JP5080335B2 - サーマルプリントヘッド - Google Patents
サーマルプリントヘッド Download PDFInfo
- Publication number
- JP5080335B2 JP5080335B2 JP2008097974A JP2008097974A JP5080335B2 JP 5080335 B2 JP5080335 B2 JP 5080335B2 JP 2008097974 A JP2008097974 A JP 2008097974A JP 2008097974 A JP2008097974 A JP 2008097974A JP 5080335 B2 JP5080335 B2 JP 5080335B2
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- JP
- Japan
- Prior art keywords
- print head
- thermal print
- electrical connection
- protective film
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
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- Electronic Switches (AREA)
Description
絶縁基板と、
前記絶縁基板の上に配置された発熱抵抗体層と、
前記発熱抵抗体層に設けられた複数の発熱部にそれぞれに通電する金属層が並行に複数配列されて成る発熱素子群と、
前記発熱部と前記金属層を少なくとも被覆し前記絶縁基板上に積層する保護膜と、
前記金属層を被覆する前記保護膜に開口部が形成され、前記開口部に設けられた電気接続部とを具備するサーマルプリントヘッドにおいて、
前記開口部は前記複数の金属層が並行配列される方向に千鳥足状に設けられ、前記電気接続部のうち少なくとも前記金属層が隣接する位置に配置された電気接続部は前記開口部において前記開口部からせり上がり隣接する前記金属層の直上の前記保護膜上に延在するパターンに形成された金属体を有することを特徴とするサーマルプリントヘッドにある。そして、本発明では、前記発熱素子群の駆動を制御する駆動用ICが備えられ、電気接続部は駆動用ICとボンディングワイヤで接続される構成になる。
Claims (4)
- 絶縁基板と、
前記絶縁基板の上に配置された発熱抵抗体層と、
前記発熱抵抗体層に設けられた複数の発熱部にそれぞれに通電する電極を形成する金属層が並行に複数配列されて成る発熱素子群と、
前記発熱部と前記金属層を少なくとも被覆し前記絶縁基板上に積層する保護膜と、
前記金属層を被覆する前記保護膜に開口部が形成され、前記開口部に設けられた電気接続部とを具備するサーマルプリントヘッドにおいて、
前記開口部は前記複数の金属層が並行配列される方向に千鳥足状に設けられ、前記電気接続部のうち少なくとも前記金属層が隣接する位置に配置された電気接続部は前記開口部において前記開口部からせり上がり隣接する前記金属層の直上の前記保護膜上に延在するパターンに形成された金属体を有することを特徴とするサーマルプリントヘッド。 - 前記発熱素子群の駆動を制御する駆動用ICが備えられ、前記電気接続部は前記駆動用ICとボンディングワイヤで接続されていることを特徴とする請求項1に記載のサーマルプリントヘッド。
- 前記電気接続部の金属体は前記開口部に充填されていることを特徴とする請求項1に記載のサーマルプリントヘッド。
- 前記発熱部から延長された金属層の幅は前記開口部においても同じ幅であることを特徴とする請求項1又は2に記載のサーマルプリントヘッド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008097974A JP5080335B2 (ja) | 2008-04-04 | 2008-04-04 | サーマルプリントヘッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008097974A JP5080335B2 (ja) | 2008-04-04 | 2008-04-04 | サーマルプリントヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009248415A JP2009248415A (ja) | 2009-10-29 |
JP5080335B2 true JP5080335B2 (ja) | 2012-11-21 |
Family
ID=41309553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008097974A Expired - Fee Related JP5080335B2 (ja) | 2008-04-04 | 2008-04-04 | サーマルプリントヘッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5080335B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014069374A (ja) * | 2012-09-28 | 2014-04-21 | Toshiba Hokuto Electronics Corp | サーマルプリントヘッドおよびその製造方法 |
JP2016190463A (ja) * | 2015-03-31 | 2016-11-10 | 東芝ホクト電子株式会社 | サーマルプリントヘッド及びサーマルプリンタ |
WO2023210426A1 (ja) * | 2022-04-28 | 2023-11-02 | ローム株式会社 | サーマルプリントヘッドおよびサーマルプリンタ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206562A (ja) * | 1989-02-06 | 1990-08-16 | Ricoh Co Ltd | サーマルヘッド |
JPH0529377A (ja) * | 1991-07-25 | 1993-02-05 | Nec Corp | 半導体装置 |
JPH05226404A (ja) * | 1991-09-06 | 1993-09-03 | Rohm Co Ltd | 半導体装置 |
JP3504421B2 (ja) * | 1996-03-12 | 2004-03-08 | 株式会社ルネサステクノロジ | 半導体装置 |
JP2006272851A (ja) * | 2005-03-30 | 2006-10-12 | Toshiba Hokuto Electronics Corp | サーマルヘッド |
-
2008
- 2008-04-04 JP JP2008097974A patent/JP5080335B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009248415A (ja) | 2009-10-29 |
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