JP5097979B2 - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法 Download PDF

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Publication number
JP5097979B2
JP5097979B2 JP2008215536A JP2008215536A JP5097979B2 JP 5097979 B2 JP5097979 B2 JP 5097979B2 JP 2008215536 A JP2008215536 A JP 2008215536A JP 2008215536 A JP2008215536 A JP 2008215536A JP 5097979 B2 JP5097979 B2 JP 5097979B2
Authority
JP
Japan
Prior art keywords
microetching
treatment step
printed wiring
wiring board
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008215536A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010050397A (ja
Inventor
幸子 中村
篤泰 池尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Priority to JP2008215536A priority Critical patent/JP5097979B2/ja
Priority to TW098127493A priority patent/TWI442858B/zh
Priority to KR1020090078098A priority patent/KR101629010B1/ko
Priority to CN2009101712341A priority patent/CN101662896B/zh
Publication of JP2010050397A publication Critical patent/JP2010050397A/ja
Application granted granted Critical
Publication of JP5097979B2 publication Critical patent/JP5097979B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2008215536A 2008-08-25 2008-08-25 プリント配線板の製造方法 Expired - Fee Related JP5097979B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008215536A JP5097979B2 (ja) 2008-08-25 2008-08-25 プリント配線板の製造方法
TW098127493A TWI442858B (zh) 2008-08-25 2009-08-14 Production method of printed wiring board
KR1020090078098A KR101629010B1 (ko) 2008-08-25 2009-08-24 인쇄 배선판의 제조 방법
CN2009101712341A CN101662896B (zh) 2008-08-25 2009-08-25 印刷布线板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008215536A JP5097979B2 (ja) 2008-08-25 2008-08-25 プリント配線板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011205943A Division JP2012019232A (ja) 2011-09-21 2011-09-21 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JP2010050397A JP2010050397A (ja) 2010-03-04
JP5097979B2 true JP5097979B2 (ja) 2012-12-12

Family

ID=41790559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008215536A Expired - Fee Related JP5097979B2 (ja) 2008-08-25 2008-08-25 プリント配線板の製造方法

Country Status (4)

Country Link
JP (1) JP5097979B2 (zh)
KR (1) KR101629010B1 (zh)
CN (1) CN101662896B (zh)
TW (1) TWI442858B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676908B2 (ja) * 2010-04-21 2015-02-25 上村工業株式会社 プリント配線基板の表面処理方法及び表面処理剤
CN102307435B (zh) * 2011-08-25 2012-11-21 高德（无锡）电子有限公司 一种高密度互联印刷电路板的清洁工艺
KR102065808B1 (ko) * 2012-12-03 2020-01-13 멕크 가부시키가이샤 에칭액, 보급액, 및 구리 배선의 형성 방법
CN105887053A (zh) * 2016-05-06 2016-08-24 广东利尔化学有限公司 一种印制线路板化学镀铜前处理工艺
JP6982383B2 (ja) * 2016-08-10 2021-12-17 上村工業株式会社 還元処理と同時に用いられる無電解めっき用前処理液、およびプリント配線基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644951B2 (ja) * 1991-09-20 1997-08-25 株式会社日立製作所 導体回路の形成方法
JP3804809B2 (ja) * 1996-10-18 2006-08-02 日立化成工業株式会社 多層プリント配線板の製造方法
JP3941433B2 (ja) * 2001-08-08 2007-07-04 株式会社豊田自動織機 ビアホールのスミア除去方法

Also Published As

Publication number Publication date
KR20100024364A (ko) 2010-03-05
CN101662896A (zh) 2010-03-03
JP2010050397A (ja) 2010-03-04
TWI442858B (zh) 2014-06-21
KR101629010B1 (ko) 2016-06-09
TW201010554A (en) 2010-03-01
CN101662896B (zh) 2013-04-10

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