GB2573278A - Method of electrically connecting two surfaces - Google Patents

Method of electrically connecting two surfaces Download PDF

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Publication number
GB2573278A
GB2573278A GB1806721.5A GB201806721A GB2573278A GB 2573278 A GB2573278 A GB 2573278A GB 201806721 A GB201806721 A GB 201806721A GB 2573278 A GB2573278 A GB 2573278A
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GB
United Kingdom
Prior art keywords
conducting
functional group
layer
adhesive layer
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1806721.5A
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GB201806721D0 (en
Inventor
Ali Moazzam
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Saralon GmbH
Original Assignee
Saralon GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saralon GmbH filed Critical Saralon GmbH
Priority to GB1806721.5A priority Critical patent/GB2573278A/en
Publication of GB201806721D0 publication Critical patent/GB201806721D0/en
Publication of GB2573278A publication Critical patent/GB2573278A/en
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10733—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing epoxy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/025—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/025—Particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/14—Glass
    • C09J2400/143—Glass in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A method of electrically adhering two surfaces comprises (i) providing a first conducting layer 120 on a first surface 111 and a second conducting layer 140 on a second surface 131, (ii) providing a first conducting adhesive 150 on the first layer and a second conducting adhesive 160 on the second layer, the first adhesive comprising conductive particle(s), hot melt polymer, and first anchoring polymer with a first functional group and the second adhesive comprising conductive particle(s), hot melt polymer, and second anchoring polymer with a second functional group, (iii) heating first and/or second adhesives, and (iv) contacting first and second adhesives to create covalent bonds between first and second functional groups. One of the functional groups may be amine and the other may be epoxy. Alternatively, one of the functional groups may be thiol and the other may be a carbon-carbon double bond. One of the surfaces may be a glass bottle (200, Fig. 2) and the other may be a flexible plastics substrate (210, Fig. 2).

Description

Method of electrically connecting two surfaces
CROSS-RELATION TO OTHER APPLICATIONS [0001] None
FIELD OF THE INVENTION [0002] The present disclosure relates to a method to electrically connect a first conducting layer to a second conducting layer by using electrically conducting adhesive.
BACKGROUND OF THE INVENTION [0003] Flexible electronics is an emerging field. New demands for flexible electronics are coming in the field of use-and-throw low cost electronics, for example smart and intelligent packages. Flexible electronics are produced on paper or plastic substrate. Printed conducting layers can be provided on a flexible substrate by a printing method and by using a conducting ink. For some applications, flexible circuit board needs to be electrically connected to other conducting layer, provided on a different surface, by using electrically conducting adhesive. In the state of the art, there are very few methods available for this purpose. A simple method is to use pressure sensitive adhesive mixed with conducting particles. Generally, pressure sensitive adhesives are not strong enough and over time resistance of the contact area increases which can cause heating of the contact area. Another method is by using epoxy-amine based conducting adhesive. But this kind of adhesive needs long curing time (>5 minutes) and higher temperature (>90°C). From an economical point of view this is a slow process, hence expensive. Therefore, there is a need of an economical production method to electrically connect two conducting layers by using some conducting adhesive layer.
SUMMARY OF THE INVENTION [0004] The present invention relates to a method of attaching a first conducting layer provided on a substrate, more specifically on a flexible substrate to a second conducting layer of a second surface. In the first step a first conducting layer is provided on a first surface of a first material. Next, a first conducting adhesive layer is provided on the first conducting layer. The first conducting adhesive layer comprises at least one hot melt polymer, at least one first
-1anchoring polymer and at least one conducting particle. The at least one first anchoring polymer comprises at least one first functional group. In the next step, a second conducting adhesive layer is provided on a second conducting layer, wherein the second conducting layer is provided on a second surface of a second material. The second conducting adhesive layer comprises at least one hot melt polymer, at least one second anchoring polymer and at least one conducting particle. The at least one second anchoring polymer comprises at least one second functional group. After that, at least one of the first conducting adhesive layer and the second conducting adhesive layer is heated up to make the hot melt polymer sticky. In the final step, the first conducting adhesive layer and the second conducting adhesive layer are brought into contact to each other to establish electrical contact between the first conducting layer and the second conducting layer. The strong adhesion between first conducting adhesive layer and the second conducting adhesive layer comes due to the two kinds of chemical interaction involved. First one is the Van der Waals interactions between hot melt polymer chains and the second one is covalent bonds between the first functional group and the second functional group.
BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1A is a cross sectional view of conducting layers provided on two materials, in accordance with an aspect of the present invention.
[0006] FIG. IB is a cross sectional view of a conducting adhesive layer provided on a first material, in accordance with an aspect of the present invention.
[0007] FIG. 1C is a cross sectional view of conducting adhesive layers on two materials, in accordance with an aspect of the present invention.
[0008] FIG. ID is a cross sectional view of an electrically and physical connected two conducting adhesive layers, in accordance with an aspect of the present invention.
[0009] FIG. 2 is cross sectional view of an application of an aspect of the present invention.
-3DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [00010] The invention will now be described in detail. Drawings and examples are provided for better illustration of the invention. It will be understood that the embodiments and aspects of the invention described herein are only examples and do not limit the protector’s scope of the claims in any way. The invention is defined by the claims and their equivalents. It will be understood that features of one aspect or embodiment of the invention can be combined with the feature of a different aspect or aspects and/or embodiments of the invention.
[00011] The term “functional group” as used in this disclosure refers to a specific group of atoms or bonds within a molecule or a polymer that are responsible for a specific chemical reaction. For example, a carbon-carbon double bond can be called an alkenyl functional group, which may participate in a radical reaction. It is known in literature that a carbon-carbon double bond reacts with a thiol functional group easily and an epoxy functional group reacts with an amine functional group easily.
[00012] The present invention is about a method to electrically and physically connect a first surface of a first material on a second surface of a second material. Fig. 1A shows a cross sectional view of a first material 110. On a first surface 111 of the first material 110 is provided a first conducting layer 120. The first material 110 can be mechanically flexible. In a nonlimiting aspect, the first material 110 is paper, plastic or laminate. The first conducting layer 120 can be provided on the first material 110 by a printing method and by using a conducting ink. In another aspect, the first conducting layer 120 can be provided on the first material 110 by etching out a metal layer from the first surface 111. Fig. 1A also shows a cross sectional view of a second material 130, having a second surface 131. A second conducting layer 140 is provided on the second surface 131. A first conducting adhesive layer 150 is provided on the first conducting layer 120, as shown in Fig. IB. The first conducting adhesive layer 150 comprises at least one hot melt polymer 151, at least one first anchoring polymer (or oligomer or molecule) 152 and at least one conducting particle 153. The at least one hot melt polymer 151 is a thermoplastic which becomes sticky and behaves as an adhesive after heating it up above a certain temperature. In a non-limiting aspect, this temperature is 50°C. Hot melt thermoplastic adhesives are well known in state-of-the-art. Some of the hot melt polymer 151 are Pearlstick™, Peralbond™ and Estane® from Lubrizol company. The at least one conducting particle 153 is any electrically conducting particle e.g. silver, carbon, copper etc.
-4The purpose of the at least one conducting particle 153 is to make the first conducting adhesive layer 150 electrically conducting. The at least one first anchoring polymer 152 comprises at least one first functional group 154. The at least one first functional group 154 is attached to the polymeric chain of the first anchoring polymer 152. The first functional group 154 is selected from the group of epoxy, thiol, acrylate, methacrylate and alkenyl. The first anchoring polymer 152 can be selected, but not limited to, from a group of polyaniline, polycarboxylic acid, multiple thiol functional groups containing molecule or polymer, multiple epoxy functional groups containing molecule or polymer, multiple acrylate functional groups containing molecule or polymer, multiple methacrylate functional groups containing molecule or polymer etc. In a non-limiting aspect, the first conducting adhesive layer 150 is provided on the first conducting layer 120 by a printing method. It is understood here that after printing a layer, a heating and/or a curing step is needed to convert a wet printed layer into a solid layer or semi solid layer.
[00013] In the next step, a second conducting adhesive layer 160 is provided on the second conducting layer 140, as shown in Fig. 1C. The second conducting adhesive layer 160 comprises at least one hot melt polymer 161, at least one second anchoring polymer 162 and at least one conducting particle 163. The at least one hot melt polymer 161 is a thermoplastic which becomes sticky and behaves as an adhesive after heating it up above a certain temperature. In a preferred aspect of the invention, the at least one hot melt polymer 151 of the first conducting adhesive layer 150 and the at least one hot melt polymer 161 of the second conducting adhesive layer 160 are the same material. The at least one conducting particle 163 is any electrically conducting particle e.g. silver, carbon, copper etc. The at least one second anchoring polymer 162 comprises at least one second functional group 164. The at least one second functional group 164 is attached to the polymeric chain of the second anchoring polymer 162. The second functional group 164 is selected from a group of epoxy, thiol, acrylate, methacrylate and alkenyl. The second anchoring polymer 162 can be selected, but not limited to, from a group of polyaniline, polycarboxylic acid, multiple thiol functional groups containing molecule or polymer, multiple epoxy functional groups containing molecule or polymer, multiple acrylate functional groups containing molecule or polymer, multiple methacrylate functional groups containing molecule or polymer etc. In a non-limiting aspect, second conducting adhesive layer 160 is provided on the second conducting layer 140 by a printing method. It is understood here that after printing a layer, a heating and/or a curing step is needed to convert a wet printed layer into a sold layer or semi solid layer.
-5[00014] In the final step, at least one of the second conducting adhesive layer 160 and the first conducting adhesive layer 150 is heated up so that the hot melt polymer 151 and/or 161 becomes sticky. In a preferred embodiment, at least one of the second conducting adhesive layer 160 and the first conducting adhesive layer 150 is heated above 100 °C. After heating, the second conducting adhesive layer 160 is brought into contact with the first conducting adhesive layer 150, as shown in Fig. ID. It is also possible to first bring the second conducting adhesive layer 160 into contact with the first conducting adhesive layer 150 and then heating both the layers. When in contact, some of the first functional group 154 makes covalent bonds 170 with some of the second functional group 164. These covalent bonds 170 make the adhesion very strong. The hot melt polymer 151 and the hot melt polymer 161 makes Van der Waals bonds.
[00015] The first functional group 154 and the second functional group 164 are selected in such a way that when they come into contact, they react to each other themselves. If first functional group 154 is an epoxy, then the second functional group 164 is selected an amine or a carboxylic acid. If first functional group 154 is an amine or a carboxylic acid, then the second functional group 164 is selected an epoxy. If first functional group 154 is a thiol, then the second functional group 164 is selected from a carbon-carbon double bond based functional group. The carbon-carbon double bond based functional group can be alkenyl, acrylate and methacrylate. If first functional group 154 is selected from a carbon-carbon double bond based functional group, then the second functional group 164 is thiol.
[00016] Fig. 2 shows an application of the present invention, without liming the scope of the invention. Here, the first material is a plastic substrate 210. On a first surface 211 of the plastic substrate 210 is printed a first conducting layer 220. On a portion of the first conducting layer 220, is printed a first conducting adhesive layer 250. The first conducting adhesive layer 250 comprises at least one hot melt polymer 251, at least one first anchoring polymer (or oligomer or molecule) 252 and at least one conducting particle 253. The at least one first anchoring polymer 252 comprises at least one first functional group 254. On a second surface 231 of the second material 230 is provided a second conducting layer 240. The second material 230 is here a glass bottle 200. On top of the second conducting layer 240 is provided a second conducting adhesive layer 260. The second conducting adhesive layer 260 comprises at least one hot melt polymer 261, at least one second anchoring polymer (or oligomer or molecule) 262 and at least one conducting particle 263. The at least one second anchoring polymer 262 comprises at least
-6one second functional group 264. The first conducting adhesive layer 250 and the second conducting adhesive layer 260 are heated and connected to establish an electrical connection between the first conducting layer 220 and the second conducting layer 240. Because of the covalent bond 270 formation between the first functional group 254 and the second functional group 264, the adhesion is strong. This kind of electrical connection can be used for powering electronics devices e.g. SMD LEDs or printed AC driven electroluminescent display 290 provided on the bottle 200. A battery and/or a controlling circuit 280 can be provided on the first material 210 and connected to the first conducting layer 220.

Claims (5)

1. A method of electrically connecting a first surface (111) to a second surface (131), comprising the steps of
a. providing a first conducting layer (120) on the first surface (111) and a second conducting layer (140) on the second surface (131);
b. providing a first conducting adhesive layer (150) on the first conducting layer (120), wherein the first conducting adhesive layer (150) comprises at least one hot melt polymer (151), at least one first anchoring polymer (152) and at least one conducting particle (153), the at least one first anchoring polymer (152) comprises at least one first functional group (154);
c. providing a second conducting adhesive layer (160) on the second conducting layer (140), wherein the second conducting adhesive layer (160) comprises at least one hot melt polymer (161), at least one second anchoring polymer (162) and at least one conducting particle (163), the at least one second anchoring polymer (162) comprises at least one second functional group (164);
d. heating up at least one of the first conducting adhesive layer (150) and the second conducting adhesive layer (160); and
e. bringing the first conducting adhesive layer (150) and the second conducting adhesive layer (160) into contact to create covalent bonds (170) between some of the at least one first functional group (154) and some of the at least one second functional group (164) and hence to attach the first conducting layer (120) to the second conducting layer (140).
2. The method of claim 1, wherein one of the at least one of the first surface (111, 211) and the second surface (131, 231) is a surface of a glass bottle (200) and another of the at least one of the first surface (111,211) and the second surface (131, 231) is a surface of a flexible plastic substrate (210).
3. The method of claim 1, wherein the at least one hot melt polymer (151, 161) becomes sticky above 50°C.
4. The method of claim 1, wherein one of the at least one first functional group (154) and the at least one second functional group (164) is an amine and another of the at least one first functional group (154) and the at least one second functional group (164) is an epoxy.
5. The method of claim 1, wherein one of the at least one first functional group (154) and the at least one second functional group (164) is a thiol and another of the at least one first
-8functional group (154) and the at least one second functional group (164) is a carbon-carbon double bond.
GB1806721.5A 2018-04-25 2018-04-25 Method of electrically connecting two surfaces Withdrawn GB2573278A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009073943A (en) * 2007-09-20 2009-04-09 Seiko Epson Corp Joining method and joined body
US20140308465A1 (en) * 2013-04-15 2014-10-16 Apple Inc. Liquid-Based Pressure Sensitive Adhesive for Grounding Applications

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009073943A (en) * 2007-09-20 2009-04-09 Seiko Epson Corp Joining method and joined body
US20140308465A1 (en) * 2013-04-15 2014-10-16 Apple Inc. Liquid-Based Pressure Sensitive Adhesive for Grounding Applications

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