JP5099987B2 - 回路接続方法および接続構造体 - Google Patents
回路接続方法および接続構造体 Download PDFInfo
- Publication number
- JP5099987B2 JP5099987B2 JP2005213814A JP2005213814A JP5099987B2 JP 5099987 B2 JP5099987 B2 JP 5099987B2 JP 2005213814 A JP2005213814 A JP 2005213814A JP 2005213814 A JP2005213814 A JP 2005213814A JP 5099987 B2 JP5099987 B2 JP 5099987B2
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- JP
- Japan
- Prior art keywords
- conductive particles
- connection
- conductive
- chip
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Wire Bonding (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005213814A JP5099987B2 (ja) | 2005-07-25 | 2005-07-25 | 回路接続方法および接続構造体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005213814A JP5099987B2 (ja) | 2005-07-25 | 2005-07-25 | 回路接続方法および接続構造体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011034465A Division JP5202662B2 (ja) | 2011-02-21 | 2011-02-21 | 回路接続フィルム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007035743A JP2007035743A (ja) | 2007-02-08 |
JP2007035743A5 JP2007035743A5 (de) | 2008-08-14 |
JP5099987B2 true JP5099987B2 (ja) | 2012-12-19 |
Family
ID=37794663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005213814A Active JP5099987B2 (ja) | 2005-07-25 | 2005-07-25 | 回路接続方法および接続構造体 |
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Country | Link |
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JP (1) | JP5099987B2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105917529A (zh) * | 2014-01-16 | 2016-08-31 | 迪睿合株式会社 | 连接体、连接体的制造方法、连接方法、各向异性导电粘接剂 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4684087B2 (ja) * | 2005-11-21 | 2011-05-18 | 旭化成イーマテリアルズ株式会社 | 連結構造体 |
JP4684086B2 (ja) * | 2005-11-21 | 2011-05-18 | 旭化成イーマテリアルズ株式会社 | 導電粒子の連結構造体 |
JP4933296B2 (ja) * | 2007-02-15 | 2012-05-16 | ダイヤテックス株式会社 | 導電性接着剤組成物、導電性接着シート及び導電性接着テープ |
JP6645730B2 (ja) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
JP7027390B2 (ja) * | 2014-01-28 | 2022-03-01 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
JP6326867B2 (ja) * | 2014-03-04 | 2018-05-23 | 日立化成株式会社 | 接続構造体の製造方法及び接続構造体 |
CN111094487A (zh) * | 2017-09-11 | 2020-05-01 | 日立化成株式会社 | 电路连接用粘接剂膜及其制造方法、电路连接结构体的制造方法、以及粘接剂膜收纳组件 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0429504Y2 (de) * | 1986-02-24 | 1992-07-16 | ||
JPS63102110A (ja) * | 1986-10-17 | 1988-05-07 | 富士ゼロックス株式会社 | 異方導電体及びその製法 |
JP3280685B2 (ja) * | 1991-01-23 | 2002-05-13 | 株式会社東芝 | 異方導電性接着樹脂層及びその製造方法 |
JP2001052778A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Chem Co Ltd | 異方導電性接着フィルムおよびその製造方法 |
JP2001237278A (ja) * | 2000-02-25 | 2001-08-31 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP2002201456A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
WO2003001586A1 (en) * | 2001-06-20 | 2003-01-03 | Toray Engineering Co., Ltd. | Mounting method and device |
JP2003303852A (ja) * | 2002-04-10 | 2003-10-24 | Seiko Epson Corp | 半導体チップの実装構造、配線基板、電気光学装置及び電子機器 |
-
2005
- 2005-07-25 JP JP2005213814A patent/JP5099987B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105917529A (zh) * | 2014-01-16 | 2016-08-31 | 迪睿合株式会社 | 连接体、连接体的制造方法、连接方法、各向异性导电粘接剂 |
Also Published As
Publication number | Publication date |
---|---|
JP2007035743A (ja) | 2007-02-08 |
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