JP5111954B2 - 静電チャック及びその製造方法 - Google Patents
静電チャック及びその製造方法 Download PDFInfo
- Publication number
- JP5111954B2 JP5111954B2 JP2007165465A JP2007165465A JP5111954B2 JP 5111954 B2 JP5111954 B2 JP 5111954B2 JP 2007165465 A JP2007165465 A JP 2007165465A JP 2007165465 A JP2007165465 A JP 2007165465A JP 5111954 B2 JP5111954 B2 JP 5111954B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- flux
- paste
- ceramic
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007165465A JP5111954B2 (ja) | 2007-06-22 | 2007-06-22 | 静電チャック及びその製造方法 |
| US12/142,014 US20080315536A1 (en) | 2007-06-22 | 2008-06-19 | Electrostatic chuck and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007165465A JP5111954B2 (ja) | 2007-06-22 | 2007-06-22 | 静電チャック及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009004649A JP2009004649A (ja) | 2009-01-08 |
| JP2009004649A5 JP2009004649A5 (enExample) | 2010-04-30 |
| JP5111954B2 true JP5111954B2 (ja) | 2013-01-09 |
Family
ID=40135695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007165465A Active JP5111954B2 (ja) | 2007-06-22 | 2007-06-22 | 静電チャック及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20080315536A1 (enExample) |
| JP (1) | JP5111954B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5284227B2 (ja) * | 2009-09-07 | 2013-09-11 | 日本特殊陶業株式会社 | 静電チャック及び静電チャックの製造方法 |
| JP5712336B2 (ja) * | 2012-12-28 | 2015-05-07 | Hoya株式会社 | マスクブランク用基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、マスクブランク用基板の製造方法及び多層反射膜付き基板の製造方法並びに半導体装置の製造方法 |
| JP5767357B1 (ja) * | 2014-03-26 | 2015-08-19 | Hoya株式会社 | マスクブランク用基板、マスクブランク及び転写用マスク、並びにそれらの製造方法 |
| JP6583897B1 (ja) | 2018-05-25 | 2019-10-02 | ▲らん▼海精研股▲ふん▼有限公司 | セラミック製静電チャックの製造方法 |
| JP7010313B2 (ja) * | 2020-01-31 | 2022-01-26 | 住友大阪セメント株式会社 | セラミックス接合体、静電チャック装置、セラミックス接合体の製造方法 |
| CN114695214A (zh) * | 2020-12-31 | 2022-07-01 | 中国科学院微电子研究所 | 一种晶圆传送机械臂及其制造方法、晶圆的传送方法 |
| JP7744516B2 (ja) * | 2021-10-28 | 2025-09-25 | インテグリス・インコーポレーテッド | 誘電体層を含む上部セラミック層を含む静電チャック、ならびに関連する方法および構造 |
| KR20240142283A (ko) * | 2022-01-31 | 2024-09-30 | 스미토모 오사카 세멘토 가부시키가이샤 | 세라믹스 접합체, 정전 척 장치, 및 세라믹스 접합체의 제조 방법 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4039338A (en) * | 1972-12-29 | 1977-08-02 | International Business Machines Corporation | Accelerated sintering for a green ceramic sheet |
| JP3604888B2 (ja) * | 1997-01-30 | 2004-12-22 | 日本碍子株式会社 | 窒化アルミニウム質セラミックス基材の接合体、窒化アルミニウム質セラミックス基材の接合体の製造方法及び接合剤 |
| JPH11168134A (ja) * | 1997-12-03 | 1999-06-22 | Shin Etsu Chem Co Ltd | 静電吸着装置およびその製造方法 |
| JP2002170870A (ja) * | 2000-12-01 | 2002-06-14 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板および静電チャック |
| JP3973872B2 (ja) * | 2001-10-17 | 2007-09-12 | 住友大阪セメント株式会社 | 電極内蔵型サセプタ及びその製造方法 |
| JP2003152064A (ja) * | 2001-11-13 | 2003-05-23 | Sumitomo Osaka Cement Co Ltd | 電極内蔵型サセプタ及びその製造方法 |
| TWI228786B (en) * | 2002-04-16 | 2005-03-01 | Anelva Corp | Electrostatic chucking stage and substrate processing apparatus |
| JP4476701B2 (ja) * | 2004-06-02 | 2010-06-09 | 日本碍子株式会社 | 電極内蔵焼結体の製造方法 |
-
2007
- 2007-06-22 JP JP2007165465A patent/JP5111954B2/ja active Active
-
2008
- 2008-06-19 US US12/142,014 patent/US20080315536A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20080315536A1 (en) | 2008-12-25 |
| JP2009004649A (ja) | 2009-01-08 |
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