KR101629010B1 - 인쇄 배선판의 제조 방법 - Google Patents

인쇄 배선판의 제조 방법 Download PDF

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Publication number
KR101629010B1
KR101629010B1 KR1020090078098A KR20090078098A KR101629010B1 KR 101629010 B1 KR101629010 B1 KR 101629010B1 KR 1020090078098 A KR1020090078098 A KR 1020090078098A KR 20090078098 A KR20090078098 A KR 20090078098A KR 101629010 B1 KR101629010 B1 KR 101629010B1
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KR
South Korea
Prior art keywords
treatment step
wiring board
printed wiring
micro
agent
Prior art date
Application number
KR1020090078098A
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English (en)
Korean (ko)
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KR20100024364A (ko
Inventor
사치코 나카무라
시게히로 이케지리
Original Assignee
멕크 가부시키가이샤
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Publication of KR20100024364A publication Critical patent/KR20100024364A/ko
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Publication of KR101629010B1 publication Critical patent/KR101629010B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020090078098A 2008-08-25 2009-08-24 인쇄 배선판의 제조 방법 KR101629010B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-215536 2008-08-25
JP2008215536A JP5097979B2 (ja) 2008-08-25 2008-08-25 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20100024364A KR20100024364A (ko) 2010-03-05
KR101629010B1 true KR101629010B1 (ko) 2016-06-09

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ID=41790559

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Application Number Title Priority Date Filing Date
KR1020090078098A KR101629010B1 (ko) 2008-08-25 2009-08-24 인쇄 배선판의 제조 방법

Country Status (4)

Country Link
JP (1) JP5097979B2 (zh)
KR (1) KR101629010B1 (zh)
CN (1) CN101662896B (zh)
TW (1) TWI442858B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676908B2 (ja) * 2010-04-21 2015-02-25 上村工業株式会社 プリント配線基板の表面処理方法及び表面処理剤
CN102307435B (zh) * 2011-08-25 2012-11-21 高德（无锡）电子有限公司 一种高密度互联印刷电路板的清洁工艺
KR102065808B1 (ko) * 2012-12-03 2020-01-13 멕크 가부시키가이샤 에칭액, 보급액, 및 구리 배선의 형성 방법
CN105887053A (zh) * 2016-05-06 2016-08-24 广东利尔化学有限公司 一种印制线路板化学镀铜前处理工艺
JP6982383B2 (ja) * 2016-08-10 2021-12-17 上村工業株式会社 還元処理と同時に用いられる無電解めっき用前処理液、およびプリント配線基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060330A (ja) * 2001-08-08 2003-02-28 Toyota Industries Corp ビアホールのスミア除去方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644951B2 (ja) * 1991-09-20 1997-08-25 株式会社日立製作所 導体回路の形成方法
JP3804809B2 (ja) * 1996-10-18 2006-08-02 日立化成工業株式会社 多層プリント配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060330A (ja) * 2001-08-08 2003-02-28 Toyota Industries Corp ビアホールのスミア除去方法

Also Published As

Publication number Publication date
KR20100024364A (ko) 2010-03-05
CN101662896A (zh) 2010-03-03
JP2010050397A (ja) 2010-03-04
TWI442858B (zh) 2014-06-21
JP5097979B2 (ja) 2012-12-12
TW201010554A (en) 2010-03-01
CN101662896B (zh) 2013-04-10

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