JP2008520099A - 多機能構造回路 - Google Patents
多機能構造回路 Download PDFInfo
- Publication number
- JP2008520099A JP2008520099A JP2007541206A JP2007541206A JP2008520099A JP 2008520099 A JP2008520099 A JP 2008520099A JP 2007541206 A JP2007541206 A JP 2007541206A JP 2007541206 A JP2007541206 A JP 2007541206A JP 2008520099 A JP2008520099 A JP 2008520099A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- lcp
- structural element
- structural
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/02—Alignment layer characterised by chemical composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/919—Delaminating in preparation for post processing recycling step
- Y10S156/922—Specified electronic component delaminating in preparation for recycling
- Y10S156/924—Delaminating display screen, e.g. cathode-ray, LCD screen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Moulding By Coating Moulds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Liquid Crystal (AREA)
Abstract
Description
105 頂面
110 底面
115 導体
120 構造素子
125 頂面
130 型
135 被覆層
140 回路構成部品
300 LCP回路
305 頂部
310 底部
315 構造素子
320 型
325 頂部
340 LCP回路
400 LCP回路
405 頂部
410 底部
415 構造素子
420 外面
Claims (10)
- 構造回路を構成する方法であって、
液晶ポリマー回路を液晶ポリマー基板の上に形成するステップと、
前記液晶ポリマー回路と関連する如何なる機能をも除く機械的機能を遂行するために選択される物理的構成を有する構造素子と共に前記液晶ポリマー回路を熱成形するステップと、
少なくとも1つの回路構成部品を前記液晶ポリマー回路の表面に取り付けるステップとを含む、
方法。 - 被覆層を前記液晶ポリマー回路の表面の少なくとも一部に塗布するステップをさらに含む、請求項1に記載の方法。
- 前記塗布するステップは、前記被覆層を前記液晶ポリマー回路の前記表面の少なくとも一部に熱成形するステップを含む、請求項2に記載の方法。
- 前記被覆層は液晶ポリマー膜である、請求項2に記載の方法。
- 電子回路を構造素子に一体化するための方法であって、
電子回路を選択するステップと、
機械的機能を遂行するための物理的構成を有する構造素子を選択するステップと、
前記物理的構成の少なくとも一部を定めるために、前記電子回路を前記構造素子と共に一体的に形成するステップと、
少なくとも1つの回路構成部品を前記電子回路の表面に取り付けるステップと、
前記電子回路の機能を除く機能であるべき前記構造素子の前記機械的機能を選択するステップとを含む、
方法。 - 前記構造素子は、炭素繊維布から成り、当該方法は、前記構造素子の少なくとも一部を流動可能な樹脂で含浸するステップを含む、請求項5に記載の方法。
- 液晶ポリマー基板の上に形成される液晶ポリマー回路と、
該液晶ポリマー回路と関連する如何なる機能をも除く機械的機能を遂行する物理的構成を有する構造素子とを含み、
前記液晶ポリマー回路及び前記構造素子は、単一の一体的な複合構造を形成するよう、共に熱成形される、
構造回路。 - 前記構造素子は炭素繊維布から成る、請求項7に記載の構造回路。
- 前記液晶ポリマー回路の表面の少なくとも一部の頂上に配置される被覆層をさらに含む、請求項7に記載の構造回路。
- 前記被覆層は液晶ポリマー膜である、請求項9に記載の構造回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/987,285 US7343675B2 (en) | 2004-11-12 | 2004-11-12 | Method of constructing a structural circuit |
PCT/US2005/037721 WO2006055164A2 (en) | 2004-11-12 | 2005-10-20 | Multi-functional structural circuits |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011044569A Division JP5148723B2 (ja) | 2004-11-12 | 2011-03-02 | 多機能構造回路 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008520099A true JP2008520099A (ja) | 2008-06-12 |
Family
ID=36386040
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007541206A Pending JP2008520099A (ja) | 2004-11-12 | 2005-10-20 | 多機能構造回路 |
JP2011044569A Expired - Fee Related JP5148723B2 (ja) | 2004-11-12 | 2011-03-02 | 多機能構造回路 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011044569A Expired - Fee Related JP5148723B2 (ja) | 2004-11-12 | 2011-03-02 | 多機能構造回路 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7343675B2 (ja) |
EP (1) | EP1812955A4 (ja) |
JP (2) | JP2008520099A (ja) |
CA (1) | CA2586855C (ja) |
WO (1) | WO2006055164A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022508794A (ja) * | 2018-10-09 | 2022-01-19 | レオンハード クルツ シュティフトゥング ウント コー. カーゲー | 多層体の製造方法及び多層体 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8161633B2 (en) * | 2007-04-03 | 2012-04-24 | Harris Corporation | Method of fabricating non-planar circuit board |
US20090186169A1 (en) * | 2008-01-17 | 2009-07-23 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods |
US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
US9270016B2 (en) | 2011-07-15 | 2016-02-23 | The Boeing Company | Integrated antenna system |
TW201319118A (zh) | 2011-08-29 | 2013-05-16 | Ticona Llc | 低熔融黏度液晶聚合物之熔融聚合 |
WO2013032975A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Thermotropic liquid crystalline polymer with improved low shear viscosity |
WO2013032971A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Melt-extruded substrate for use in thermoformed articles |
US8906258B2 (en) | 2011-08-29 | 2014-12-09 | Ticona Llc | Heat-resistant liquid crystalline polymer composition having a low melting temperature |
KR20140059825A (ko) | 2011-08-29 | 2014-05-16 | 티코나 엘엘씨 | 고유동성 액정 중합체 조성물 |
WO2013032974A1 (en) | 2011-08-29 | 2013-03-07 | Ticona Llc | Solid-state polymerization of a liquid crystalline polymer |
US9045685B2 (en) | 2011-08-29 | 2015-06-02 | Ticona Llc | Cast molded parts formed from a liquid crystalline polymer |
KR20140057360A (ko) | 2011-08-29 | 2014-05-12 | 티코나 엘엘씨 | 고유동성 액정 중합체 조성물 |
KR20140057629A (ko) | 2011-08-29 | 2014-05-13 | 티코나 엘엘씨 | 방향족 아마이드 화합물 |
US8877558B2 (en) | 2013-02-07 | 2014-11-04 | Harris Corporation | Method for making electronic device with liquid crystal polymer and related devices |
EP3832473A1 (en) * | 2013-05-15 | 2021-06-09 | TactoTek Oy | Enabling arrangement for an electronic device with housing-integrated functionalities and method therefor |
US9206300B2 (en) | 2013-06-07 | 2015-12-08 | Ticona Llc | High strength thermotropic liquid crystalline polymer |
US9293438B2 (en) | 2013-07-03 | 2016-03-22 | Harris Corporation | Method for making electronic device with cover layer with openings and related devices |
CN107709007B (zh) * | 2015-05-19 | 2021-01-05 | 塔科图特科有限责任公司 | 用于电子器件的热成型塑料覆盖部及相关的制造方法 |
CN108242427B (zh) * | 2016-12-23 | 2020-05-12 | 光宝电子(广州)有限公司 | 电子制品的封装结构及封装工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244800A (ja) * | 1987-03-31 | 1988-10-12 | 株式会社富士通ゼネラル | 配線方法 |
JPH10258492A (ja) * | 1997-03-21 | 1998-09-29 | Sumitomo Chem Co Ltd | 積層体の製造方法 |
JP2000286537A (ja) * | 1999-03-31 | 2000-10-13 | Kuraray Co Ltd | 回路基板およびその製造方法 |
JP2001160449A (ja) * | 1999-09-16 | 2001-06-12 | Ticona Gmbh | 集積導電路を含む電気または電子デバイス用ハウジング |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5184141A (en) | 1990-04-05 | 1993-02-02 | Vought Aircraft Company | Structurally-embedded electronics assembly |
US5827999A (en) | 1994-05-26 | 1998-10-27 | Amkor Electronics, Inc. | Homogeneous chip carrier package |
JP2939477B2 (ja) * | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
US6320257B1 (en) | 1994-09-27 | 2001-11-20 | Foster-Miller, Inc. | Chip packaging technique |
EP0865905B1 (en) * | 1997-03-19 | 2004-09-15 | Sumitomo Chemical Company, Limited | Laminate of liquid crystal polyester resin composition |
CN1116164C (zh) * | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | 使用聚合物薄膜的涂层方法和由此得到的涂层体 |
JPH11307904A (ja) * | 1998-04-22 | 1999-11-05 | Kuraray Co Ltd | 成形回路部品およびその製造方法 |
US6329603B1 (en) | 1999-04-07 | 2001-12-11 | International Business Machines Corporation | Low CTE power and ground planes |
US6696163B2 (en) | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
AU2002227246A1 (en) | 2000-12-14 | 2002-06-24 | World Properties Inc. | Liquid crystalline polymer bond plies and circuits formed therefrom |
US20030200748A1 (en) * | 2002-04-30 | 2003-10-30 | Adc Telecommunications, Inc. | Thermally-activated actuator |
US6952046B2 (en) | 2002-06-19 | 2005-10-04 | Foster-Miller, Inc. | Electronic and optoelectronic component packaging technique |
-
2004
- 2004-11-12 US US10/987,285 patent/US7343675B2/en active Active
-
2005
- 2005-10-20 EP EP05816032A patent/EP1812955A4/en not_active Withdrawn
- 2005-10-20 WO PCT/US2005/037721 patent/WO2006055164A2/en active Application Filing
- 2005-10-20 JP JP2007541206A patent/JP2008520099A/ja active Pending
- 2005-10-20 CA CA2586855A patent/CA2586855C/en not_active Expired - Fee Related
-
2011
- 2011-03-02 JP JP2011044569A patent/JP5148723B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244800A (ja) * | 1987-03-31 | 1988-10-12 | 株式会社富士通ゼネラル | 配線方法 |
JPH10258492A (ja) * | 1997-03-21 | 1998-09-29 | Sumitomo Chem Co Ltd | 積層体の製造方法 |
JP2000286537A (ja) * | 1999-03-31 | 2000-10-13 | Kuraray Co Ltd | 回路基板およびその製造方法 |
JP2001160449A (ja) * | 1999-09-16 | 2001-06-12 | Ticona Gmbh | 集積導電路を含む電気または電子デバイス用ハウジング |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022508794A (ja) * | 2018-10-09 | 2022-01-19 | レオンハード クルツ シュティフトゥング ウント コー. カーゲー | 多層体の製造方法及び多層体 |
JP7482143B2 (ja) | 2018-10-09 | 2024-05-13 | レオンハード クルツ シュティフトゥング ウント コー. カーゲー | 多層体の製造方法及び多層体 |
Also Published As
Publication number | Publication date |
---|---|
EP1812955A4 (en) | 2009-01-07 |
JP5148723B2 (ja) | 2013-02-20 |
US20060104037A1 (en) | 2006-05-18 |
CA2586855C (en) | 2011-09-13 |
CA2586855A1 (en) | 2006-05-26 |
JP2011176318A (ja) | 2011-09-08 |
US7343675B2 (en) | 2008-03-18 |
WO2006055164A3 (en) | 2006-08-17 |
EP1812955A2 (en) | 2007-08-01 |
WO2006055164A2 (en) | 2006-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5148723B2 (ja) | 多機能構造回路 | |
JP6822940B2 (ja) | 回路基板 | |
US5949650A (en) | Composite heat sink/support structure | |
CN106716627A (zh) | 具有嵌入式集成电路裸片的柔性电子电路及其制作和使用方法 | |
US20080257589A1 (en) | Method for the production of expandable circuit carrier and expandable circuit carrier | |
KR950002544A (ko) | 다층금속프린트기판과 몰드모듈 | |
JP2008509549A (ja) | 素子を含む層の形成 | |
JP2011176222A (ja) | 樹脂封止形電子制御装置、及びその製造方法 | |
EP3479662B1 (en) | Cooling component carrier material by carbon structure within dielectric shell | |
CN108366494A (zh) | 可转变到粘性状态以将部件嵌入部件承载件的固态过渡件 | |
KR20150126778A (ko) | 기판 통합형 인터커넥트 | |
JP2009224358A (ja) | 可撓性を有するプリント配線板および光送受信モジュール | |
JP2007158045A (ja) | 部品内蔵基板、部品内蔵基板を備えた電子機器、および、部品内蔵基板の製造方法 | |
US20070230146A1 (en) | Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device | |
JP5348603B2 (ja) | シール構造体 | |
US11057993B2 (en) | Printed circuit board | |
US10952316B2 (en) | Printed circuit board | |
KR100952029B1 (ko) | 모듈 패키지 및 그 제조 방법 | |
JPH118449A (ja) | フレキシブル配線基板 | |
KR20090105046A (ko) | 액정고분자를 이용한 경연성 인쇄회로기판의 제조방법 | |
JP2022150170A (ja) | アンテナモジュール | |
US20090117324A1 (en) | Electronic substrate having cavities and method of making | |
CN111201843A (zh) | 制造印刷电路板的方法及由该方法制造的印刷电路板 | |
KR20110018683A (ko) | 임베디드 회로 기판 및 임베디드 회로 기판의 제조 방법 | |
JPH1117339A (ja) | 多層配線板とその製造方法並びに実装体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091201 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100225 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100304 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100330 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101005 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101221 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110105 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110426 |