JP2009055283A5 - - Google Patents

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Publication number
JP2009055283A5
JP2009055283A5 JP2007219477A JP2007219477A JP2009055283A5 JP 2009055283 A5 JP2009055283 A5 JP 2009055283A5 JP 2007219477 A JP2007219477 A JP 2007219477A JP 2007219477 A JP2007219477 A JP 2007219477A JP 2009055283 A5 JP2009055283 A5 JP 2009055283A5
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JP
Japan
Prior art keywords
base
heating
lid
ausn alloy
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007219477A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009055283A (ja
JP5131438B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2007219477A priority Critical patent/JP5131438B2/ja
Priority claimed from JP2007219477A external-priority patent/JP5131438B2/ja
Publication of JP2009055283A publication Critical patent/JP2009055283A/ja
Publication of JP2009055283A5 publication Critical patent/JP2009055283A5/ja
Application granted granted Critical
Publication of JP5131438B2 publication Critical patent/JP5131438B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007219477A 2007-08-27 2007-08-27 圧電デバイスの製造方法 Expired - Fee Related JP5131438B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007219477A JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007219477A JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2009055283A JP2009055283A (ja) 2009-03-12
JP2009055283A5 true JP2009055283A5 (https=) 2010-10-07
JP5131438B2 JP5131438B2 (ja) 2013-01-30

Family

ID=40505953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007219477A Expired - Fee Related JP5131438B2 (ja) 2007-08-27 2007-08-27 圧電デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP5131438B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249424A (ja) * 2010-05-24 2011-12-08 Daishinku Corp 電子部品パッケージの封止部材、電子部品パッケージ、及び電子部品パッケージの封止部材の製造方法
US8975517B2 (en) 2011-03-18 2015-03-10 Daishinku Corporation Electronic component package, electronic component, and electronic component package manufacturing method
JP2015079866A (ja) * 2013-10-17 2015-04-23 住友金属鉱山株式会社 ろう材付きパッケージ封止用蓋とその製造方法、及びそれを用いたパッケージ型電子部品の封止方法、並びにパッケージ型電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718380B2 (ja) * 1999-08-18 2005-11-24 株式会社日立製作所 はんだ接続構造を有する回路装置およびその製造方法
JP4514400B2 (ja) * 2001-09-27 2010-07-28 古河電気工業株式会社 部材の接合方法、その方法で得られた接合部材
JP3994980B2 (ja) * 2004-03-29 2007-10-24 株式会社日立製作所 素子搭載用基板及びその製造方法並びに半導体素子実装方法
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
JP4630338B2 (ja) * 2006-02-15 2011-02-09 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法

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