JP5143143B2 - 可変力式電気接触器 - Google Patents
可変力式電気接触器 Download PDFInfo
- Publication number
- JP5143143B2 JP5143143B2 JP2009548372A JP2009548372A JP5143143B2 JP 5143143 B2 JP5143143 B2 JP 5143143B2 JP 2009548372 A JP2009548372 A JP 2009548372A JP 2009548372 A JP2009548372 A JP 2009548372A JP 5143143 B2 JP5143143 B2 JP 5143143B2
- Authority
- JP
- Japan
- Prior art keywords
- contactor
- tip
- force
- contact
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 claims description 85
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- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 230000000737 periodic effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88707607P | 2007-01-29 | 2007-01-29 | |
| US60/887,076 | 2007-01-29 | ||
| US11/740,480 | 2007-04-26 | ||
| US11/740,480 US7839138B2 (en) | 2007-01-29 | 2007-04-26 | Adjustable force electrical contactor |
| PCT/US2008/052050 WO2008094831A1 (en) | 2007-01-29 | 2008-01-25 | Adjustable force electrical contactor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010517058A JP2010517058A (ja) | 2010-05-20 |
| JP2010517058A5 JP2010517058A5 (enExample) | 2011-03-10 |
| JP5143143B2 true JP5143143B2 (ja) | 2013-02-13 |
Family
ID=39667238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009548372A Expired - Fee Related JP5143143B2 (ja) | 2007-01-29 | 2008-01-25 | 可変力式電気接触器 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7839138B2 (enExample) |
| JP (1) | JP5143143B2 (enExample) |
| KR (1) | KR101441156B1 (enExample) |
| CN (1) | CN101589518B (enExample) |
| TW (1) | TWI409999B (enExample) |
| WO (1) | WO2008094831A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102269564B (zh) * | 2011-05-03 | 2013-01-23 | 厦门精合电气自动化有限公司 | 接触器触头参数的测试装置及方法 |
| CN105008941B (zh) * | 2012-12-19 | 2018-12-04 | 伊斯梅卡半导体控股公司 | 用于限制力的装置和方法 |
| KR102235612B1 (ko) | 2015-01-29 | 2021-04-02 | 삼성전자주식회사 | 일-함수 금속을 갖는 반도체 소자 및 그 형성 방법 |
| JP2018054463A (ja) * | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| JP6727651B2 (ja) | 2016-09-30 | 2020-07-22 | 株式会社ヒューモラボラトリー | チップ電子部品の電気特性の連続的な検査方法 |
| JP6679552B2 (ja) | 2017-10-02 | 2020-04-15 | 株式会社ヒューモラボラトリー | チップ電子部品の検査選別方法 |
| US10497521B1 (en) * | 2018-10-29 | 2019-12-03 | Xerox Corporation | Roller electric contact |
| CN110132558B (zh) * | 2019-04-30 | 2024-12-31 | 广州广汽荻原模具冲压有限公司 | 一种顶杆干涉排查装置 |
| CN114585940A (zh) * | 2019-09-30 | 2022-06-03 | 伊雷克托科学工业股份有限公司 | 模组化二端点终端接触式电测量系统中的减少的阻抗变化 |
| KR102247261B1 (ko) * | 2020-12-15 | 2021-04-30 | 김상길 | 내마모성 및 윤활성능이 개선된 전자부품 검사용 회전접촉롤러, 이를 포함하는 프로브 조립체 및 전자부품 검사장치 |
| WO2022225675A1 (en) * | 2021-04-22 | 2022-10-27 | Electro Scientific Industries, Inc. | Roller contact with reduced contact resistance variation |
| DE102022107387A1 (de) | 2022-03-29 | 2023-10-05 | Infineon Technologies Ag | Eine vorrichtung zum testen von halbleiterbauelementen und ein rollender kontaktgeber zur verwendung in einer solchen vorrichtung |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3915850A (en) * | 1973-11-14 | 1975-10-28 | Gti Corp | Component handler and method and apparatus utilizing same |
| JPH0789141B2 (ja) * | 1987-06-19 | 1995-09-27 | 東京エレクトロン株式会社 | 検査装置 |
| CA1310693C (en) * | 1988-01-27 | 1992-11-24 | Manfred Prokopp | Electrical connecting apparatus for an electrical or electronic testing unit |
| US5034749A (en) * | 1988-10-06 | 1991-07-23 | Electro Scientific Industries, Inc. | Sliding contact test apparatus |
| US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
| JPH08292228A (ja) | 1995-04-24 | 1996-11-05 | Hitachi Electron Eng Co Ltd | Icデバイスの試験装置 |
| JPH08334547A (ja) | 1995-06-09 | 1996-12-17 | Iwaki Electron Corp Ltd | 大電流電子部品の試験方法および試験装置 |
| US6064195A (en) * | 1998-05-11 | 2000-05-16 | R-Tec Corporation | Test probe positioning device |
| US6100707A (en) * | 1998-09-25 | 2000-08-08 | Electro Scientific Industries, Inc. | Apparatus for testing multi-terminal electronic components |
| JP3662756B2 (ja) * | 1999-01-11 | 2005-06-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | プローバ圧接装置及びプローバ圧接方法 |
| CA2262175C (en) * | 1999-02-16 | 2008-02-12 | Mold-Masters Limited | Injection molding apparatus with removable nozzle seal |
| JP4106859B2 (ja) * | 2000-06-27 | 2008-06-25 | 沖電気工業株式会社 | 半導体装置の電気的特性試験装置 |
| US6714028B2 (en) * | 2001-11-14 | 2004-03-30 | Electro Scientific Industries, Inc. | Roller contact with conductive brushes |
| JP4173306B2 (ja) * | 2001-11-30 | 2008-10-29 | 東京エレクトロン株式会社 | 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法 |
| JP4123408B2 (ja) * | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | プローブカード交換装置 |
| JP3836830B2 (ja) * | 2003-10-28 | 2006-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレーション | アクティブマトリックスパネルの検査装置、アクティブマトリックスパネルの検査方法、およびアクティブマトリックスoledパネルの製造方法 |
| JP4017586B2 (ja) * | 2003-10-29 | 2007-12-05 | 三洋電機株式会社 | 電池の充電方法 |
| JP2006194831A (ja) * | 2005-01-17 | 2006-07-27 | Humo Laboratory Ltd | チップ形電子部品特性検査分類装置 |
| US7443179B2 (en) * | 2006-11-30 | 2008-10-28 | Electro Scientific Industries, Inc. | Zero motion contact actuation |
-
2007
- 2007-04-26 US US11/740,480 patent/US7839138B2/en active Active
-
2008
- 2008-01-25 JP JP2009548372A patent/JP5143143B2/ja not_active Expired - Fee Related
- 2008-01-25 TW TW097102902A patent/TWI409999B/zh not_active IP Right Cessation
- 2008-01-25 KR KR1020097017635A patent/KR101441156B1/ko not_active Expired - Fee Related
- 2008-01-25 WO PCT/US2008/052050 patent/WO2008094831A1/en not_active Ceased
- 2008-01-25 CN CN2008800033332A patent/CN101589518B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010517058A (ja) | 2010-05-20 |
| TW200847540A (en) | 2008-12-01 |
| CN101589518A (zh) | 2009-11-25 |
| US20080180117A1 (en) | 2008-07-31 |
| TWI409999B (zh) | 2013-09-21 |
| WO2008094831A1 (en) | 2008-08-07 |
| US7839138B2 (en) | 2010-11-23 |
| KR20090107069A (ko) | 2009-10-12 |
| CN101589518B (zh) | 2012-09-19 |
| KR101441156B1 (ko) | 2014-09-17 |
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