JP5054901B2 - 超高速均一プラズマ処理装置 - Google Patents

超高速均一プラズマ処理装置 Download PDF

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Publication number
JP5054901B2
JP5054901B2 JP2005204419A JP2005204419A JP5054901B2 JP 5054901 B2 JP5054901 B2 JP 5054901B2 JP 2005204419 A JP2005204419 A JP 2005204419A JP 2005204419 A JP2005204419 A JP 2005204419A JP 5054901 B2 JP5054901 B2 JP 5054901B2
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electrode
process region
separation member
plasma
tubular
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Japanese (ja)
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JP2006032344A5 (enExample
JP2006032344A (ja
Inventor
エス． コンドラショフ ロバート
ピー． ファジオ ジェームズ
デー． ゲティ ジェームズ
エス． タイラー ジェームズ
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Nordson Corp
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Nordson Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2005204419A 2004-07-13 2005-07-13 超高速均一プラズマ処理装置 Expired - Lifetime JP5054901B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/710,457 US7845309B2 (en) 2004-07-13 2004-07-13 Ultra high speed uniform plasma processing system
US10/710,457 2004-07-13

Publications (3)

Publication Number Publication Date
JP2006032344A JP2006032344A (ja) 2006-02-02
JP2006032344A5 JP2006032344A5 (enExample) 2010-08-12
JP5054901B2 true JP5054901B2 (ja) 2012-10-24

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JP2005204419A Expired - Lifetime JP5054901B2 (ja) 2004-07-13 2005-07-13 超高速均一プラズマ処理装置

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US (1) US7845309B2 (enExample)
EP (1) EP1617457B1 (enExample)
JP (1) JP5054901B2 (enExample)
CN (1) CN1728916B (enExample)
SG (2) SG119365A1 (enExample)
TW (1) TWI392402B (enExample)

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Publication number Publication date
EP1617457A2 (en) 2006-01-18
SG137851A1 (en) 2007-12-28
TWI392402B (zh) 2013-04-01
EP1617457B1 (en) 2011-12-28
CN1728916B (zh) 2011-06-01
EP1617457A3 (en) 2006-10-18
JP2006032344A (ja) 2006-02-02
US7845309B2 (en) 2010-12-07
TW200616498A (en) 2006-05-16
SG119365A1 (en) 2006-02-28
US20060011299A1 (en) 2006-01-19
CN1728916A (zh) 2006-02-01

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