JP2009073943A5 - - Google Patents

Download PDF

Info

Publication number
JP2009073943A5
JP2009073943A5 JP2007244521A JP2007244521A JP2009073943A5 JP 2009073943 A5 JP2009073943 A5 JP 2009073943A5 JP 2007244521 A JP2007244521 A JP 2007244521A JP 2007244521 A JP2007244521 A JP 2007244521A JP 2009073943 A5 JP2009073943 A5 JP 2009073943A5
Authority
JP
Japan
Prior art keywords
bonding film
adherend
region
bonding
metal atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007244521A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009073943A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007244521A priority Critical patent/JP2009073943A/ja
Priority claimed from JP2007244521A external-priority patent/JP2009073943A/ja
Publication of JP2009073943A publication Critical patent/JP2009073943A/ja
Publication of JP2009073943A5 publication Critical patent/JP2009073943A5/ja
Withdrawn legal-status Critical Current

Links

JP2007244521A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009073943A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244521A JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244521A JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009073943A JP2009073943A (ja) 2009-04-09
JP2009073943A5 true JP2009073943A5 (https=) 2010-09-02

Family

ID=40609243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244521A Withdrawn JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Country Status (1)

Country Link
JP (1) JP2009073943A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569358B2 (ja) * 2015-07-29 2019-09-04 セイコーエプソン株式会社 電子デバイス、液体噴射ヘッド、および、電子デバイスの製造方法
KR101888097B1 (ko) * 2017-06-13 2018-08-14 호서대학교 산학협력단 유기발광 다이오드 봉지구조체 및 그 제조방법
GB2573278A (en) * 2018-04-25 2019-11-06 Saralon Gmbh Method of electrically connecting two surfaces
WO2022038876A1 (ja) * 2020-08-20 2022-02-24 長瀬産業株式会社 高分子フィルムと銅箔の接合方法、高分子フィルム積層体および高分子フィルム積層体を備えるデバイス
WO2022038875A1 (ja) * 2020-08-20 2022-02-24 長瀬産業株式会社 高分子フィルム積層体の製造方法、高分子フィルム積層体および高分子フィルム積層体を備えるデバイス
CN114891449B (zh) * 2022-04-25 2024-02-02 歌尔股份有限公司 一种激光胶膜粘接工艺方法以及智能手表
CN115775722B (zh) * 2022-09-08 2025-11-18 武汉新芯集成电路股份有限公司 键合装置及键合方法
CN116241535A (zh) * 2023-01-06 2023-06-09 歌尔股份有限公司 屏幕粘接方法及电子设备

Similar Documents

Publication Publication Date Title
JP2009073943A5 (https=)
JP2007518865A5 (https=)
US9266310B2 (en) Methods of joining device structures with adhesive
WO2008076390A3 (en) Dry adhesives and methods for making dry adhesives
JP2012524159A5 (https=)
RU2013128449A (ru) Способ изготовления панели, включающей износостойкий слой, и панель
WO2008094758A8 (en) Method of bonding perfluoroelastomeric materials to a surface
JP2009529442A5 (https=)
JP2004503066A5 (https=)
JP2010526931A5 (https=)
PL1762377T3 (pl) Sposób wytwarzania laminatu
WO2009037797A1 (ja) 表示装置の製造方法及び積層構造体
JP2010082857A5 (https=)
JP2009028923A5 (https=)
WO2009069576A1 (ja) 粘着シート、その製造方法、およびその貼合方法
JP2010511568A5 (https=)
EP2154710A3 (en) Substrate joining method and 3-D semiconductor device
JP2011527241A5 (https=)
WO2006102957A8 (de) Verfahren zur kaschierung flächiger trägermaterialien auf substraten
JP2005536602A5 (https=)
JP2023027234A5 (https=)
JP2009072813A5 (https=)
TW200629462A (en) Supporting plate attaching method
JP2009076697A5 (https=)
WO2006132382A3 (en) Method of manufacturing a film