JP5127481B2 - 発光素子アレイチップおよび露光光源装置 - Google Patents
発光素子アレイチップおよび露光光源装置 Download PDFInfo
- Publication number
- JP5127481B2 JP5127481B2 JP2008019209A JP2008019209A JP5127481B2 JP 5127481 B2 JP5127481 B2 JP 5127481B2 JP 2008019209 A JP2008019209 A JP 2008019209A JP 2008019209 A JP2008019209 A JP 2008019209A JP 5127481 B2 JP5127481 B2 JP 5127481B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- element array
- light
- array chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Devices (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
Description
n−Al0.35Ga0.65As層:〜1μm;Siドーピング
p−Al0.13Ga0.87As層:〜0.5μm;Cドーピング
p−Al0.35Ga0.65As層:〜1μm;Cドーピング
p−GaAs層:0.1〜0.5μm;Cドーピング
2 8セグメント(64発光素子)からなるブロック
3 ワイヤーボンディング用の共有電極パッド
4 8素子からなるセグメント
5 発光点(発光素子)
6 異なるセグメントに属する発光素子の電極を接続する配線
7 ワイヤーボンディング用の電極パッド
11 長辺
12 長辺
13 短辺
23 ワイヤーボンディング用の共有電極パッド
24 8素子からなるセグメント
25 発光点(発光素子)
26 異なるセグメントに属する発光素子の電極を接続する配線
27 ワイヤーボンディング用の電極パッド
201 発光素子アレイチップ
202 発光素子アレイチップ
299 接続部
1000 チップ
1001 チップ
1002 チップ
1010 発光点
1500 接続部
1600 チップの短辺
1999 チップの長手方向
3000 ロッドレンズアレイ
3050 ドライバIC
4000 発光素子チップアレイ
5000 配線基板
Claims (5)
- 基板上に複数の発光素子が二次元配列してなる発光素子アレイチップであって、
該発光素子アレイチップの形状は、第1の辺、第2の辺、前記第1の辺と平行の第3の辺、および前記第2の辺と平行の第4の辺を含み、前記第1の辺と前記第2の辺とが第1の鋭角をなし、前記第3の辺と前記第4の辺とが第2の鋭角をなし、前記第1の辺と前記第4の辺とが第1の鈍角をなし、前記第2の辺と前記第3の辺が第2の鈍角をなして構成される平行四辺形であり、
一つの共通電極に接続されている複数の発光素子が、前記第1の辺の方向に複数列、かつ前記第2の辺の方向に複数列並ぶことで1つのセグメントが形成され、
複数の前記セグメントが前記第2の辺の方向に並ぶことにより発光素子アレイが形成されており、
互いに異なる前記セグメントに属する前記発光素子同士を電気的に接続する配線と、
前記配線を介して前記複数の発光素子と接続された複数の電極パッドとを有し、
複数の前記セグメントのうち前記第1の辺と最近接するセグメントを構成する複数の発光素子と接続された配線は、前記第1の辺と最近接するセグメントを構成する複数の発光素子から、前記第1の鋭角に向かう方向、かつ、前記第2の辺と直交する方向に引き出され、
複数の前記セグメントのうち前記第3の辺と最近接するセグメントを構成する複数の発光素子と接続された配線は、前記第3の辺と最近接するセグメントを構成する複数の発光素子から、前記第2の鋭角に向かう方向、かつ、前記第2の辺と直交する方向に引き出され、
前記複数の電極パッドは、前記第1の鋭角をなしている領域または前記第2の鋭角をなしている領域に配置され、前記第1の鈍角をなしている領域および前記第2の鈍角をなしている領域には配置されていないことを特徴とする発光素子アレイチップ。 - 前記共通電極は、前記第1の鈍角をなしている領域または前記第2の鈍角をなしている領域に配置されていることを特徴とする請求項1に記載の発光素子アレイチップ。
- 請求項1または2に記載の発光素子アレイチップを備え、かつ該発光素子アレイチップから放射される光を集光し結像するためのロッドレンズアレイを有することを特徴とする露光光源装置。
- 前記複数の発光素子は、時分割で駆動されることを特徴とする請求項3に記載の露光光源装置。
- 前記複数の発光素子は、同時に駆動されることを特徴とする請求項3または4に記載の露光光源装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008019209A JP5127481B2 (ja) | 2007-02-16 | 2008-01-30 | 発光素子アレイチップおよび露光光源装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007036360 | 2007-02-16 | ||
JP2007036360 | 2007-02-16 | ||
JP2008019209A JP5127481B2 (ja) | 2007-02-16 | 2008-01-30 | 発光素子アレイチップおよび露光光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008227467A JP2008227467A (ja) | 2008-09-25 |
JP5127481B2 true JP5127481B2 (ja) | 2013-01-23 |
Family
ID=39706482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008019209A Expired - Fee Related JP5127481B2 (ja) | 2007-02-16 | 2008-01-30 | 発光素子アレイチップおよび露光光源装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080198592A1 (ja) |
JP (1) | JP5127481B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9472594B2 (en) * | 2012-02-10 | 2016-10-18 | Oculus Vr, Llc | Light emitting diode chip |
JP5994091B2 (ja) * | 2012-05-16 | 2016-09-21 | 株式会社ブイ・テクノロジー | 露光装置 |
JP6129777B2 (ja) * | 2014-03-31 | 2017-05-17 | 株式会社沖データ | 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3612850B2 (ja) * | 1996-03-28 | 2005-01-19 | 富士ゼロックス株式会社 | 光電変換素子アレイ装置、半導体発光素子アレイを用いた光源装置、およびその製造方法 |
JP3185049B2 (ja) * | 1996-11-12 | 2001-07-09 | 沖電気工業株式会社 | 発光素子アレイ及びその製造方法 |
US6388696B1 (en) * | 1997-05-28 | 2002-05-14 | Oki Electric Industry Co., Ltd | Led array, and led printer head |
US6163036A (en) * | 1997-09-15 | 2000-12-19 | Oki Data Corporation | Light emitting element module with a parallelogram-shaped chip and a staggered chip array |
JP2001024232A (ja) * | 1999-07-12 | 2001-01-26 | Nippon Sheet Glass Co Ltd | 発光素子アレイ装置 |
JP2003069078A (ja) * | 2001-08-22 | 2003-03-07 | Sanyo Electric Co Ltd | 発光素子および光プリントヘッド |
JP2004023019A (ja) * | 2002-06-20 | 2004-01-22 | Sanyo Electric Co Ltd | 発光素子アレイ |
US20050151828A1 (en) * | 2004-01-14 | 2005-07-14 | Xerox Corporation. | Xerographic printing system with VCSEL-micro-optic laser printbar |
-
2008
- 2008-01-30 JP JP2008019209A patent/JP5127481B2/ja not_active Expired - Fee Related
- 2008-02-14 US US12/031,087 patent/US20080198592A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2008227467A (ja) | 2008-09-25 |
US20080198592A1 (en) | 2008-08-21 |
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