JP2009072813A5 - - Google Patents
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- Publication number
- JP2009072813A5 JP2009072813A5 JP2007244520A JP2007244520A JP2009072813A5 JP 2009072813 A5 JP2009072813 A5 JP 2009072813A5 JP 2007244520 A JP2007244520 A JP 2007244520A JP 2007244520 A JP2007244520 A JP 2007244520A JP 2009072813 A5 JP2009072813 A5 JP 2009072813A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding film
- adherend
- region
- bonding
- metal atom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007244520A JP2009072813A (ja) | 2007-09-20 | 2007-09-20 | 接合方法および接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007244520A JP2009072813A (ja) | 2007-09-20 | 2007-09-20 | 接合方法および接合体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009072813A JP2009072813A (ja) | 2009-04-09 |
| JP2009072813A5 true JP2009072813A5 (https=) | 2010-09-02 |
Family
ID=40608337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007244520A Withdrawn JP2009072813A (ja) | 2007-09-20 | 2007-09-20 | 接合方法および接合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009072813A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014188536A (ja) * | 2013-03-26 | 2014-10-06 | National Institute For Materials Science | 金属材の拡散接合方法および金属材の拡散接合装置 |
| CN114999948A (zh) * | 2022-06-06 | 2022-09-02 | 闽南师范大学 | 一种高真空磁控溅射热压键合一体机以及键合方法 |
-
2007
- 2007-09-20 JP JP2007244520A patent/JP2009072813A/ja not_active Withdrawn
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