JP2011018816A5 - - Google Patents

Download PDF

Info

Publication number
JP2011018816A5
JP2011018816A5 JP2009163351A JP2009163351A JP2011018816A5 JP 2011018816 A5 JP2011018816 A5 JP 2011018816A5 JP 2009163351 A JP2009163351 A JP 2009163351A JP 2009163351 A JP2009163351 A JP 2009163351A JP 2011018816 A5 JP2011018816 A5 JP 2011018816A5
Authority
JP
Japan
Prior art keywords
electronic component
mounting
imaging
substrate
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009163351A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011018816A (ja
JP5144599B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009163351A priority Critical patent/JP5144599B2/ja
Priority claimed from JP2009163351A external-priority patent/JP5144599B2/ja
Publication of JP2011018816A publication Critical patent/JP2011018816A/ja
Publication of JP2011018816A5 publication Critical patent/JP2011018816A5/ja
Application granted granted Critical
Publication of JP5144599B2 publication Critical patent/JP5144599B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009163351A 2009-07-10 2009-07-10 電子部品の装着方法 Active JP5144599B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009163351A JP5144599B2 (ja) 2009-07-10 2009-07-10 電子部品の装着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009163351A JP5144599B2 (ja) 2009-07-10 2009-07-10 電子部品の装着方法

Publications (3)

Publication Number Publication Date
JP2011018816A JP2011018816A (ja) 2011-01-27
JP2011018816A5 true JP2011018816A5 (enrdf_load_stackoverflow) 2012-08-30
JP5144599B2 JP5144599B2 (ja) 2013-02-13

Family

ID=43596378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009163351A Active JP5144599B2 (ja) 2009-07-10 2009-07-10 電子部品の装着方法

Country Status (1)

Country Link
JP (1) JP5144599B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5728977B2 (ja) * 2011-02-01 2015-06-03 富士通株式会社 作業支援装置、作業支援プログラムおよび作業支援方法
JP6108380B2 (ja) * 2012-06-05 2017-04-05 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． 電子部品実装装置
JP6259274B2 (ja) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 部品装着装置
JP6335246B2 (ja) * 2016-11-07 2018-05-30 株式会社Ｆｕｊｉ 検査管理装置及び検査管理方法
JP7249426B2 (ja) * 2019-09-19 2023-03-30 株式会社Fuji 部品実装機

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4667681B2 (ja) * 2001-09-28 2011-04-13 パナソニック株式会社 実装検査システムおよび実装検査方法
JP4563205B2 (ja) * 2005-02-08 2010-10-13 富士機械製造株式会社 実装された電子部品の検査方法及び装置
JP2007335524A (ja) * 2006-06-13 2007-12-27 Fuji Mach Mfg Co Ltd 実装ライン
JP2008227301A (ja) * 2007-03-14 2008-09-25 Fuji Mach Mfg Co Ltd 電子回路部品装着検査方法および装置

Similar Documents

Publication Publication Date Title
JP2011018816A5 (enrdf_load_stackoverflow)
WO2012157985A3 (en) Camera module
JP6072897B2 (ja) スクリーンプリンタ装備の補正方法及びそれを用いた基板検査システム
EP2568367A3 (en) Touch screen, transparent circuit board for touch screen and method for fabricating touch screen
WO2009129066A3 (en) Method and system for forming an electronic assembly having inertial sensors mounted thereto
WO2011123643A3 (en) Method and apparatus for managing installation information
EP2496061A4 (en) CIRCUIT BOARD AND SEMICONDUCTOR DEVICE WITH A COMPONENT MOUNTED ON A PCB
WO2015054194A3 (en) System and method for camera based position and orientation measurement
WO2009053848A3 (en) Methods and processes for detecting a mark on a playing surface and for tracking an object
EP2753061A3 (en) Method for obtaining image data and electronic device for processing method thereof
JP2013539910A5 (enrdf_load_stackoverflow)
WO2013120616A3 (en) Physical layer management (plm) in an optical distribution frame
WO2012018568A3 (en) Method and apparatus for imaging
WO2008121339A3 (en) Method and apparatus for registering a physical space to image space
JP2014003342A5 (ja) 積層装置および積層方法
JP2013019825A5 (enrdf_load_stackoverflow)
JP2011518383A5 (enrdf_load_stackoverflow)
JP2015153935A5 (enrdf_load_stackoverflow)
WO2014109694A3 (en) Supporting and enhancing image-based positioning
CN102681360A (zh) 激光成像系统中实现电路板两面曝光图形对准的对位方法
WO2015103413A3 (en) Method and system for verifying printed circuit board designs for fabrication and assembly
JP2014107383A5 (enrdf_load_stackoverflow)
WO2013160533A3 (en) Method, apparatus and computer program product for generating panorama images
WO2014095316A3 (de) Elektronische vorrichtung und verfahren zur herstellung einer elektronischen vorrichtung
EP3038145A3 (en) Electronic packages with pre-defined via patterns and methods of making and using the same