JP5144599B2 - 電子部品の装着方法 - Google Patents
電子部品の装着方法 Download PDFInfo
- Publication number
- JP5144599B2 JP5144599B2 JP2009163351A JP2009163351A JP5144599B2 JP 5144599 B2 JP5144599 B2 JP 5144599B2 JP 2009163351 A JP2009163351 A JP 2009163351A JP 2009163351 A JP2009163351 A JP 2009163351A JP 5144599 B2 JP5144599 B2 JP 5144599B2
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- Prior art keywords
- electronic component
- mounting
- imaging
- component mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 94
- 239000000758 substrate Substances 0.000 claims description 173
- 238000003384 imaging method Methods 0.000 claims description 168
- 230000000052 comparative effect Effects 0.000 claims description 46
- 230000002950 deficient Effects 0.000 description 23
- 238000009434 installation Methods 0.000 description 21
- 238000012545 processing Methods 0.000 description 20
- 230000007547 defect Effects 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 16
- 238000007689 inspection Methods 0.000 description 12
- 238000005192 partition Methods 0.000 description 12
- 238000012937 correction Methods 0.000 description 8
- 230000005856 abnormality Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009163351A JP5144599B2 (ja) | 2009-07-10 | 2009-07-10 | 電子部品の装着方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009163351A JP5144599B2 (ja) | 2009-07-10 | 2009-07-10 | 電子部品の装着方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011018816A JP2011018816A (ja) | 2011-01-27 |
JP2011018816A5 JP2011018816A5 (enrdf_load_stackoverflow) | 2012-08-30 |
JP5144599B2 true JP5144599B2 (ja) | 2013-02-13 |
Family
ID=43596378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009163351A Active JP5144599B2 (ja) | 2009-07-10 | 2009-07-10 | 電子部品の装着方法 |
Country Status (1)
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JP (1) | JP5144599B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5728977B2 (ja) * | 2011-02-01 | 2015-06-03 | 富士通株式会社 | 作業支援装置、作業支援プログラムおよび作業支援方法 |
JP6108380B2 (ja) * | 2012-06-05 | 2017-04-05 | ハンファテクウィン株式会社Hanwha Techwin Co.,Ltd. | 電子部品実装装置 |
JP6259274B2 (ja) * | 2012-12-11 | 2018-01-10 | ヤマハ発動機株式会社 | 部品装着装置 |
JP6335246B2 (ja) * | 2016-11-07 | 2018-05-30 | 株式会社Fuji | 検査管理装置及び検査管理方法 |
JP7249426B2 (ja) * | 2019-09-19 | 2023-03-30 | 株式会社Fuji | 部品実装機 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4667681B2 (ja) * | 2001-09-28 | 2011-04-13 | パナソニック株式会社 | 実装検査システムおよび実装検査方法 |
JP4563205B2 (ja) * | 2005-02-08 | 2010-10-13 | 富士機械製造株式会社 | 実装された電子部品の検査方法及び装置 |
JP2007335524A (ja) * | 2006-06-13 | 2007-12-27 | Fuji Mach Mfg Co Ltd | 実装ライン |
JP2008227301A (ja) * | 2007-03-14 | 2008-09-25 | Fuji Mach Mfg Co Ltd | 電子回路部品装着検査方法および装置 |
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- 2009-07-10 JP JP2009163351A patent/JP5144599B2/ja active Active
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JP2011018816A (ja) | 2011-01-27 |
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