2014-10-07 | Ticona Llc | Melt-extruded substrate for use in thermoformed articles |
WO2013032974A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Solid-state polymerization of a liquid crystalline polymer |
WO2013032975A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Thermotropic liquid crystalline polymer with improved low shear viscosity |
US8778221B2 (en) | 2011-08-29 | 2014-07-15 | Ticona Llc | Aromatic amide compound |
TW201319223A (zh) | 2011-08-29 | 2013-05-16 | Ticona Llc | 高流量液晶聚合物組合物 |
US8877558B2 (en) | 2013-02-07 | 2014-11-04 | Harris Corporation | Method for making electronic device with liquid crystal polymer and related devices |
WO2014184445A1 (en) * | 2013-05-15 | 2014-11-20 | Tactotek Oy | Enabling arrangement for an electronic device with housing-integrated functionalities and method therefor |
JP6625050B2 (ja) | 2013-06-07 | 2019-12-25 | ティコナ・エルエルシー | 高強度サーモトロピック液晶ポリマー |
US9293438B2 (en) | 2013-07-03 | 2016-03-22 | Harris Corporation | Method for making electronic device with cover layer with openings and related devices |
JP6784701B2 (ja) | 2015-05-19 | 2020-11-11 | タクトテク オーユー | エレクトロニクス用の熱成形プラスチックカバーおよび関連した製法 |
CN108242427B (zh) * | 2016-12-23 | 2020-05-12 | 光宝电子(广州)有限公司 | 电子制品的封装结构及封装工艺 |
DE102018124853A1 (de) | 2018-10-09 | 2020-04-09 | Burg Design Gmbh | Verfahren zur Herstellung eines Mehrschichtkörpers und ein Mehrschichtkörper |
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JPS63244800A (ja) * | 1987-03-31 | 1988-10-12 | 株式会社富士通ゼネラル | 配線方法 |
US5184141A (en) | 1990-04-05 | 1993-02-02 | Vought Aircraft Company | Structurally-embedded electronics assembly |
US5827999A (en) | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
JP2939477B2 (ja) * | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
US6320257B1 (en) | 1994-09-27 | 2001-11-20 | Foster-Miller, Inc. | Chip packaging technique |
DE69826168T2 (de) * | 1997-03-19 | 2005-09-08 | Sumitomo Chemical Co. Ltd. | Laminat aus flüssigkristalliner Polyesterharzzusammensetzung |
JP3949216B2 (ja) * | 1997-03-21 | 2007-07-25 | 住友化学株式会社 | 積層体の製造方法 |
CN1116164C (zh) * | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | 使用聚合物薄膜的涂层方法和由此得到的涂层体 |
JPH11307904A (ja) * | 1998-04-22 | 1999-11-05 | Kuraray Co Ltd | 成形回路部品およびその製造方法 |
JP4138995B2 (ja) * | 1999-03-31 | 2008-08-27 | 株式会社クラレ | 回路基板およびその製造方法 |
US6329603B1 (en) | 1999-04-07 | 2001-12-11 | International Business Machines Corporation | Low CTE power and ground planes |
DE19944383A1 (de) * | 1999-09-16 | 2001-04-19 | Ticona Gmbh | Gehäuse für elektrische oder elektronische Vorrichtungen mit integrierten Leiterbahnen |
US6696163B2 (en) | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
AU2002227246A1 (en) | 2000-12-14 | 2002-06-24 | World Properties Inc. | Liquid crystalline polymer bond plies and circuits formed therefrom |
US20030200748A1 (en) * | 2002-04-30 | 2003-10-30 | Adc Telecommunications, Inc. | Thermally-activated actuator |
US6952046B2 (en) | 2002-06-19 | 2005-10-04 | Foster-Miller, Inc. | Electronic and optoelectronic component packaging technique |
-
2004
- 2004-11-12 US US10/987,285 patent/US7343675B2/en active Active
-
2005
- 2005-10-20 JP JP2007541206A patent/JP2008520099A/ja active Pending
- 2005-10-20 WO PCT/US2005/037721 patent/WO2006055164A2/en active Application Filing
- 2005-10-20 CA CA2586855A patent/CA2586855C/en not_active Expired - Fee Related
- 2005-10-20 EP EP05816032A patent/EP1812955A4/en not_active Withdrawn
-
2011
- 2011-03-02 JP JP2011044569A patent/JP5148723B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2586855C (en) | 2011-09-13 |
EP1812955A2 (en) | 2007-08-01 |
JP2011176318A (ja) | 2011-09-08 |
JP2008520099A (ja) | 2008-06-12 |
US7343675B2 (en) | 2008-03-18 |
CA2586855A1 (en) | 2006-05-26 |
WO2006055164A3 (en) | 2006-08-17 |
US20060104037A1 (en) | 2006-05-18 |
EP1812955A4 (en) | 2009-01-07 |
WO2006055164A2 (en) | 2006-05-26 |
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