BRPI0812073A2 - Laminado para moldagem de encaixe e método de sua fabricação, e moldagem de encaixe e método de sua fabricação - Google Patents

Laminado para moldagem de encaixe e método de sua fabricação, e moldagem de encaixe e método de sua fabricação

Info

Publication number
BRPI0812073A2
BRPI0812073A2 BRPI0812073-0A2A BRPI0812073A BRPI0812073A2 BR PI0812073 A2 BRPI0812073 A2 BR PI0812073A2 BR PI0812073 A BRPI0812073 A BR PI0812073A BR PI0812073 A2 BRPI0812073 A2 BR PI0812073A2
Authority
BR
Brazil
Prior art keywords
fitting
manufacture
laminated
fitting fitting
Prior art date
Application number
BRPI0812073-0A2A
Other languages
English (en)
Inventor
Nishimura Takeshi
Original Assignee
Nissha Printing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing filed Critical Nissha Printing
Publication of BRPI0812073A2 publication Critical patent/BRPI0812073A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2709/00—Use of inorganic materials not provided for in groups B29K2703/00 - B29K2707/00, for preformed parts, e.g. for inserts
    • B29K2709/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
    • B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature
    • Y10T428/24793—Comprising discontinuous or differential impregnation or bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y10T428/24868—Translucent outer layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Position Input By Displaying (AREA)
BRPI0812073-0A2A 2007-05-31 2008-05-30 Laminado para moldagem de encaixe e método de sua fabricação, e moldagem de encaixe e método de sua fabricação BRPI0812073A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007144878 2007-05-31
PCT/JP2008/059980 WO2008149789A1 (ja) 2007-05-31 2008-05-30 インサート成形用積層物とその製造方法、インサート成形品とその製造方法

Publications (1)

Publication Number Publication Date
BRPI0812073A2 true BRPI0812073A2 (pt) 2014-11-25

Family

ID=40093607

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0812073-0A2A BRPI0812073A2 (pt) 2007-05-31 2008-05-30 Laminado para moldagem de encaixe e método de sua fabricação, e moldagem de encaixe e método de sua fabricação

Country Status (8)

Country Link
US (1) US8263211B2 (pt)
EP (1) EP2154596B1 (pt)
JP (1) JP5066182B2 (pt)
KR (1) KR101036044B1 (pt)
CN (1) CN101681216B (pt)
BR (1) BRPI0812073A2 (pt)
TW (1) TWI368568B (pt)
WO (1) WO2008149789A1 (pt)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8198979B2 (en) * 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
US8238073B2 (en) * 2008-07-18 2012-08-07 Synaptics, Inc. In-molded capacitive sensors
WO2010058829A1 (ja) * 2008-11-21 2010-05-27 株式会社 翔栄 タッチパネルの支持構造およびその製造方法
US9383881B2 (en) 2009-06-03 2016-07-05 Synaptics Incorporated Input device and method with pressure-sensitive layer
JP5553648B2 (ja) 2009-06-26 2014-07-16 株式会社ジャパンディスプレイ 表示装置
EP2273348A1 (fr) * 2009-07-10 2011-01-12 EM Microelectronic-Marin SA Procédé de fabrication d'un verre à touches capacitives pour un instrument electronique, et instrument comprenant un tel verre
US8663806B2 (en) * 2009-08-25 2014-03-04 Apple Inc. Techniques for marking a substrate using a physical vapor deposition material
US8482541B2 (en) * 2009-12-22 2013-07-09 Nissha Printing Co., Ltd. Touch panel and portable device using the same
KR101073215B1 (ko) * 2010-03-05 2011-10-12 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치
US20110232826A1 (en) * 2010-03-26 2011-09-29 Sumitomo Chemical Company, Limited Production method for ceramic-resin composite
JP5545643B2 (ja) * 2010-05-25 2014-07-09 株式会社富士精工 射出成形装置及びインサート成形装置
FR2961134B1 (fr) * 2010-06-10 2012-07-27 Valeo Systemes Thermiques Interface de commande pour vehicule automobile et procede de fabrication correspondant
KR101699530B1 (ko) * 2010-07-27 2017-01-25 삼성디스플레이 주식회사 터치스크린패널 및 이를 구비한 영상표시장치
DE102010049006A1 (de) * 2010-10-21 2012-04-26 Schreiner Group Gmbh & Co. Kg Sensoranordnung zur Detektion einer Annäherung und/oder Berührung sowie Verfahren zur Assemblierung einer Sensoranordnung
US20120113361A1 (en) * 2010-11-10 2012-05-10 Tpk Touch Solutions Inc. Optical Level Composite Pressure-Sensitive Adhesive and an Apparatus Therewith
US9235240B2 (en) 2010-11-11 2016-01-12 Apple Inc. Insert molding around glass members for portable electronic devices
KR101217802B1 (ko) * 2010-12-30 2013-01-02 (주)미래글로텍 이동통신단말기용 윈도우일체형 케이스 및 그 제조방법
JP5090553B2 (ja) 2011-03-30 2012-12-05 アルプス電気株式会社 表面パネルおよびその製造方法
FR2973529B1 (fr) * 2011-03-31 2013-04-26 Valeo Systemes Thermiques Module de commande et d'affichage pour vehicule automobile
US8804344B2 (en) 2011-06-10 2014-08-12 Scott Moncrieff Injection molded control panel with in-molded decorated plastic film
KR101308857B1 (ko) * 2011-06-13 2013-09-13 (주)엘지하우시스 몰드 캐스팅을 이용한 디스플레이 패널용 베젤의 제조 방법 및 이를 통해 제조되는 디스플레이 패널용 베젤
US9227348B2 (en) * 2011-09-21 2016-01-05 Ocean Net, Inc. Method for forming a glass-plastic composite
CN103129073B (zh) * 2011-11-28 2015-04-15 宸鸿光电科技股份有限公司 具有多层印刷层的装置及其印刷方法
KR101600871B1 (ko) * 2011-12-22 2016-03-08 니폰샤신인사츠가부시키가이샤 장식 부착 터치 센서와 그 제조 방법, 및 거기에 사용되는 터치 센서
JP2013134668A (ja) * 2011-12-27 2013-07-08 Smk Corp タッチパネルユニット
CN103240840A (zh) * 2012-02-06 2013-08-14 深圳富泰宏精密工业有限公司 玻璃与塑胶的复合体及其制备方法
JP5868721B2 (ja) * 2012-02-10 2016-02-24 ホシデン株式会社 入力装置
JP5314773B2 (ja) * 2012-02-10 2013-10-16 ホシデン株式会社 部品モジュール
JP2013239812A (ja) * 2012-05-14 2013-11-28 Sharp Corp 携帯端末
CN103576959A (zh) * 2012-08-01 2014-02-12 宸鸿科技(厦门)有限公司 触控面板模组及其制造方法
CN103592999A (zh) * 2012-08-14 2014-02-19 汉达精密电子(昆山)有限公司 笔记本电脑键盘成型方法及其产品
KR20140030772A (ko) * 2012-09-03 2014-03-12 삼성전기주식회사 터치패널
JP5559857B2 (ja) * 2012-11-14 2014-07-23 ホシデン株式会社 タッチセンサ及びタッチセンサの製造方法
CN103909689A (zh) * 2013-01-07 2014-07-09 深圳富泰宏精密工业有限公司 陶瓷与塑料的复合体及应用该复合体的电子装置
CN103197802B (zh) * 2013-04-15 2016-06-29 上海摩软通讯技术有限公司 用于固定触摸屏的前壳制造方法及移动终端
US9586351B2 (en) 2013-05-06 2017-03-07 Google Technology Holdings LLC Floating core for glass insert molding method and apparatuses therefrom
US9616603B2 (en) 2013-05-06 2017-04-11 Google Technology Holdings LLC Floating core for glass insert molding method and apparatuses therefrom
US9871898B2 (en) 2013-05-08 2018-01-16 Apple Inc. Ceramic cover for electronic device housing
US9023267B2 (en) 2013-05-20 2015-05-05 Google Technology Holdings LLC Floating core for glass insert molding method and apparatuses therefrom
KR102124047B1 (ko) 2013-06-04 2020-06-18 삼성디스플레이 주식회사 커버 윈도우
US9573843B2 (en) 2013-08-05 2017-02-21 Corning Incorporated Polymer edge-covered glass articles and methods for making and using same
JP6376565B2 (ja) * 2014-01-06 2018-08-22 株式会社クラレ ガラス基材積層体の製造方法、光学素子の製造方法、光学素子及び集光型太陽光発電装置
CN106660352B (zh) * 2014-07-25 2019-07-30 三菱化学株式会社 气体阻隔性层叠膜
CN206850816U (zh) 2014-08-29 2018-01-05 苹果公司 一种电子设备和用于电子设备的壳体
KR20170035581A (ko) * 2015-09-23 2017-03-31 (주)파트론 센서 패키지
CN105443526B (zh) * 2015-11-03 2018-06-29 广东欧珀移动通信有限公司 一种消除断差的方法和移动终端电池盖
CN106201100B (zh) * 2016-07-20 2021-04-06 京东方科技集团股份有限公司 一种触摸显示屏及其制备方法
CN106445227A (zh) * 2016-08-30 2017-02-22 京东方科技集团股份有限公司 基板、其制备方法及显示装置
CN108701212B (zh) * 2017-02-07 2021-08-31 深圳市汇顶科技股份有限公司 一种指纹识别装置
WO2019026504A1 (ja) * 2017-08-03 2019-02-07 株式会社東海理化電機製作所 操作検出装置
JP6858270B2 (ja) * 2017-10-10 2021-04-14 株式会社豊田自動織機 蓄電モジュール
JP6600339B2 (ja) 2017-10-16 2019-10-30 Ｎｉｓｓｈａ株式会社 成形品及び当該成形品を含む表示装置並びに成形品の製造方法
JP7161963B2 (ja) * 2018-03-16 2022-10-27 日東電工株式会社 生体センサ用積層体および生体センサ
FR3080695B1 (fr) * 2018-04-25 2020-04-24 Faurecia Interieur Industrie Procede pour appliquer un film de detection sur une lentille transparente
FR3084609B1 (fr) * 2018-08-02 2020-11-06 Commissariat Energie Atomique Procede de fabrication d'une piece plastique formant une interface de commande homme-machine
JP2020066547A (ja) * 2018-10-24 2020-04-30 双葉電子工業株式会社 ガラス成形品
KR102668174B1 (ko) * 2018-11-05 2024-05-24 삼성디스플레이 주식회사 표시장치 및 그 제조방법
EP3898165B1 (en) 2020-03-05 2022-10-12 Google LLC Zero or low-draft angle injection molding method and system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02249616A (ja) * 1989-03-24 1990-10-05 Takagi Seiko:Kk 板ガラスインサート成形方法
JPH0418628A (ja) * 1990-05-11 1992-01-22 Nitto Denko Corp タッチパネル
JP2511549Y2 (ja) * 1991-11-28 1996-09-25 株式会社小糸製作所 表示装置
JPH05324203A (ja) * 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル
CN1155911C (zh) * 2000-09-26 2004-06-30 洋华光电股份有限公司 触控面板的制造方法
KR100905478B1 (ko) * 2001-10-05 2009-07-02 가부시키가이샤 브리지스톤 투명 전도성 필름 및 터치패널
US7554624B2 (en) * 2003-12-26 2009-06-30 Nissha Printing Co., Ltd. Electronic device with protection panel, protection panel, and method of fabricating protection panels
JP2005222266A (ja) * 2004-02-05 2005-08-18 Sharp Corp タッチセンサ付き表示装置、およびタッチセンサ付き表示装置用両面接着テープ
JP2006294799A (ja) 2005-04-08 2006-10-26 Fuji Photo Film Co Ltd 固体撮像素子及びその製造方法
JP2008210528A (ja) * 2005-06-16 2008-09-11 Nissha Printing Co Ltd 照光スイッチ付き筺体とその製造方法
BRPI0720833A2 (pt) * 2007-01-04 2014-03-04 Nissha Priting Co., Ltd. Painel protetor tendo uma função de painel de toque

Also Published As

Publication number Publication date
US8263211B2 (en) 2012-09-11
KR101036044B1 (ko) 2011-05-19
EP2154596A1 (en) 2010-02-17
EP2154596A4 (en) 2017-04-19
US20100159183A1 (en) 2010-06-24
CN101681216A (zh) 2010-03-24
JPWO2008149789A1 (ja) 2010-08-26
KR20100027109A (ko) 2010-03-10
TWI368568B (en) 2012-07-21
WO2008149789A1 (ja) 2008-12-11
CN101681216B (zh) 2012-10-03
JP5066182B2 (ja) 2012-11-07
TW200911519A (en) 2009-03-16
EP2154596B1 (en) 2019-07-03

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2329 DE 25-08-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.