TWI409999B - 可調應力電接觸器 - Google Patents
可調應力電接觸器 Download PDFInfo
- Publication number
- TWI409999B TWI409999B TW097102902A TW97102902A TWI409999B TW I409999 B TWI409999 B TW I409999B TW 097102902 A TW097102902 A TW 097102902A TW 97102902 A TW97102902 A TW 97102902A TW I409999 B TWI409999 B TW I409999B
- Authority
- TW
- Taiwan
- Prior art keywords
- contactor
- stress
- test
- contact
- axis
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims abstract description 102
- 230000009467 reduction Effects 0.000 claims abstract description 7
- 230000008859 change Effects 0.000 claims description 10
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 21
- 238000009434 installation Methods 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88707607P | 2007-01-29 | 2007-01-29 | |
| US11/740,480 US7839138B2 (en) | 2007-01-29 | 2007-04-26 | Adjustable force electrical contactor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200847540A TW200847540A (en) | 2008-12-01 |
| TWI409999B true TWI409999B (zh) | 2013-09-21 |
Family
ID=39667238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097102902A TWI409999B (zh) | 2007-01-29 | 2008-01-25 | 可調應力電接觸器 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7839138B2 (enExample) |
| JP (1) | JP5143143B2 (enExample) |
| KR (1) | KR101441156B1 (enExample) |
| CN (1) | CN101589518B (enExample) |
| TW (1) | TWI409999B (enExample) |
| WO (1) | WO2008094831A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102269564B (zh) * | 2011-05-03 | 2013-01-23 | 厦门精合电气自动化有限公司 | 接触器触头参数的测试装置及方法 |
| CN105008941B (zh) * | 2012-12-19 | 2018-12-04 | 伊斯梅卡半导体控股公司 | 用于限制力的装置和方法 |
| KR102235612B1 (ko) | 2015-01-29 | 2021-04-02 | 삼성전자주식회사 | 일-함수 금속을 갖는 반도체 소자 및 그 형성 방법 |
| JP2018054463A (ja) * | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| JP6727651B2 (ja) | 2016-09-30 | 2020-07-22 | 株式会社ヒューモラボラトリー | チップ電子部品の電気特性の連続的な検査方法 |
| JP6679552B2 (ja) | 2017-10-02 | 2020-04-15 | 株式会社ヒューモラボラトリー | チップ電子部品の検査選別方法 |
| US10497521B1 (en) * | 2018-10-29 | 2019-12-03 | Xerox Corporation | Roller electric contact |
| CN110132558B (zh) * | 2019-04-30 | 2024-12-31 | 广州广汽荻原模具冲压有限公司 | 一种顶杆干涉排查装置 |
| CN114585940A (zh) * | 2019-09-30 | 2022-06-03 | 伊雷克托科学工业股份有限公司 | 模组化二端点终端接触式电测量系统中的减少的阻抗变化 |
| KR102247261B1 (ko) * | 2020-12-15 | 2021-04-30 | 김상길 | 내마모성 및 윤활성능이 개선된 전자부품 검사용 회전접촉롤러, 이를 포함하는 프로브 조립체 및 전자부품 검사장치 |
| WO2022225675A1 (en) * | 2021-04-22 | 2022-10-27 | Electro Scientific Industries, Inc. | Roller contact with reduced contact resistance variation |
| DE102022107387A1 (de) | 2022-03-29 | 2023-10-05 | Infineon Technologies Ag | Eine vorrichtung zum testen von halbleiterbauelementen und ein rollender kontaktgeber zur verwendung in einer solchen vorrichtung |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317788A (ja) * | 1987-06-19 | 1988-12-26 | Tokyo Electron Ltd | 検査装置 |
| JP2005134421A (ja) * | 2003-10-28 | 2005-05-26 | Internatl Business Mach Corp <Ibm> | アクティブマトリックスパネルの検査装置、アクティブマトリックスパネルの検査方法、およびアクティブマトリックスoledパネルの製造方法 |
| JP2006194831A (ja) * | 2005-01-17 | 2006-07-27 | Humo Laboratory Ltd | チップ形電子部品特性検査分類装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3915850A (en) * | 1973-11-14 | 1975-10-28 | Gti Corp | Component handler and method and apparatus utilizing same |
| CA1310693C (en) * | 1988-01-27 | 1992-11-24 | Manfred Prokopp | Electrical connecting apparatus for an electrical or electronic testing unit |
| US5034749A (en) * | 1988-10-06 | 1991-07-23 | Electro Scientific Industries, Inc. | Sliding contact test apparatus |
| US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
| JPH08292228A (ja) | 1995-04-24 | 1996-11-05 | Hitachi Electron Eng Co Ltd | Icデバイスの試験装置 |
| JPH08334547A (ja) | 1995-06-09 | 1996-12-17 | Iwaki Electron Corp Ltd | 大電流電子部品の試験方法および試験装置 |
| US6064195A (en) * | 1998-05-11 | 2000-05-16 | R-Tec Corporation | Test probe positioning device |
| US6100707A (en) * | 1998-09-25 | 2000-08-08 | Electro Scientific Industries, Inc. | Apparatus for testing multi-terminal electronic components |
| JP3662756B2 (ja) * | 1999-01-11 | 2005-06-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | プローバ圧接装置及びプローバ圧接方法 |
| CA2262175C (en) * | 1999-02-16 | 2008-02-12 | Mold-Masters Limited | Injection molding apparatus with removable nozzle seal |
| JP4106859B2 (ja) * | 2000-06-27 | 2008-06-25 | 沖電気工業株式会社 | 半導体装置の電気的特性試験装置 |
| US6714028B2 (en) * | 2001-11-14 | 2004-03-30 | Electro Scientific Industries, Inc. | Roller contact with conductive brushes |
| JP4173306B2 (ja) * | 2001-11-30 | 2008-10-29 | 東京エレクトロン株式会社 | 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法 |
| JP4123408B2 (ja) * | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | プローブカード交換装置 |
| JP4017586B2 (ja) * | 2003-10-29 | 2007-12-05 | 三洋電機株式会社 | 電池の充電方法 |
| US7443179B2 (en) * | 2006-11-30 | 2008-10-28 | Electro Scientific Industries, Inc. | Zero motion contact actuation |
-
2007
- 2007-04-26 US US11/740,480 patent/US7839138B2/en active Active
-
2008
- 2008-01-25 JP JP2009548372A patent/JP5143143B2/ja not_active Expired - Fee Related
- 2008-01-25 TW TW097102902A patent/TWI409999B/zh not_active IP Right Cessation
- 2008-01-25 KR KR1020097017635A patent/KR101441156B1/ko not_active Expired - Fee Related
- 2008-01-25 WO PCT/US2008/052050 patent/WO2008094831A1/en not_active Ceased
- 2008-01-25 CN CN2008800033332A patent/CN101589518B/zh not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317788A (ja) * | 1987-06-19 | 1988-12-26 | Tokyo Electron Ltd | 検査装置 |
| JP2005134421A (ja) * | 2003-10-28 | 2005-05-26 | Internatl Business Mach Corp <Ibm> | アクティブマトリックスパネルの検査装置、アクティブマトリックスパネルの検査方法、およびアクティブマトリックスoledパネルの製造方法 |
| JP2006194831A (ja) * | 2005-01-17 | 2006-07-27 | Humo Laboratory Ltd | チップ形電子部品特性検査分類装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010517058A (ja) | 2010-05-20 |
| TW200847540A (en) | 2008-12-01 |
| CN101589518A (zh) | 2009-11-25 |
| US20080180117A1 (en) | 2008-07-31 |
| WO2008094831A1 (en) | 2008-08-07 |
| US7839138B2 (en) | 2010-11-23 |
| JP5143143B2 (ja) | 2013-02-13 |
| KR20090107069A (ko) | 2009-10-12 |
| CN101589518B (zh) | 2012-09-19 |
| KR101441156B1 (ko) | 2014-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |