JP5067481B2 - 配線基板およびその製造方法、電子装置の製造方法 - Google Patents
配線基板およびその製造方法、電子装置の製造方法 Download PDFInfo
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Description
11 基体
11A,11B,65A〜65C Cu電極パッド
11S Cu電極パッド表面領域
11T Cu犠牲層
12.66 Biメッキ層
12A,12B はんだ層
12Eu Sn−Bi共晶はんだ
13,67 Snメッキ層
13S Sn犠牲層
13T Cu犠牲層
13U Snメッキ層界面領域
30 電子装置
31 半導体チップ
31A,31B 電極パッド
61 コア基板
61A,61B スルービア
61a〜61d,64A〜64H Cu配線パターン
62A,62B 低誘電率樹脂膜
62a〜62d 開口部
63A,63B Cuシード層
図1は、第1の実施形態による配線基板10の構成を示す。
[第2の実施形態]
図9A〜9Fは、本発明の第2の実施形態による配線基板20の製造工程を示す図である。ただし図中、先に説明した部分に対応する部分には同一の参照符号を付し、説明を省略する。
[第3の実施形態]
次にコア基板を有する配線基板に対して適用した本発明の第3の実施形態について、図10A〜10Lを参照しながら説明する。
Claims (8)
- 基体と、
前記基体上に形成されたCu配線パターンと、
前記Cu配線パターンの表面に形成された第1の金属層と、
前記第1の金属層の表面に形成された第2の金属層と、
を含み、
前記第1の金属層は、前記第2の金属層と比べて、Cuとの反応性が低く、
前記第1の金属層と第2の金属層は共晶反応を生じ、
前記第2の金属層はCuと金属間化合物を形成し、前記第1の金属層は、Cuと金属間化合物を形成しないことを特徴とする配線基板。 - 前記共晶反応は、139℃以上、150℃以下の温度で生じる請求項1記載の配線基板。
- 前記第1の金属層は、ビスマス、鉛、インジウム、銀、あるいはこれらのいずれかを主成分とする合金よりなり、前記第2の金属層は、錫、金、あるいはこれらのいずれかを主成分とする合金よりなる請求項1または2記載の配線基板。
- さらに前記Cu配線パターンは、前記第1の金属層との界面に沿って、前記第2の金属層を構成する金属元素を含む第1の界面領域を有し、前記第2の金属層は、前記第1の金属層との界面に沿って、Cuを含む第2の界面領域を有する請求項1〜3のうち、いずれか一項記載の配線基板。
- 請求項1〜4のうち、いずれか一項記載の配線基板上に電子部品を、前記電子部品の端子が前記第2の金属層と当接するように載置する工程と、
前記第1および第2の金属層をリフローさせ、前記電子部品の前記端子を前記Cu配線パターンに接合する工程と、
を含むことを特徴とする電子装置の製造方法。 - 基体上に形成されたCu配線パターン上に第1の金属層を形成する工程と、
前記第1の金属層上に、前記第1の金属層との間で共晶反応を生じる第2の金属層を形成する工程と、
リフローを行い、前記第1の金属層と第2の金属層との間に共晶反応を生じさせる工程と、
を含み、
前記第1の金属層は前記第2の金属層と比べてCuとの反応性が低く、
前記第2の金属層はCuと金属間化合物を形成し、前記第1の金属層はCuと金属間化合物を形成しないことを特徴とする配線基板の製造方法。 - さらに前記基体と前記第1の金属層との間に、前記第2の金属層と同じ組成の第1の犠牲層を形成する工程と、前記第1の金属層と前記第2の金属層との間に、Cuよりなる第2の犠牲層を形成する工程を含み、前記第1の犠牲層は前記第1の金属層の形成工程で消失し、前記第2の犠牲層は、前記第2の金属層の工程で消失する請求項6記載の配線基板の製造方法。
- 前記第1の金属層は、ビスマス、鉛、インジウム、銀、あるいはこれらのいずれかを主成分とする合金よりなり、前記第2の金属層は、錫、金、あるいはこれらのいずれかを主成分とする合金よりなる請求項6または7記載の配線基板の製造方法。
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TWI430377B (zh) * | 2011-08-09 | 2014-03-11 | Univ Nat Chiao Tung | 用於減緩介金屬化合物成長之方法 |
US8943150B2 (en) | 2011-09-12 | 2015-01-27 | Fiserv, Inc. | Systems and methods for customizing mobile applications based upon user associations with one or more entities |
US8943124B2 (en) * | 2011-09-12 | 2015-01-27 | Fiserv, Inc. | Systems and methods for customizing mobile applications based upon user associations with one or more entities |
US20130256007A1 (en) * | 2012-03-28 | 2013-10-03 | Ibiden Co., Ltd. | Wiring board with built-in electronic component and method for manufacturing the same |
TWI615367B (zh) | 2012-10-12 | 2018-02-21 | 康寧公司 | 具有保留強度之物品 |
JP2016029682A (ja) * | 2014-07-25 | 2016-03-03 | イビデン株式会社 | プリント配線板 |
GB2557439B (en) * | 2016-10-24 | 2021-06-30 | Jaguar Land Rover Ltd | Apparatus and method relating to electrochemical migration |
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JP2003198117A (ja) * | 2001-12-28 | 2003-07-11 | Matsushita Electric Ind Co Ltd | はんだ付け方法および接合構造体 |
JP2007275917A (ja) * | 2006-04-05 | 2007-10-25 | Mitsubishi Electric Corp | 表面処理膜及びそれを用いたはんだ付方法 |
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JPWO2009133625A1 (ja) | 2011-08-25 |
US8713792B2 (en) | 2014-05-06 |
KR101184108B1 (ko) | 2012-09-18 |
WO2009133625A1 (ja) | 2009-11-05 |
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US20140202739A1 (en) | 2014-07-24 |
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