JP5130939B2 - 半導体用接着組成物およびそれを用いた半導体装置の製造方法 - Google Patents
半導体用接着組成物およびそれを用いた半導体装置の製造方法 Download PDFInfo
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- JP5130939B2 JP5130939B2 JP2008031396A JP2008031396A JP5130939B2 JP 5130939 B2 JP5130939 B2 JP 5130939B2 JP 2008031396 A JP2008031396 A JP 2008031396A JP 2008031396 A JP2008031396 A JP 2008031396A JP 5130939 B2 JP5130939 B2 JP 5130939B2
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| JP5444986B2 (ja) * | 2009-09-16 | 2014-03-19 | 東レ株式会社 | 半導体用接着組成物、それを用いた半導体装置 |
| WO2011049011A1 (ja) * | 2009-10-19 | 2011-04-28 | 東レ株式会社 | 感光性接着剤組成物、感光性接着剤シートおよびこれらを用いた半導体装置 |
| JP5630639B2 (ja) * | 2010-07-07 | 2014-11-26 | 住友電気工業株式会社 | フィルム状導電性接着剤 |
| JP5779895B2 (ja) * | 2011-02-08 | 2015-09-16 | 東レ株式会社 | 半導体用絶縁性接着剤 |
| MY169367A (en) | 2011-11-29 | 2019-03-26 | Toray Industries | Resin composition, resin composition sheet, semiconductor device and production method therefor |
| CN105339410B (zh) * | 2014-06-04 | 2019-08-20 | 日立化成株式会社 | 膜状环氧树脂组合物、膜状环氧树脂组合物的制造方法和半导体装置的制造方法 |
| WO2018194156A1 (ja) * | 2017-04-21 | 2018-10-25 | 日立化成株式会社 | 半導体装置及びその製造方法 |
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| JP4449325B2 (ja) * | 2003-04-17 | 2010-04-14 | 住友ベークライト株式会社 | 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。 |
| JP4394547B2 (ja) * | 2004-09-13 | 2010-01-06 | ソニーケミカル＆インフォメーションデバイス株式会社 | 異方性導電膜を用いた接続方法 |
| WO2006132165A1 (ja) * | 2005-06-06 | 2006-12-14 | Toray Industries, Inc. | 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 |
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