JP5144062B2 - 個片搬送装置 - Google Patents
個片搬送装置 Download PDFInfo
- Publication number
- JP5144062B2 JP5144062B2 JP2006337690A JP2006337690A JP5144062B2 JP 5144062 B2 JP5144062 B2 JP 5144062B2 JP 2006337690 A JP2006337690 A JP 2006337690A JP 2006337690 A JP2006337690 A JP 2006337690A JP 5144062 B2 JP5144062 B2 JP 5144062B2
- Authority
- JP
- Japan
- Prior art keywords
- conveyance
- chute
- individual piece
- heat sink
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
2 搬送シュート
3 搬送枠
11 送り爪(搬送手段)
16 ヒートシンク(個片)
23 個片搬送装置
24 ヒータ(加熱手段)
35 収納部
36 後辺
37、38 側辺
39 前辺
50 ヒートシンク支持部材
51 後辺
52、53 側辺
60 搬送枠
t 高さ寸法
T 厚さ寸法
Claims (3)
- 加熱手段が設けられた搬送シュートの上面に接触載置され電子部品を装着する個片を搬送する個片搬送装置において、前記搬送シュートの上面に接触載置された前記個片の搬送方向の後縁及びこの後縁に続く両側縁を支持し、厚さが前記個片の厚さより大きく、底が無く、前記搬送シュートに載置された支持手段と、この支持手段を前記搬送シュート上にて移動させる搬送手段とを備えたことを特徴とする個片搬送装置。
- 加熱手段が設けられた搬送シュートの上面に接触載置され電子部品を装着する個片を搬送する個片搬送装置において、厚さが前記個片の厚さより大きく、前記搬送シュートの上面に接触載置された前記個片を収納し、底が無く、前記搬送シュートに載置された搬送枠と、この搬送枠を前記搬送シュート上にて移動させる搬送手段とを備えたことを特徴とする個片搬送装置。
- 加熱手段が設けられた搬送シュートの上面に接触載置され、電子部品を装着する個片を搬送する個片搬送装置において、厚さが前記個片の厚さより大きく、前記搬送シュートの上面に接触載置された前記個片を収納する底が無い複数の収納部が形成され前記搬送シュートに載置された搬送枠と、この搬送枠の搬送手段とを備えたことを特徴とする個片搬送装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006337690A JP5144062B2 (ja) | 2006-12-15 | 2006-12-15 | 個片搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006337690A JP5144062B2 (ja) | 2006-12-15 | 2006-12-15 | 個片搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008153316A JP2008153316A (ja) | 2008-07-03 |
JP5144062B2 true JP5144062B2 (ja) | 2013-02-13 |
Family
ID=39655211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006337690A Expired - Fee Related JP5144062B2 (ja) | 2006-12-15 | 2006-12-15 | 個片搬送装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5144062B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201706437VA (en) * | 2017-08-07 | 2019-03-28 | Rokko Systems Pte Ltd | Method and apparatus for pcb sawing |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01225194A (ja) * | 1988-03-03 | 1989-09-08 | Nec Corp | 半田付・洗浄用保持装置 |
JPH0597223A (ja) * | 1991-10-08 | 1993-04-20 | Sharp Corp | 部品搬送装置 |
JPH06252239A (ja) * | 1993-02-22 | 1994-09-09 | Toshiba Corp | 半導体装置の製造装置 |
JPH10144773A (ja) * | 1996-11-07 | 1998-05-29 | Mitsubishi Heavy Ind Ltd | 基板ホルダー |
JPH1111571A (ja) * | 1997-06-24 | 1999-01-19 | Denki Kagaku Kogyo Kk | 半導体集積回路装置収納用トレイ |
JP2000183148A (ja) * | 1998-12-10 | 2000-06-30 | Technisco:Kk | 半導体ウエーハ支持トレー |
JP2004200471A (ja) * | 2002-12-19 | 2004-07-15 | Hitachi High-Tech Instruments Co Ltd | ワーク収納装置 |
JP2005317691A (ja) * | 2004-04-28 | 2005-11-10 | Olympus Corp | プリント基板のはんだ付け方法及びはんだ付けに用いるパレット |
JP2006100641A (ja) * | 2004-09-30 | 2006-04-13 | Sanyo Electric Co Ltd | プリント基板の半田付け方法 |
US7621969B2 (en) * | 2005-03-31 | 2009-11-24 | Toray Engineering Co., Ltd. | Mounting system |
-
2006
- 2006-12-15 JP JP2006337690A patent/JP5144062B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008153316A (ja) | 2008-07-03 |
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