JP5142919B2 - フリットを用いた気密封止装置及び気密封止方法 - Google Patents
フリットを用いた気密封止装置及び気密封止方法 Download PDFInfo
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- JP5142919B2 JP5142919B2 JP2008249935A JP2008249935A JP5142919B2 JP 5142919 B2 JP5142919 B2 JP 5142919B2 JP 2008249935 A JP2008249935 A JP 2008249935A JP 2008249935 A JP2008249935 A JP 2008249935A JP 5142919 B2 JP5142919 B2 JP 5142919B2
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- 238000007789 sealing Methods 0.000 title claims description 37
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 81
- 239000011521 glass Substances 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
- B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Description
200 ガラスマスク
300 マザーガラス基板
310,320 有機発光セル
400a,400b,400c 下部支持部材
500(500a,500b,500c,500d) 加圧部材(シリンダ)
510 ローラ
520 移動式ボール
600 ベッド部材
L 移動式照射部材
f フリット
Claims (7)
- フリットを用いて第1基板と第2基板とを貼り合わせる気密封止装置において、
前記第1基板の上面に配置されたガラスマスクと、
該ガラスマスクの上面に配置された支持部材と、
前記ガラスマスクの上面に離隔して位置し、前記第1基板の下面の外郭領域に閉曲線状に配置された前記フリットに対して、前記閉曲線に対応する軌跡を移動しながら、レーザを照射して前記フリットを加熱するレーザ照射部材と、
前記第2基板の下面の外郭領域に配置され、前記第2基板を支持する複数の下部支持部材と、
該下部支持部材の下面に配置されており、前記下部支持部材に上方に加圧力を加えることにより、加熱された前記フリットを加圧する加圧部材とを含み、
前記複数の下部支持部材は、隣接する第2基板のフリット間の距離よりも大きな一定の幅を有することを特徴とする、フリットを用いた気密封止装置。 - 前記加圧部材は、前記閉曲線状に配置され、上昇運動時、前記下部支持部材と接触して前記加圧力を加えるピストンを備えた複数のシリンダからなることを特徴とする、請求項1に記載のフリットを用いた気密封止装置。
- 前記加圧部材は、前記下部支持部材と接触するロールが備えられており、前記閉曲線状に対応する軌跡を移動するローラからなることを特徴とする、請求項1に記載のフリットを用いた気密封止装置。
- 前記加圧部材は、前記下部支持部材と接触するボールが備えられており、前記閉曲線状に対応する軌跡を移動する1つ以上の移動式ボールからなることを特徴とする、請求項1に記載のフリットを用いた気密封止装置。
- 前記支持部材の下面に備えられ、弾性力を有する部材で形成される接触部材をさらに含むことを特徴とする、請求項1に記載のフリットを用いた気密封止装置。
- 前記第2基板の下面に配置され、前記下部支持部材の間に位置し、前記第2基板を支持するベッド部材をさらに含むことを特徴とする、請求項1に記載のフリットを用いた気密封止装置。
- フリットを用いて第1基板と第2基板とを貼り合わせる気密封止方法において、
前記第1基板上に配置されたガラスマスクの上面に離隔して位置するレーザ照射部材が、前記第1基板の下面の外郭領域に閉曲線状に配置された前記フリットに対して、前記閉曲線に対応する軌跡を移動しながら、レーザを照射して前記フリットを加熱するステップと、
前記第2基板の下面の外郭領域に配置され、前記第2基板を支持する複数の下部支持部材の下面に配置された加圧部材が、前記下部支持部材に上方に加圧力を加えることにより、加熱された前記フリットを加圧するステップとを含み、
前記複数の下部支持部材は、隣接する第2基板のフリット間の距離よりも大きな一定の幅を有していることを特徴とする、フリットを用いた気密封止方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0024345 | 2008-03-17 | ||
KR1020080024345A KR100926622B1 (ko) | 2008-03-17 | 2008-03-17 | 프릿을 이용한 기밀 밀봉 장치 및 기밀 밀봉 방법 |
Publications (2)
Publication Number | Publication Date |
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JP2009224310A JP2009224310A (ja) | 2009-10-01 |
JP5142919B2 true JP5142919B2 (ja) | 2013-02-13 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008249935A Active JP5142919B2 (ja) | 2008-03-17 | 2008-09-29 | フリットを用いた気密封止装置及び気密封止方法 |
Country Status (4)
Country | Link |
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US (1) | US7807009B2 (ja) |
JP (1) | JP5142919B2 (ja) |
KR (1) | KR100926622B1 (ja) |
CN (1) | CN101540301B (ja) |
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US8440479B2 (en) * | 2009-05-28 | 2013-05-14 | Corning Incorporated | Method for forming an organic light emitting diode device |
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KR101243920B1 (ko) * | 2010-01-07 | 2013-03-14 | 삼성디스플레이 주식회사 | 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법 |
JP2011210431A (ja) * | 2010-03-29 | 2011-10-20 | Canon Inc | 気密容器の製造方法 |
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JP2012059401A (ja) | 2010-09-06 | 2012-03-22 | Canon Inc | 気密容器の製造方法 |
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KR101859964B1 (ko) * | 2011-06-29 | 2018-05-24 | 삼성디스플레이 주식회사 | 기판 밀봉장치 및 이를 이용한 기판의 밀봉방법 |
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KR102145887B1 (ko) | 2013-08-09 | 2020-08-20 | 삼성디스플레이 주식회사 | 프릿 실링 시스템 |
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2008
- 2008-03-17 KR KR1020080024345A patent/KR100926622B1/ko active IP Right Grant
- 2008-08-18 US US12/228,994 patent/US7807009B2/en active Active
- 2008-09-29 JP JP2008249935A patent/JP5142919B2/ja active Active
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Publication number | Publication date |
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CN101540301B (zh) | 2011-07-13 |
KR100926622B1 (ko) | 2009-11-11 |
US20090229745A1 (en) | 2009-09-17 |
JP2009224310A (ja) | 2009-10-01 |
US7807009B2 (en) | 2010-10-05 |
KR20090099222A (ko) | 2009-09-22 |
CN101540301A (zh) | 2009-09-23 |
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