JP5096651B2 - 熱張係数の異なる材料間の低応力界面及びその製造方法 - Google Patents

熱張係数の異なる材料間の低応力界面及びその製造方法 Download PDF

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JP5096651B2
JP5096651B2 JP2000305635A JP2000305635A JP5096651B2 JP 5096651 B2 JP5096651 B2 JP 5096651B2 JP 2000305635 A JP2000305635 A JP 2000305635A JP 2000305635 A JP2000305635 A JP 2000305635A JP 5096651 B2 JP5096651 B2 JP 5096651B2
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Japan
Prior art keywords
layer
tce
laminated structure
flat surface
thermal expansion
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Expired - Fee Related
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JP2000305635A
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English (en)
Japanese (ja)
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JP2001150399A5 (enExample
JP2001150399A (ja
Inventor
フィリップ・ダブリュー・バース
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アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B32B7/028—Heat-shrinkability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3538—Optical coupling means having switching means based on displacement or deformation of a liquid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
JP2000305635A 1999-10-08 2000-10-05 熱張係数の異なる材料間の低応力界面及びその製造方法 Expired - Fee Related JP5096651B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/415,286 US6238805B1 (en) 1999-10-08 1999-10-08 Low-stress interface between materials having different coefficients of expansion and method for fabricating same
US09/415286 1999-10-08

Publications (3)

Publication Number Publication Date
JP2001150399A JP2001150399A (ja) 2001-06-05
JP2001150399A5 JP2001150399A5 (enExample) 2007-11-22
JP5096651B2 true JP5096651B2 (ja) 2012-12-12

Family

ID=23645098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000305635A Expired - Fee Related JP5096651B2 (ja) 1999-10-08 2000-10-05 熱張係数の異なる材料間の低応力界面及びその製造方法

Country Status (2)

Country Link
US (1) US6238805B1 (enExample)
JP (1) JP5096651B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6560844B1 (en) * 2000-02-24 2003-05-13 Honeywell International Inc. Alignment plate with matched thermal coefficient of expansion
US20040148756A1 (en) * 2002-09-09 2004-08-05 Pommer Richard J. Alignment plate with matched thermal coefficient of expansion
JP4688869B2 (ja) * 2004-05-05 2011-05-25 ネオフォトニクス・コーポレイション アサーマルａｗｇおよび可変幅の溝を用いる低消費電力ａｗｇ
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
FR2902364B1 (fr) * 2006-06-16 2012-04-27 Commissariat Energie Atomique Procede de fabrication d'une vessie d'etancheite en polymere thermodurcissable pour un reservoir contenant un fluide sous pression, tel qu'un reservoir composite, et reservoir
BR112013009338A2 (pt) * 2010-10-18 2016-07-26 Velocys Corp processadores químicos reisistentes ao vazamento laminados, métodos de fabricação e métodos de operação

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673049A (en) * 1970-10-07 1972-06-27 Corning Glass Works Glass laminated bodies comprising a tensilely stressed core and a compressively stressed surface layer fused thereto
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
US4496793A (en) * 1980-06-25 1985-01-29 General Electric Company Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion
NO154221C (no) * 1982-10-11 1986-08-20 Ardal Og Sunndal Verk Trelags metall-laminat med bimetalleffekt og anvendelse av dette laminat i kokekar.
DE69013124T2 (de) * 1989-09-25 1995-05-04 Gen Electric Direktverbundene Metallsubstratstrukturen.
JPH0536966A (ja) * 1991-07-19 1993-02-12 Fujitsu Ltd 半導体装置
JP3114759B2 (ja) * 1992-03-13 2000-12-04 富士通株式会社 半導体装置
JPH07176563A (ja) * 1992-10-27 1995-07-14 Fujitsu Ltd 半導体装置
JPH0817962A (ja) * 1994-07-04 1996-01-19 Fujitsu Ltd 半導体装置及び半導体パッケージ
JP3412952B2 (ja) * 1995-03-17 2003-06-03 株式会社東芝 ハイブリッド型半導体装置およびその製造方法
JP3646349B2 (ja) * 1995-05-17 2005-05-11 株式会社デンソー 半導体装置の製造方法
US5699462A (en) 1996-06-14 1997-12-16 Hewlett-Packard Company Total internal reflection optical switches employing thermal activation
JP3144627B2 (ja) * 1996-09-02 2001-03-12 日本電信電話株式会社 光スイッチ及びその組立方法
JPH10227986A (ja) * 1997-02-17 1998-08-25 Hitachi Ltd 光スイッチとその製造方法及び光スイッチを用いた光通信機器

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Publication number Publication date
US6238805B1 (en) 2001-05-29
JP2001150399A (ja) 2001-06-05

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