JP5091909B2 - リソグラフィ方法 - Google Patents
リソグラフィ方法 Download PDFInfo
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- JP5091909B2 JP5091909B2 JP2009114604A JP2009114604A JP5091909B2 JP 5091909 B2 JP5091909 B2 JP 5091909B2 JP 2009114604 A JP2009114604 A JP 2009114604A JP 2009114604 A JP2009114604 A JP 2009114604A JP 5091909 B2 JP5091909 B2 JP 5091909B2
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- resist
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- pattern
- resist layer
- radiation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
放射ビームPB(例えばUV放射、DUV放射、またはEUV放射、あるいはさらに短い波長を有する放射)を調整する照明系(イルミネータ)ILと、
パターニングデバイス(例えばマスク)MAを支持し、要素PLに対してパターニングデバイスを正確に位置決めする第1の位置決め装置PMに接続されている支持構造(例えば支持構造)MTと、
基板(例えばレジストを塗布されたウエーハ)Wを保持し、要素PLに対して基板を正確に位置決めする第2の位置決め装置PWに接続されている基板テーブル(例えばウエーハテーブル)WTと、
パターニングデバイスMAにより放射ビームPBに付与されたパターンを基板Wの(例えば1つ以上のダイからなる)目標部分Cに投影するよう構成されている投影系(例えば屈折投影レンズ)PLと、を備える。
Claims (10)
- レジスト層が形成され、該レジスト層の上に更なる層が成膜されている基板へのリソグラフィ方法であって、
パターンのフィーチャ間距離により画定される間隔を通じて前記レジスト層を放射で露光するために、前記更なる層に前記パターンを形成することと、
前記更なる層の前記パターンの側壁の位置にあたる前記レジスト層に伝播して露光する近接場放射を生成するように、前記間隔を画定する前記パターンのフィーチャ間距離よりも大きい波長を有する放射で前記レジスト層を露光することと、
前記更なる層の前記パターンの側壁の位置にあたる前記レジスト層においてパターンフィーチャが選択的に現像可能とされるように、露光されたレジスト領域にシリル化処理をすることと、を含み、
前記近接場放射は、前記側壁の位置にあたる前記レジスト層の上層部分のみを露光強度しきい値を超えて露光し、前記上層部分は厚さが3nm以下で幅が10nm未満であり、前記パターンフィーチャは10nm未満のフィーチャを含むことを特徴とするリソグラフィ方法。 - 前記更なる層の前記パターンの1つは2つの側壁を有し、前記パターンフィーチャは、前記更なる層の前記パターンの2倍のパターンピッチを有することを特徴とする請求項1に記載のリソグラフィ方法。
- 前記更なる層の材料は、金属、第2のレジスト、またはシリル化レジストであることを特徴とする請求項1または2に記載のリソグラフィ方法。
- 前記金属はクロムであることを特徴とする請求項3に記載のリソグラフィ方法。
- 前記更なる層を除去することをさらに含むことを特徴とする請求項1乃至4のいずれかに記載のリソグラフィ方法。
- レジストを現像またはエッチングすることをさらに含むことを特徴とする請求項5に記載のリソグラフィ方法。
- 前記レジスト層の露光は、偏光されている放射でレジストを露光することを含むことを特徴とする請求項1乃至6のいずれかに記載のリソグラフィ方法。
- 前記レジスト層の露光は、レジスト層に実質的に垂直な角度で入射する放射でレジストを露光することを含むことを特徴とする請求項1乃至7のいずれかに記載のリソグラフィ方法。
- 基板にレジスト層を形成することをさらに含むことを特徴とする請求項1乃至8のいずれかに記載のリソグラフィ方法。
- 前記レジスト層に前記更なる層を形成することをさらに含むことを特徴とする請求項9に記載のリソグラフィ方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7170408P | 2008-05-14 | 2008-05-14 | |
US61/071,704 | 2008-05-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009278091A JP2009278091A (ja) | 2009-11-26 |
JP5091909B2 true JP5091909B2 (ja) | 2012-12-05 |
Family
ID=41316455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009114604A Active JP5091909B2 (ja) | 2008-05-14 | 2009-05-11 | リソグラフィ方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US9086633B2 (ja) |
JP (1) | JP5091909B2 (ja) |
NL (1) | NL1036787A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1036787A1 (nl) * | 2008-05-14 | 2009-11-17 | Asml Holding Nv | Lithographic method. |
KR102149795B1 (ko) * | 2013-12-13 | 2020-08-31 | 삼성전기주식회사 | 레지스트 필름 및 패턴 형성 방법 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03259257A (ja) * | 1990-03-09 | 1991-11-19 | Mitsubishi Electric Corp | 微細パターン形成方法 |
US6258514B1 (en) * | 1999-03-10 | 2001-07-10 | Lsi Logic Corporation | Top surface imaging technique using a topcoat delivery system |
JP2003100600A (ja) * | 2001-09-25 | 2003-04-04 | Sharp Corp | レジストパターン形成方法 |
JP3903149B2 (ja) * | 2003-01-31 | 2007-04-11 | 独立行政法人科学技術振興機構 | レジストパターン形成方法、デバイスの作製方法 |
JP4194514B2 (ja) * | 2003-06-26 | 2008-12-10 | キヤノン株式会社 | 露光用マスクの設計方法及び製造方法 |
JP2005070319A (ja) * | 2003-08-22 | 2005-03-17 | Canon Inc | 近接場露光用フォトレジスト、及びこれを用いた微細パターンの作製方法 |
JP2006013216A (ja) * | 2004-06-28 | 2006-01-12 | Canon Inc | 近接場露光によるレジストパターンの形成方法、及び該レジストパターンの形成方法を用いた基板の加工方法、デバイスの作製方法 |
JP2006080467A (ja) * | 2004-09-13 | 2006-03-23 | Toshiba Corp | 露光方法 |
JP4674105B2 (ja) * | 2005-03-25 | 2011-04-20 | 独立行政法人科学技術振興機構 | 回路パターン転写装置及び方法 |
WO2006114369A2 (en) * | 2005-04-27 | 2006-11-02 | Obducat Ab | Means for transferring a pattern to an object |
JP2007095859A (ja) * | 2005-09-28 | 2007-04-12 | Japan Science & Technology Agency | リソグラフィ方法 |
JP2008098265A (ja) * | 2006-10-10 | 2008-04-24 | Canon Inc | 近接場光による露光方法及びレジストパターンの形成方法 |
US7709187B2 (en) * | 2006-10-23 | 2010-05-04 | International Business Machines Corporation | High resolution imaging process using an in-situ image modifying layer |
KR101452257B1 (ko) * | 2007-10-01 | 2014-10-24 | 시게이트 테크놀로지 엘엘씨 | 표면 플라즈몬을 이용한 나노 패터닝 방법, 이를 이용한나노 임프린트용 마스터 및 이산 트랙 자기기록매체의제조방법 |
NL1036787A1 (nl) * | 2008-05-14 | 2009-11-17 | Asml Holding Nv | Lithographic method. |
-
2009
- 2009-03-30 NL NL1036787A patent/NL1036787A1/nl not_active Application Discontinuation
- 2009-05-11 US US12/463,679 patent/US9086633B2/en active Active
- 2009-05-11 JP JP2009114604A patent/JP5091909B2/ja active Active
-
2015
- 2015-06-15 US US14/739,886 patent/US9366952B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9086633B2 (en) | 2015-07-21 |
JP2009278091A (ja) | 2009-11-26 |
US9366952B2 (en) | 2016-06-14 |
US20090286053A1 (en) | 2009-11-19 |
US20150277222A1 (en) | 2015-10-01 |
NL1036787A1 (nl) | 2009-11-17 |
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