JP5131438B2 - 圧電デバイスの製造方法 - Google Patents

圧電デバイスの製造方法 Download PDF

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Publication number
JP5131438B2
JP5131438B2 JP2007219477A JP2007219477A JP5131438B2 JP 5131438 B2 JP5131438 B2 JP 5131438B2 JP 2007219477 A JP2007219477 A JP 2007219477A JP 2007219477 A JP2007219477 A JP 2007219477A JP 5131438 B2 JP5131438 B2 JP 5131438B2
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JP
Japan
Prior art keywords
piezoelectric
base
brazing material
layer
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007219477A
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English (en)
Japanese (ja)
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JP2009055283A (ja
JP2009055283A5 (https=
Inventor
達也 安齊
幸弘 利根川
英雄 棚谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2007219477A priority Critical patent/JP5131438B2/ja
Publication of JP2009055283A publication Critical patent/JP2009055283A/ja
Publication of JP2009055283A5 publication Critical patent/JP2009055283A5/ja
Application granted granted Critical
Publication of JP5131438B2 publication Critical patent/JP5131438B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2007219477A 2007-08-27 2007-08-27 圧電デバイスの製造方法 Expired - Fee Related JP5131438B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007219477A JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007219477A JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2009055283A JP2009055283A (ja) 2009-03-12
JP2009055283A5 JP2009055283A5 (https=) 2010-10-07
JP5131438B2 true JP5131438B2 (ja) 2013-01-30

Family

ID=40505953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007219477A Expired - Fee Related JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Country Status (1)

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JP (1) JP5131438B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249424A (ja) * 2010-05-24 2011-12-08 Daishinku Corp 電子部品パッケージの封止部材、電子部品パッケージ、及び電子部品パッケージの封止部材の製造方法
US8975517B2 (en) 2011-03-18 2015-03-10 Daishinku Corporation Electronic component package, electronic component, and electronic component package manufacturing method
JP2015079866A (ja) * 2013-10-17 2015-04-23 住友金属鉱山株式会社 ろう材付きパッケージ封止用蓋とその製造方法、及びそれを用いたパッケージ型電子部品の封止方法、並びにパッケージ型電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718380B2 (ja) * 1999-08-18 2005-11-24 株式会社日立製作所 はんだ接続構造を有する回路装置およびその製造方法
JP4514400B2 (ja) * 2001-09-27 2010-07-28 古河電気工業株式会社 部材の接合方法、その方法で得られた接合部材
JP3994980B2 (ja) * 2004-03-29 2007-10-24 株式会社日立製作所 素子搭載用基板及びその製造方法並びに半導体素子実装方法
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
JP4630338B2 (ja) * 2006-02-15 2011-02-09 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法

Also Published As

Publication number Publication date
JP2009055283A (ja) 2009-03-12

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