JP5066182B2 - インサート成形用積層物とその製造方法、インサート成形品とその製造方法 - Google Patents
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Description
しかし、ガラス基板の中央部をディスプレイ用の透明窓部にして、その裏面に静電容量型タッチセンサを設ける場合、ガラス用接着層はプラスチックフィルムとの接着性に乏しく、プラスチックフィルムからなる静電容量型タッチセンサを強固に貼り付けすることができないという問題があった。また、ガラス用接着層は透明性が低いため、鮮明性の必要なディスプレイ用の透明窓部には適していないという問題があった。
本発明のインサート成形用積層物の第1特徴構成は、ガラス基板の一方の面における周囲部分に枠形状に形成された耐熱性接着層と、前記ガラス基板の一方の面における内方側部分に形成され、前記ガラス基板厚み方向視で前記耐熱性接着層に一部が重複する形状の透明感圧接着層と、その透明感圧接着層上に積層され、前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサと、を備えた点にある。
〔実施例1〕
縦38mm、横58mm、厚み1mmのガラス基板上に、ポリエステル系樹脂をバインダーとし黒色の着色剤を含有するインキを用い、スクリーン印刷法にて全厚み15μmの図柄を構成する耐熱性接着層を、ガラス基板の外形から枠形状に縦・横とも5mmの幅で形成した。
縦38mm、横58mm、厚み1mmのガラス基板上に、厚み600Åのアルミニウム蒸着膜からなる図柄層を、ガラス基板の外形から枠形状に縦・横とも5mmの幅で形成した。次に、前記黒と白の着色材を含むポリエステル系の着色インキによる図柄層上にガラス基板の外形から枠形状に縦・横とも3mmの幅で、ポリエステル系樹脂からなるプライマー層およびビニル系樹脂からなる耐熱性接着層を順次積層形成した。
Claims (11)
- ガラス基板の一方の面における周囲部分に枠形状に形成された耐熱性接着層と、
前記ガラス基板の一方の面における内方側部分に形成され、前記ガラス基板厚み方向視で前記耐熱性接着層に一部が重複する形状の透明感圧接着層と、
その透明感圧接着層上に積層され、前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサと、を備えたことを特徴とするインサート成形用積層物。 - 前記耐熱性接着層が図柄を構成したものである請求項1記載のインサート成形用積層物。
- ガラス基板の一方の面における周囲部分に枠形状に形成された図柄層と、
その図柄層上に枠形状に形成されたプライマー層と、
そのプライマー層上に枠形状に形成された耐熱性接着層と、
前記ガラス基板の一方の面における内方側部分に形成され、前記ガラス基板厚み方向視で前記図柄層に一部が重複する形状の透明感圧接着層と、
その透明感圧接着層上に積層され、前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサと、を備えたことを特徴とするインサート成形用積層物。 - ガラス基板の一方の面における周囲部分に耐熱性接着層を枠形状に形成する工程、
前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサの片面に透明感圧接着層を形成する工程、
前記ガラス基板の一方の面における内方側部分に前記静電容量型タッチセンサを前記ガラス基板厚み方向視で前記ガラス基板の耐熱性接着層の一部に重複するように接着する工程、を含有することを特徴とするインサート成形用積層物の製造方法。 - ガラス基板の一方の面における周囲部分に図柄層を枠形状に形成する工程、
その図柄層上にプライマー層を枠形状に形成する工程、
そのプライマー層上に耐熱性接着層を枠形状に形成する工程、
前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサの片面に透明感圧接着層を形成する工程、
前記ガラス基板の一方の面における内方側部分に前記静電容量型タッチセンサを前記ガラス基板厚み方向視で前記ガラス基板の前記図柄層の一部に重複するように接着する工程、を含有することを特徴とするインサート成形用積層物の製造方法。 - ガラス基板の一方の面における周囲部分に枠形状に形成された耐熱性接着層と、
前記ガラス基板の一方の面における内方側部分に形成され、前記ガラス基板厚み方向視で前記耐熱性接着層に一部が重複する形状の透明感圧接着層と、
その透明感圧接着層上に積層され、前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサと、
前記耐熱性接着層上で前記透明感圧接着層が形成されていない部分に一体的に形成され、前記静電容量型タッチセンサの外形形状より大きい形状の開口部を有する射出成形樹脂部と、を備えたことを特徴とするインサート成形品。 - 前記耐熱性接着層が図柄を構成したものである請求項6記載のインサート成形品。
- ガラス基板の一方の面における周囲部分に枠形状に形成された図柄層と、
その図柄層上に枠形状に形成されたプライマー層と、
そのプライマー層上に枠形状に形成された耐熱性接着層と、
前記ガラス基板の一方の面における内方側部分に形成され、前記ガラス基板厚み方向視で前記図柄層に一部が重複する形状の透明感圧接着層と、
その透明感圧接着層上に積層され、前記ガラス基板の外形形状より小さい形状の静電容量型タッチセンサと、
前記耐熱性接着層上で前記透明感圧接着層が形成されていない部分に一体的に形成され、前記静電容量型タッチセンサの外形形状より大きい形状の開口部を有する射出成形樹脂部と、を備えたことを特徴とするインサート成形品。 - 前記射出成形樹脂部を構成する樹脂の成形収縮率が0.6%以下である請求項6〜8のいずれか1項に記載のインサート成形品。
- 請求項1〜3のいずれか1項に記載のインサート成形用積層物を射出成形用金型の所定の位置に配置し、前記射出成形用金型を型締めし、前記射出成形金型と前記インサート成形用積層物とにより形成されたキャビティに溶融した射出成形樹脂を充填した後、その射出成形樹脂を冷却固化させ、前記射出成形用金型を型開きして、前記インサート成形用積層物の耐熱性接着層上で前記透明感圧接着層が形成されていない部分に前記射出成形樹脂部が前記静電容量型タッチセンサの外形形状より大きい形状の開口部を有するよう一体的に形成することを特徴とするインサート成形品の製造方法。
- 前記インサート成形用積層物の静電容量型タッチセンサと接する前記射出成形用金型のキャビティ面が、前記静電容量型タッチセンサの外周を囲む形状の凸部を備えるものである請求項10記載のインサート成形品の製造方法。
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Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8198979B2 (en) * | 2007-04-20 | 2012-06-12 | Ink-Logix, Llc | In-molded resistive and shielding elements |
US8238073B2 (en) * | 2008-07-18 | 2012-08-07 | Synaptics, Inc. | In-molded capacitive sensors |
JP5272018B2 (ja) * | 2008-11-21 | 2013-08-28 | 株式会社翔栄 | タッチパネルの支持構造の製造方法 |
US9383881B2 (en) * | 2009-06-03 | 2016-07-05 | Synaptics Incorporated | Input device and method with pressure-sensitive layer |
JP5553648B2 (ja) | 2009-06-26 | 2014-07-16 | 株式会社ジャパンディスプレイ | 表示装置 |
EP2273348A1 (fr) * | 2009-07-10 | 2011-01-12 | EM Microelectronic-Marin SA | Procédé de fabrication d'un verre à touches capacitives pour un instrument electronique, et instrument comprenant un tel verre |
US8663806B2 (en) * | 2009-08-25 | 2014-03-04 | Apple Inc. | Techniques for marking a substrate using a physical vapor deposition material |
EP2518602B1 (en) * | 2009-12-22 | 2014-06-25 | Nissha Printing Co., Ltd. | Touch panel and portable device using the same |
KR101073215B1 (ko) * | 2010-03-05 | 2011-10-12 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 일체형 평판표시장치 |
US20110232826A1 (en) * | 2010-03-26 | 2011-09-29 | Sumitomo Chemical Company, Limited | Production method for ceramic-resin composite |
JP5545643B2 (ja) * | 2010-05-25 | 2014-07-09 | 株式会社富士精工 | 射出成形装置及びインサート成形装置 |
FR2961134B1 (fr) * | 2010-06-10 | 2012-07-27 | Valeo Systemes Thermiques | Interface de commande pour vehicule automobile et procede de fabrication correspondant |
KR101699530B1 (ko) * | 2010-07-27 | 2017-01-25 | 삼성디스플레이 주식회사 | 터치스크린패널 및 이를 구비한 영상표시장치 |
DE102010049006A1 (de) * | 2010-10-21 | 2012-04-26 | Schreiner Group Gmbh & Co. Kg | Sensoranordnung zur Detektion einer Annäherung und/oder Berührung sowie Verfahren zur Assemblierung einer Sensoranordnung |
US20120113361A1 (en) * | 2010-11-10 | 2012-05-10 | Tpk Touch Solutions Inc. | Optical Level Composite Pressure-Sensitive Adhesive and an Apparatus Therewith |
US9235240B2 (en) | 2010-11-11 | 2016-01-12 | Apple Inc. | Insert molding around glass members for portable electronic devices |
KR101217802B1 (ko) * | 2010-12-30 | 2013-01-02 | (주)미래글로텍 | 이동통신단말기용 윈도우일체형 케이스 및 그 제조방법 |
JP5090553B2 (ja) | 2011-03-30 | 2012-12-05 | アルプス電気株式会社 | 表面パネルおよびその製造方法 |
FR2973529B1 (fr) * | 2011-03-31 | 2013-04-26 | Valeo Systemes Thermiques | Module de commande et d'affichage pour vehicule automobile |
US9030837B2 (en) | 2011-06-10 | 2015-05-12 | Scott Moncrieff | Injection molded control panel with in-molded decorated plastic film that includes an internal connector |
KR101308857B1 (ko) * | 2011-06-13 | 2013-09-13 | (주)엘지하우시스 | 몰드 캐스팅을 이용한 디스플레이 패널용 베젤의 제조 방법 및 이를 통해 제조되는 디스플레이 패널용 베젤 |
US9227348B2 (en) * | 2011-09-21 | 2016-01-05 | Ocean Net, Inc. | Method for forming a glass-plastic composite |
CN103129073B (zh) * | 2011-11-28 | 2015-04-15 | 宸鸿光电科技股份有限公司 | 具有多层印刷层的装置及其印刷方法 |
US9320140B2 (en) * | 2011-12-22 | 2016-04-19 | Nissha Printing Co., Ltd. | Touch sensor with ornament, method of manufacturing same, and transparent conductive sensor used in same |
JP2013134668A (ja) * | 2011-12-27 | 2013-07-08 | Smk Corp | タッチパネルユニット |
CN103240840A (zh) * | 2012-02-06 | 2013-08-14 | 深圳富泰宏精密工业有限公司 | 玻璃与塑胶的复合体及其制备方法 |
JP5314773B2 (ja) * | 2012-02-10 | 2013-10-16 | ホシデン株式会社 | 部品モジュール |
JP5868721B2 (ja) | 2012-02-10 | 2016-02-24 | ホシデン株式会社 | 入力装置 |
JP2013239812A (ja) * | 2012-05-14 | 2013-11-28 | Sharp Corp | 携帯端末 |
CN103576959A (zh) * | 2012-08-01 | 2014-02-12 | 宸鸿科技(厦门)有限公司 | 触控面板模组及其制造方法 |
CN103592999A (zh) * | 2012-08-14 | 2014-02-19 | 汉达精密电子(昆山)有限公司 | 笔记本电脑键盘成型方法及其产品 |
KR20140030772A (ko) * | 2012-09-03 | 2014-03-12 | 삼성전기주식회사 | 터치패널 |
JP5559857B2 (ja) * | 2012-11-14 | 2014-07-23 | ホシデン株式会社 | タッチセンサ及びタッチセンサの製造方法 |
CN103909689A (zh) * | 2013-01-07 | 2014-07-09 | 深圳富泰宏精密工业有限公司 | 陶瓷与塑料的复合体及应用该复合体的电子装置 |
CN103197802B (zh) * | 2013-04-15 | 2016-06-29 | 上海摩软通讯技术有限公司 | 用于固定触摸屏的前壳制造方法及移动终端 |
US9616603B2 (en) | 2013-05-06 | 2017-04-11 | Google Technology Holdings LLC | Floating core for glass insert molding method and apparatuses therefrom |
US9586351B2 (en) | 2013-05-06 | 2017-03-07 | Google Technology Holdings LLC | Floating core for glass insert molding method and apparatuses therefrom |
US9871898B2 (en) | 2013-05-08 | 2018-01-16 | Apple Inc. | Ceramic cover for electronic device housing |
US9023267B2 (en) | 2013-05-20 | 2015-05-05 | Google Technology Holdings LLC | Floating core for glass insert molding method and apparatuses therefrom |
KR102124047B1 (ko) | 2013-06-04 | 2020-06-18 | 삼성디스플레이 주식회사 | 커버 윈도우 |
US9573843B2 (en) | 2013-08-05 | 2017-02-21 | Corning Incorporated | Polymer edge-covered glass articles and methods for making and using same |
US10355155B2 (en) * | 2014-01-06 | 2019-07-16 | Kuraray Co., Ltd. | Method of producing glass base material laminate, method of producing optical element, optical element, and concentrating photovoltaic device |
WO2016013624A1 (ja) | 2014-07-25 | 2016-01-28 | 三菱樹脂株式会社 | ガスバリア性積層フィルム |
US9753490B2 (en) | 2014-08-29 | 2017-09-05 | Apple Inc. | Housing features including logo features of an electronic device |
KR20170035581A (ko) * | 2015-09-23 | 2017-03-31 | (주)파트론 | 센서 패키지 |
CN105443526B (zh) * | 2015-11-03 | 2018-06-29 | 广东欧珀移动通信有限公司 | 一种消除断差的方法和移动终端电池盖 |
CN106201100B (zh) * | 2016-07-20 | 2021-04-06 | 京东方科技集团股份有限公司 | 一种触摸显示屏及其制备方法 |
CN106445227A (zh) * | 2016-08-30 | 2017-02-22 | 京东方科技集团股份有限公司 | 基板、其制备方法及显示装置 |
CN108701212B (zh) * | 2017-02-07 | 2021-08-31 | 深圳市汇顶科技股份有限公司 | 一种指纹识别装置 |
CN110998498A (zh) * | 2017-08-03 | 2020-04-10 | 株式会社东海理化电机制作所 | 操作检测装置 |
US11361910B2 (en) * | 2017-10-10 | 2022-06-14 | Kabushiki Kaisha Toyota Jidoshokki | Power storage module |
JP6600339B2 (ja) * | 2017-10-16 | 2019-10-30 | Nissha株式会社 | 成形品及び当該成形品を含む表示装置並びに成形品の製造方法 |
FR3080695B1 (fr) * | 2018-04-25 | 2020-04-24 | Faurecia Interieur Industrie | Procede pour appliquer un film de detection sur une lentille transparente |
FR3084609B1 (fr) * | 2018-08-02 | 2020-11-06 | Commissariat Energie Atomique | Procede de fabrication d'une piece plastique formant une interface de commande homme-machine |
JP2020066547A (ja) * | 2018-10-24 | 2020-04-30 | 双葉電子工業株式会社 | ガラス成形品 |
KR20200051898A (ko) * | 2018-11-05 | 2020-05-14 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조방법 |
WO2021177988A1 (en) | 2020-03-05 | 2021-09-10 | Google Llc | Zero or low-draft angle injection molding method and system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02249616A (en) * | 1989-03-24 | 1990-10-05 | Takagi Seiko:Kk | Insert molding method for plate glass |
JPH05324203A (ja) * | 1992-05-22 | 1993-12-07 | Fujitsu Ltd | 静電容量型タッチパネル |
WO2006134843A1 (ja) * | 2005-06-16 | 2006-12-21 | Nissha Printing Co., Ltd. | 照光スイッチ付き筺体部品およびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0418628A (en) | 1990-05-11 | 1992-01-22 | Nitto Denko Corp | Touch panel |
JP2511549Y2 (ja) | 1991-11-28 | 1996-09-25 | 株式会社小糸製作所 | 表示装置 |
CN1155911C (zh) * | 2000-09-26 | 2004-06-30 | 洋华光电股份有限公司 | 触控面板的制造方法 |
KR100905478B1 (ko) * | 2001-10-05 | 2009-07-02 | 가부시키가이샤 브리지스톤 | 투명 전도성 필름 및 터치패널 |
CN100405269C (zh) * | 2003-12-26 | 2008-07-23 | 日本写真印刷株式会社 | 带有保护面板的电子设备、保护面板及保护面板的制造方法 |
JP2005222266A (ja) | 2004-02-05 | 2005-08-18 | Sharp Corp | タッチセンサ付き表示装置、およびタッチセンサ付き表示装置用両面接着テープ |
JP2006294799A (ja) | 2005-04-08 | 2006-10-26 | Fuji Photo Film Co Ltd | 固体撮像素子及びその製造方法 |
BRPI0720833A2 (pt) * | 2007-01-04 | 2014-03-04 | Nissha Priting Co., Ltd. | Painel protetor tendo uma função de painel de toque |
-
2008
- 2008-05-30 WO PCT/JP2008/059980 patent/WO2008149789A1/ja active Application Filing
- 2008-05-30 TW TW097120271A patent/TWI368568B/zh not_active IP Right Cessation
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- 2008-05-30 CN CN2008800173361A patent/CN101681216B/zh active Active
- 2008-05-30 KR KR1020097024446A patent/KR101036044B1/ko not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02249616A (en) * | 1989-03-24 | 1990-10-05 | Takagi Seiko:Kk | Insert molding method for plate glass |
JPH05324203A (ja) * | 1992-05-22 | 1993-12-07 | Fujitsu Ltd | 静電容量型タッチパネル |
WO2006134843A1 (ja) * | 2005-06-16 | 2006-12-21 | Nissha Printing Co., Ltd. | 照光スイッチ付き筺体部品およびその製造方法 |
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